Sponsored by: SMD Non-Ferrous Metals Committee and Light Metals Division
Program Organizer: Professor James G. Morris, Chemical & Materials Engineering, Director, Light Metals Research Labs., University of Kentucky, Lexington, KY 40506
Wednesday, PM Room: A2-3
February 7, 1996 Location: Anaheim Convention Center
Session Chairperson: Subodh K. Das, ARCO Aluminum, Inc., 2900 First National Tower, P.O. Box 32860, Louisville, KY 40232
2:00 pm Invited
TRENDS IN ALUMINUM CAN STOCK NEEDS: Speaker to be announced.
An analysis of the aluminum industry's needs for future use of can stock materials and an indication of the trends that this technology will take in the coming years.
2:30 pm
DEVELOPMENT OF 5000 SERIES ALLOYS FOR RCS APPLICATIONS: J. K. McBride, 253 Highland Avenue, New Kensington, PA 15068; R. E. Sanders, Alcoa Technical Center, 100 Technical Drive, Alcoa Center, PA 15069; H. G. Reavis, Aluminum Company of America, Warrick Operations, Newburgh, IN 47629
The demands for formability and consistency placed on aluminum rigid container sheet (RCS) used in packaging applications are among the most stringent in the metal- working industry. The material characteristics necessary for making aluminum ends for beverage cans have changed dramatically as the industry has evolved over the past 30 years. This paper traces the evolution of alloys used in end and tab stock applications from the 1950s to the present. Early experiences with H19 RCS alloys which resulted in the development of alloy 5182 are reviewed with emphasis on work hardening and partial annealing behavior. Changes in the industry, particularly coil coating and new end designs, which drove metallurgical changes to the product are discussed.
2:50 pm
THE EFFECT OF ALUMINUM SURFACE PROPERTIES ON BLEEDTHROUGH: R. J. Rigge, Kaiser Aluminum and Chemical Corporation Center for Technology, 6177 Sunol Blvd., Pleasanton, CA 94566
The surface properties of aluminum can stock are important factors in controlling the defect of "bleedthrough" on commercial beverage cans. The nature of the organo- metallic monolayers generated and the surface topography imprinted during the final rolling steps are key properties that need to be controlled to minimize bleedthrough. It is believed some types of bleedthrough may be ascribed to deficiencies in these areas.
3:10 pm
STRIP CAST ALUMINIUM FOIL: P. Charlier, Granges Eurofoil, Dudelange, Luxembourg, H.E. Ekstrom, Granges Technology, Finspang, Sweden
Aluminium foil is an ideal product for strip casting. The advantages with the process- short production route and uniform materials properties- are utilized at the same time as the disadvantages- limitations in alloy composition and microstructural control- are avoided. The reasons for using aluminium foil in general and the threat from competing materials are discussed in the paper. The foil properties which are important for the manufacturing into different products are listed and examples are given of how the specific demands on each product can be met by the choice of process conditions and alloy composition.
3:30 pm BREAK
3:50 pm
METALLURGICAL AND MECHANICAL EFFECTS ON CAN BOTTOM WRINKLING: William M. Betts, Senior Research Metallurgist, KAISER Aluminum Corporation, 6177 Sunol Boulevard, Pleasanton, CA 94566
Bottom wrinkling has always been an issue for the D&I can but has become more troublesome with the advent of the 202 stackable bottom. This wrinkling occurs during redraw when the unsupported tapered area essentially buckles. Various D&I stock was tested to determine the effect of the following parameters on bottom wrinkling: Strength, work hardening exponent, gauge, and redraw radius. The investigation involved forming cans without doming the bottom, then measuring wrinkling by a stylus profiler. The results indicate that wrinkling can be reduced by both metal supplier and canmaker.
4:30 pm
PROCESSING AND PROPERTY CHARACTERIZATION OF ALUMINIUM PACKAGING MATERIALS: Mohit Sisodia, Department of Metallurgical Engineering, Malaviya Regional Engineering College, Jaipur- 17, India
With the advancement in 'high-
density
integrated packaging' and 'interconnection technology' electronic industries
have made a rapid improvement in multidimensional arena. The electronic
packaging and interconnections refer to the physical link between computers and
other electronic systems/integrated circuits. It leads to a drastic progress,
in increasing the computing capabilities and speed of high-
performance
workstations, minicomputer, mainframe computers as well as to miniaturization
of consumer products as explained. Electronic-
packaging
sorely depends on compatibility between conductor/dielectrics (as a substrate)
and circuitization and integration processes. Aluminium and its alloys are
being used as a conductor lines of .001 inch in a multilayer structure by
patterning technique due to high performance in achieving necessary physio-
mechanical
properties. Fabrication of these patterning lines is carried out by the latest
technique of plasma etching which is discussed with the practical problems of
its process variables. It has numerous applications like computer chip
manufacturing of sensors, high-
end
computing etc. It is observed by analyzing the associated data's that this Al-
alloys
gives a viable approach to the optimization of desired properties for
'compatibility' with dielectric substrate for eg. electrochemical migration, a
low defect density/impurity content, low electrical resistance and high thermal
conductivity. Paper also deals with optoelectronics packaging which have a
significant impact on telecommunication (fibre-
optic
lines), optical reading devices (scanners) and supercomputers.
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