TMS 2007: Workshops

Register for one or more of these educational events using the TMS 2007 Annual Meeting registration form.

Furnace Systems Technology

Date(s): Monday, Tuesday and Wednesday, Feb. 26, 27 and 28

Gain practical knowledge from this comprehensive review of combustion technology and equipment used in aluminum cast houses to improve your existing systems. Learn from industry leaders as they showcase techniques to:

• Increase productivity
• Minimize energy consumption
• Lower overall plant emissions

Presenting Companies

Register for this workshop through the online TMS 2007 Annual Meeting & Exhibition registration form. Cost: $200 members; $250 nonmembers.

Session 1: Combustion Process
Learn About

• Basics of the combustion chemical process
• Results concerning available heat to the process
• Impact of preheated air on the process
• Resulting emissions from the process
• Available heat transfer mechanisms
• Types of burners and control systems to enhance the transfer of energy and maintain an efficient operation

Session 2: Melters and Holders
Learn About

• Furnace types commonly used in the cast house for melting and holding metal
• Style furnaces and combustion/control systems used for different processes
• Expected melt rates, fuel efficiency and emissions

Session 3: Process Furnaces
Learn About

• Lower temperature process furnaces and heat transfer mechanisms that affect productivity and efficiency of furnaces
• Burner types, control schemes, effective circulation requirements and purging requirements necessary for successful operation and the resulting expected fuel efficiency and emissions

Session 4: Additional Furnace Considerations
Learn About

• Additional requirements and ancillary devices used to improve furnace performance and productivity
• Refractory linings and common practices
• Benefits and costs of oxyfuel
• Metal circulation
• Mechanisms behind dross formation and limiting metal loss

State-of-the-Art Lead-Free SolderTechnology

Date and Time: Sunday, Feb. 25 • 8 a.m. to 6 p.m.  

With demand in electronics trending towards faster, smaller and cheaper products built with ROHS compliant lead-free solders, this one day Pb-free technology workshop will include up-to-date technology reviews and identify gaps for future needs for emerging Pb-free technology.

Session 1: Pb-Free BGA Interconnect Scaling Effects
Learn About

• Second level Pb-free interconnects and prediction of benefits, limitations, technology gap, and reliability risks as packages are getting smaller
• Newly designed Pb-free solders that could potentially meet emerging technology needs

Session 2: Scaling of Flip Chip Interconnects
High performance of electronics demands low K dielectrics used in the die to reduce cross talk. Integration of low K into the package is still a challenge. Smaller joints and higher current density also set flip chip joints under very complicated stress condition.

Learn About
Mechanical stress, electrical current and chemical interactions, and their effects on reliability prediction

Register for this workshop through the online TMS 2007 Annual Meeting & Exhibition registration form. Cost: $0 full conference registrants; $50 all others.