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13th International Conference on Defects
Recognition, Imaging and Physics in Semiconductors (DRIP XIII)

DRIP XIII • SEPTEMBER 13-17, 2009 • WHEELING, WEST VIRGINIA, USA

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IMPORTANT INFO

TECHNICAL PROGRAM
View the technical program online.

FINAL TECHNICAL PROGRAM
Download a PDF of the program.

MEETING REGISTRATION

HOUSING RESERVATIONS
Make a reservation now to ensure best selection and availability


Welcome to the DRIP XIII Conference

TMS is proud to sponsor the 13th International Conference on Defects — Recognition, Imaging, and Physics in Semiconductors.

As the semiconductor technology has matured, so have the techniques for detection, identification and imaging of defects. Decreasing feature size, increasing wafer size and purity level, reduction of layer thickness and introduction of new materials have presented new challenges at every stage of semiconductor technology development. This evolution of the field continues today, and the new challenges will be the focus of DRIP XIII.

CONFERENCE HISTORY

 

For more than 20 years, DRIP conferences have focused on all aspects of defects in semiconductors including point, line, planar and volume defects studied by a variety of techniques. This comprehensive approach has allowed for a discussion of the multifaceted effects of growth, processing and device fabrication and their interrelationships.

DRIP XIII will be held September 13-17, 2009, at the in Wheeling, West Virginia, and follow in the footsteps of recent conferences held in Beijing and Berlin. View information from previous conferences:

  • : Berlin, Germany held in September 2007
  • : Beijing, China held in September 2005
CONFERENCE SPONSORS


FEI

Quantum

FOR MORE INFORMATION . . .


For more information about this conference, please submit a form or contact:

TMS Meeting Services
184 Thorn Hill Road
Warrendale , PA 15086-7514 USA
Telephone (724) 776-9000, ext. 243
(800) 759-4TMS
Fax: (724) 776-3770
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