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2007 Electronic Materials Conference

2007 ELECTRONIC MATERIALS CONFERENCE • June 20-22, 2007• University of Notre Dame • Indiana, USA

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IMPORTANT INFO

PROGRAM-AT-A-GLANCE
(PDF DOWNLOAD - 8.1 MB)

FINAL PROGRAM
(WED-THUR)

(PDF DOWNLOAD - 1 MB)

FINAL PROGRAM
(FRIDAY-INDEX)

(PDF DOWNLOAD - 5.2 MB)

EXHIBIT FLOOR PLAN
(PDF DOWNLOAD - 82 Kb)

June 20 – Welcoming Reception

 

Publications & Proceedings

EMC does not publish formal conference proceedings; however, conference abstracts are published in the Journal of Electronic Materials (JEM) throughout the year. JEM encourages both presenters and attendees to submit manuscripts of their work.

JEM SUBSCRIPTIONS

2008 JEM issues will include manuscripts of papers presented at the 2007 EMC with a special issue on group III nitrides, SiC and ZnO. TMS and IEEE members receive a discount. Subscribe to JEM.

Not a member? Join TMS today!

MANUSCRIPT SUBMISSION

JEM employs an online manuscript submission and review system. To be considered for publication, authors must submit manuscripts electronically. Detailed submission guidelines are available from the publisher’s Web site at http://jems.edmgr.com.

If submitting a manuscript for the special issue on group III nitrides, SiC and ZnO, please check the appropriate category during manuscript submission.

Find electronic materials related publications in the TMS Document Center.

FOR MORE INFORMATION . . .

For more information regarding meeting proceedings, please contact:

TMS Meeting Services
184 Thorn Hill Road
Warrendale, PA 15086
Toll Free (800) 759-4867 (U.S./Canada only) or
Telephone (724) 776-9000, ext. 256
Fax (724) 776-3770
E-mail publications@tms.org


The information on this page is maintained by the TMS Meetings Department (mtgserv@tms.org)