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2005 TMS Annual Meeting & Exhibition: Technical Program
Electronic Materials Overview
SYMPOSIUM: Lead Free Solder Implementation:
Reliability, Alloy Development,
Topics in this area could include: modifications to Sn-Ag-X alloys, alternatives to Sn-Ag-X alloys, materials and manufacturing challenges in solder alloy design, structure-property-processing relationships of bulk solders and solder joints, alloy development for optical/Optoelectronic and MEMS packaging, influence of surface and underbump metallization on solderability and integrity of solder joints, microstructure modeling and control, and testing methodologies of various kinds of electronic packages. Presentations will also focus on new technologies and techniques. These could include: soldering processes, metallization (board and component finishes), alternative interconnect technologies for stress management at both the wafer level, and chip to package level, and the issues involved in the design and integration of conductive adhesives in electronic packaging.
SYMPOSIUM: Refractory Metals in Electronic
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