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2004 Electronic Materials Conference: Proceeding Volumes

June 23-25, 2004 · 46TH ELECTRONIC MATERIALS CONFERENCE · Notre Dame University, Notre Dame, Indiana

 
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PUBLICATION INFORMATION

There are no formal conference proceedings, but the conference abstracts will be published in the Journal of Electronic Materials (JEM).

JEM, a monthly archival publication of TMS and the Institute of Electrical and Electronics Engineers (IEEE), was created to serve as the publication of the Electronic Materials Conference. Throughout the year, JEM publishes selected papers presented at the Electronic Materials Conference and welcomes the submission of related electronic materials articles by EMC presenters and attendees.

Articles that appear in JEM are reviewed, selected, and edited by peers in the field who serve as volunteer members of the editorial board, the board of associate editors, or section editors. JEM employs an online manuscript submission and review system. To be considered for publication in JEM, authors must submit their manuscripts electronically through the following web site: http://jem.electronicipc.com. Detailed manuscript submission guidelines are available from the JEM website.

Beginning this year, EMC participants also have the opportunity to publish through a new journal, TMS Letters. Timely, relevant, and rigorously reviewed, TMS Letters is a unique technical journal that presents cutting-edge research in succinct, informative technical updates. The peer-reviewed journal will be available exclusively in on-line format through the TMS Document Center and will be accessible free-of-charge to all TMS members as a benefit of membership (nonmembers may subscribe for a fee). The editor of TMS Letters is Dan Thoma, 2003 president of TMS and technical staff member of Los Alamos National Laboratory.

TMS Letters will be composed entirely of twopage technical updates, including text and graphics, of research presented at TMS meetings that are not published in any other book or journal. Presentations that are to be considered for publication must be submitted via the TMS Conference Management System (CMS) in portable document format. Complete author instructions are available through the TMS Letters. Manuscripts can be submitted through CMS at http://cms.tms.org.

JEM SUBSCRIPTION INFORMATION

The Journal of Electronic Materials acts as a forum for the rapid circulation of the results of original research, enabling those in the electronic materials field to keep abreast of activities peripheral to their own. The journal focuses on electronic memory and logic structures, magnetic-optical recording media, superlattices, packaging, detectors, emitters, metallization technology, superconductors, and low thermal-budget processing and includes general papers on electronic materials for device application, structure making, reliability, and yield. Articles on methods for preparing and evaluating the chemical, physical, and electronic properties of electronic materials are also included.

JEM subscriptions are available in both print and electronic formats. In addition to receiving on-line access to the current issues of the journal, electronic subscribers have unlimited access to past journal issues with their subscription.

TMS and IEEE members receive significant discounts on JEM subscriptions. See the registration form in this program to subscribe to JEM.

Individual issues of the journal may also be purchased through the TMS Document Center for $25 a copy (for members) or $40 a copy (for nonmembers), plus shipping, at http://doc.tms.org or through TMS Subscriptions Representative Mark Cirelli at the following address:

Mark Cirelli
TMS Subscriptions
184 Thorn Hill Road
Warrendale, PA 15086
Telephone: 724-776-9000, ext. 251
Fax: 724-776-3770
E-mail: subscriptions@tms.org

RELATED TMS PUBLICATIONS

TMS BOOKS

Proceedings are available from additional TMS conferences related to electronic materials, including those listed below. For more details on these titles, including on-line tables of contents and ordering information, visit the TMS Document Center at: http://doc.tms.org.

ADVANCED MATERIALS FOR ENERGY CONVERSION II
Dhanesh Chandra, Renato G. Bautista, and
Louis Schlapbach, editors
Approx. 560 pp., illus., index, softcover
Order No. 04-5743 * Weight 3 lbs
M $112 S $89 L $160

CALPHAD and Alloy Thermodynamics
Patrice E.A. Turchi, Antonios Gonis, and
Robert D. Shull, editors
292 pp., illus., index, hardcover
Order No. 01-514X * Weight 2 lbs
M $72 S $51 L $102

SCIENCE & TECHNOLOGY OF INTERFACES, International Symposium Honoring the Contributions of Dr. Bhakta Rath
S. Ankem, C.S. Pande, I. Ovid’ko, and
R. Ranganathan, editors
Entire Book: Softcover
Order No. 01-5204 * Weight 4 lbs
M $122 S $87 L $174
Entire Book: CD-ROM
Order No. 01-5204-CD * Weight 1 lb
M $122 S $87 L $174
Entire Book: Portable Document Format
Order No. 01-5204-E
M $122 S $87 L $174
Individual Papers: Portable Document Format
M $11 S $11 L $15

SURFACE ENGINEERING: SCIENCE AND TECHNOLOGY II
Ashok Kumar, Yip-Wah Chung, and
John J. Moore, editors
Approx. 414 pp., illus., index, softcover,
CD-ROM, or portable document format
Entire Book: Softcover
Order No. 01-5212 * Weight 4 lbs
M $111 S $79 L $158
Entire Book: CD-ROM
Order No. 01-5212-CD * Weight 1 lb
M $111 S $79 L $158
Entire Book: Portable Document Format
Order No. 01-5212-E
M $111 S $79 L $158
Individual Papers: Portable Document Format
M $11 S $11 L $15

SURFACES AND INTERFACES IN NANOSTRUCTURED MATERIALS AND TRENDS IN LIGA, MINIATURIZATION, AND NANOSCALE MATERIALS, 5th MPMD Global Innovations Symposium
Sharmila M. Mukhopadhyay, John Smugeresky,
Sudipta Seal, Narendra B. Dahotre, and
Arvind Agarwal, editors
Approx. 720 pp., illus., softcover
Order No. 04-5662 * Weight 4 lbs
M $118 S $93 L $168

SPECIAL ISSUES OF THE JOURNAL OF ELECTRONIC MATERIALS

Each year, the Journal of Electronic Materials (JEM) publishes several special issues that comprise conference and symposium proceedings and related papers. Limited numbers of these archival-quality issues are available for individual purchase. Issues from prior volume years are also available.

PLANNED SPECIAL ISSUES AND SPECIAL ISSUES FROM 2004

III-Nitrides and Related Materials (May)
Order No. JEM-0405
2003 U.S. Workshop on the Physics and
Chemistry of II-VI Materials (July)
Order No. JEM-0407
Advanced Thin Films (September)
Order No. JEM-0409
Phase Stability, Phase Transformations,
and Reactive Phase Formation in
Electronic Materials III (October)
Order No. JEM-0410

SPECIAL ISSUES FROM 2003

III-V Nitrides and Silicon Carbide (May)
Order No. JEM-0305
2002 U.S. Workshop on the Physics and
Chemistry of II-VI Materials (July)
Order No. JEM-0307
3rd International Conference on Alternative
Substrate Technology (August)
Order No. JEM-0308
Materials and Processes for Submicron
Technologies III (October)
Order No. JEM-0310
Phase Stability, Phase Transformations, and
Reactive Chemistry of II-VI Materials (November)
Order No. JEM-0311
Lead-Free Solders and Processing Issues
Relevant to Microelectronics (December)
Order No. JEM-0312

SINGLE ISSUE PRICES
TMS or IEEE Member $25
List $40
Institution $40


TO ORDER

Tel: 1-800-759-4867 (U.S. Only) or
(724) 776-9000, ext. 270
Fax: (724) 776-3770
E-mail: publications@tms.org
Web: http://doc.tms.org


 

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