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Lead-Free Technology Workshop

Date: Sunday, March 12

This one-day workshop includes an up-to-date review of Pb-free solder technology, organized into two sections:

• Section I
  covers Pb-free implementation issues and solutions. The invited speakers focus on experiences, learning and knowledge of second level interconnects, including BGA implementation, Pb-free surface finish (i.e., Sn whisker issues), SMT solder joints and long-term reliability assessment.
  
  
• Section II
  presents new Pb-free technologies including Pb-free flip chip technologies, and new and emerging Pb-free technologies for future packaging needs.