Bringing the Experts to You… TMS presents a live, interactive webcast, “Performance Considerations in Lead-Free Solder Implementation,” on Wednesday, November 15, 2006, from 11:30 a.m. to 1:30 p.m. Eastern time.

Learn about . . . issues impacting the effective implementation of lead-free solders, from both the industrial and academic perspectives. Plus, get answers to your specific questions during the webcast.

Register online before November 13 for only $179 ($129 academic rate). After November 13, contact TMS Customer Service at (724) 776-9000, ext. 243.

• “The Lead-Free Transition: An Industrial Perspective on Status and Challenges”
  Presenter: Dr. Ravi Mahajan, Intel
• “Fundamental Research on Environmentally-Benign Pb-Free Solders”
  Presenter: Professor Nikhilesh Chawla, Arizona State University
• “Design for Reliability Considerations with Pb-Free Electronics”
  Presenter: Dr. Craig Hillman, DfR Solutions

SPEAKERS

Ravi Mahajan

Nikhilesh Chawla

Craig Hillman

Ravi Mahajan, Ph.D. , is a senior principal engineer in the Pathfinding Group within Intel's assembly technology development in Chandler, Arizona. He is responsible for setting technology directions to enable packaging and assembly process for silicon at future nodes. Dr. Mahajan is also responsible for technical direction for Intel and consortia-funded research in assembly and packaging. He has authored several technical papers in the areas of experimental and analytical stress analysis and thermal management, and holds several patents in microelectronic packaging. He currently serves as an associate editor of the IEEE Transactions on Advanced Packaging.

Nikhilesh Chawla, Ph.D. , is professor of materials engineering at Arizona State University and director of the university’s interdisciplinary Mechanical Behavior of Materials Facility. His research interests encompass the mechanical behavior and modeling of advanced materials at bulk and small length scales, including Pb-free solders, metal matrix composites, biocompatible coatings, metal-ceramic nanolaminates, and powder metallurgy alloys. He has authored or co-authored over 100 publications in these areas and is the co-author of the textbook Metal Matrix Composites. Professor Chawla is chair of the TMS Composite Materials Committee and a member of both the TMS Electronic Packaging and Interconnect Materials Committee and the TMS Mechanical Behavior Committee.

Craig Hillman, Ph.D. , is the CEO and managing partner of DfR Solutions, which specializes in quality and reliability solutions for the electronics community. Dr. Hillman and his staff are at the forefront of reliability assurance and failure investigations of Pb-free electronics, including component robustness, tin whisker risk assessments, and development of reliability models for multiple Pb-free solder alloys. They have also developed extensive expertise in strategic corporate-level reliability planning, best practices in design for reliability (DfR) and manufacturability (DfM), thermal/mechanical/electrical simulation, reliability predictions and test-to-field correlation, component derating/uprating, qualification of circuit boards and assemblies, and a wide variety of failure mechanisms (electronic packaging, component, printed board, interconnections and connectors). Dr. Hillman and his team have assisted almost all the Fortune 200 companies that design, manufacture and use electronics. He has published over 40 papers in the area of electronics quality and reliability.

This webcast is presented by JOM. We thank our sponsors:

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