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2004 Electronic Materials Conference: Technical Program

June 23-25, 2004 · 46TH ELECTRONIC MATERIALS CONFERENCE · Notre Dame University, Notre Dame, Indiana

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HELPFUL LINKS

PDF: PRELIMINARY PROGRAM WITH ABSTRACTS

PDF: PRELIMINARY PROGRAM WITHOUT ABSTRACTS

PDF: PRELIMINARY TECHNICAL PROGRAM SCHEDULE

TECHNICAL SESSIONS

The Electronic Materials Conference technical program will commence at 8:30 am on Wednesday, June 23. All sessions will be held on grounds at the University of Notre Dame in DeBartolo Hall.

TECHNICAL PROGRAM

The Advance Mailer and Preliminary Technical Program, which includes a complete listing of all planned symposia (without abstracts), is available for download in portable document format and can be viewed using Adobe Acrobat. A version of the program with abstracts can be viewed as well.

A complete program with abstracts of papers to be presented at the meeting will be made available for all registrants at the registration desk.

For technical program information regarding the 2004 TMS Electronic Materials Conference, please contact:

April Brown
Duke University
130 Hudson Hall
Durham, NC 27708
Tel: (919) 660-5442
Fax: (919) 660 5293
E-mail: brown@ee.duke.edu
Edward Yu, EMC Program Chair
University of California, San Diego
ECE Dept MC 0407
9500 Gilman Dr
La Jolla, CA 92093
Tel: (858) 534-6619
Fax: (858) 822-3425
E-mail: ety@ece.ucsd.edu

LATE NEWS PAPERS

Late News Papers will be considered. Authors must submit 5 copies of their abstract by June 2, 2004, to the Program Chair. Authors of accepted papers will be notified before the conference.

PUBLICATION OF PAPERS

Conference abstracts will be published in the Journal of Electronic Materials. We also strongly encourage you to submit manuscripts on your work to the Journal of Electronic Materials.

Details on manuscript submission are available on the web through the Journal of Electronic Materials site.

Beginning this year, EMC participants also have the opportunity to publish through a new journal, TMS Letters. Complete author instructions are available through the TMS Letters home page. Manuscripts can be submitted through the TMS Conference Management System (CMS).

 



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