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FEBRUARY 13-17 · 2005 TMS ANNUAL MEETING · SAN FRANCISCO, CALIFORNIA
AM05 Logo

Lead-free Technology Workshop

Sponsored by: The TMS Electronic, Magnetic & Photonic Materials Division (EMPMD)
Date: Sunday, February 13, 2005
Time:
8:00 am to 6:00 pm
Location: San Francisco Marriott Hotel, Golden Gate Hall B2

This free, one-day workshop will include a current state-of-the-art review of Pb-free solder technology. It will consider the key challenges facing Pb-free technology for future needs in electronic packaging and assembly. Note: Pre-registration for this workshop is not required.

Specific topics

  • Pb-free flip-chip packaging: is a high-Pb bump required to meet future technology demands? Pb-free solder under-bump metallization, electromigration in flip-chip solder joints, advanced interconnect technologies for stress management

  • Pb-free BGA interconnects: long term reliability of Sn-Ag-x solder joints, fatigue resistant Pb-free solder development, Pb-free board and component surface finishes

  • Nano–technology in electronic packaging: interconnects for optical/optoelectronic and MEMS packaging, etc.

Invited Presentations

  • "Package Technology Trends and Lead Free Challenges" Presenting by Dr. C. Mike Garner, Director of Materials Technology Operation, Intel Corp., Santa Clara, CA 95054

  • "Risks to health and environment related to use of Lead in products in the EU" Presenting by Dr. Arnold Tukker, TNO Strategy, Technology and Policy, the Netherlands

  • "Mechanical Properties of Pb-Free Solders Overview" Presenting by Professor John W. Morris, Materials Science and Engineering Department, University of California, Berkeley, CA

  • "Electromigration in Flip Chip Solder Joints" Presenting by Professor King N. Tu, Materials Science and Engineering Department, University of California, Los Angles, CA

  • "A Future for Lead-Free Flip-Chip Technology? Potentials and Pitfalls" Presenting by Dr. Roger A. Quon, IBM electronics, Hopewell Junction, NY

  • "Manufacturing and Reliability of SnAgCu - Issues of "Backward" and "Forward" Compatibility" Presenting by Dr. Carol Handwerker, NIST, Gaithersburg MD 20899

  • "Near-Ternary SnAgCu Solder Joints; Microstructure, Thermal Fatigue and Failure Mechanisms"Presenting by Dr. Sung K. Kang, IBM, T.J. Watson Research Center, Yorktown Heights, NY

  • "Sn-Zn based low temperature lead-free solder and current status of lead-free in Japan" Presenting by Professor Katsuaki Suganuma, Japan Osaka University, Institute of Scientific & Industrial Research, Mihogaoka 8-1, Ibaraki, Osaka 567-0047 Japan

  • "Reaction between Electroless Ni(P) and Sn3.5Ag and Its Effect on Mechanical Reliability" Presenting Dr. Jin Yu, Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Korea

  • "Nano Interconnects and Bonding with Nanotube Conductors" Presenting by Professor Sungho Jin, University of California, San Diego, CA

  • "Trends and Technical Requirements in Electronic Packaging" Presenting by Dr. Darrel Frear, Freescale Semiconductor, Tempe, AZ

The information on this page is maintained by the TMS Meetings Department (mtgserv@tms.org).