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- ACADEMIC SCHOLARSHIPS
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Student Academic Scholarships
In addition to the other competitions sponsored by TMS, student members have the opportunity to apply for a number of scholarships funded by the TMS Foundation. Except for the International Symposium on Superalloys Scholarship and the Henry DeWitt Smith Scholarship, all TMS academic scholarships are available only to sophomore and junior undergraduate applicants. Additional competition opportunities can be found on the
View Material Advantage web site.
Henry DeWitt Smith Scholarship
Funding By: AIME (American Institute of Mining, Metallurgical, and Petroleum Engineers)
Two $2,000 scholarships are available to graduate students majoring in the field of mineral, metals, and/or materials engineering. An additional $375 for travel expenses is available to the recipient in order to personally accept the award at the TMS Annual Meeting and Exhibition. Recipients will also receive a brochure about Mr. Smith and his relationship to the mining industry. The principal aim and purpose of this scholarship fund is to further the mineral industries by affording educational opportunities in the arts and sciences pertaining to those industries, particularly by assisting worthy students in the mining, metallurgical and petroleum departments of leading colleges and universities which confer degrees in mineral engineering. The scholarship recipient is known as the Henry DeWitt Smith Scholar. This scholarship is open to graduate students.
Kaufman CALPHAD Scholarship Click to see scholarship donors.
Supported By: CALPHAD Inc and TMS Foundation
One $1,000 scholarship is made to an undergraduate student majoring in metallurgical engineering, materials science and engineering, or minerals processing/extraction programs. In addition, a travel stipend of $500 is available for the recipient to attend the TMS Annual Meeting, to formally receive the scholarship. The scholarship is established to recognize the memory of Dr. Larry Kaufman for his contributions to computational thermodynamics and its applications.
Functional Materials Division Gilbert Chin Scholarship
Supported By: TMS Functional Materials Division
One $2,000 scholarship is available to an undergraduate student in their sophomore and junior years, who is studying subjects in relation to
synthesis and processing, structure, properties, and performance of electronic, photonic, magnetic, and superconducting materials as well as materials
used in packaging, and interconnecting such materials in device structures. An additional $500 for travel expenses is available to the recipient in
order to personally accept the award at the TMS Annual Meeting and Exhibition. The scholarship recipient is known as the FMD Gilbert Chin Scholar.
Extraction & Processing Division Scholarship
Supported By: TMS Extraction & Processing Division
Four $2,000 scholarships are available to full-time undergraduate applicants in their sophomore or junior years, who are majoring in the extraction and processing of minerals, metals and materials. Each scholarship recipient is also given up to five Extraction & Processing Division-sponsored conference proceedings or textbooks to be donated in the recipient’s name to his/her college or university library. Awards are presented during the Extraction & Processing Division luncheon at the TMS Annual Meeting and Exhibition. Up to $500 for travel expenses is available to each recipient in order to accept the award at the luncheon. Scholarship recipients are known as EPD Scholars.
International Symposium on Superalloys Scholarship
Funding By: Organizing Committee of the International Symposium on Superalloys
Two $2,000 scholarships with up to $250 for each winner in travel reimbursements, are available to undergraduate and graduate students majoring in metallurgical and/or materials science and engineering with an emphasis on all aspects of the high-temperature, high-performance materials used in the gas turbine industry and all other applications. Awards are presented in conjunction with the Materials Science and Technology Conference. This scholarship is open to undergraduate and graduate students.
Light Metals Division Scholarship
Supported By: TMS Light Metals Division
Three $4,000 scholarships are available to full-time undergraduate applicants in their sophomore or junior years, who are majoring in metallurgical and/or materials science and engineering with an emphasis on both traditional (aluminum, magnesium, beryllium, titanium, lithium and other reactive metals) and emerging (composites, laminates, etc.) light metals. Additionally, recipients are awarded Light Metals Division-sponsored conference proceedings or textbooks to be donated in the recipient’s name to his/her college or university library. Each recipient is given up to $400 worth of books for his/her personal use. As the awards are presented during the Light Metals Division luncheon at the TMS Annual Meeting and Exhibition, up to $600 for travel expenses is available to each recipient. The LMD student scholarship winners must present at the LMD luncheon or submit a video for presentation if not able to attend in-person. Scholarship recipients are known as LMD Scholars.
Materials Processing & Manufacturing Division Scholarship
Supported By: TMS Materials Processing & Manufacturing Division
Two $2,500 scholarships are awarded to undergraduate students in their sophomore or junior years, who are majoring in metallurgical and/or materials science and engineering with an emphasis on manufacturing from product design to production, integrating process control technology into manufacturing, and basic and applied research into key materials technologies that impact manufacturing processes. Additionally, each recipient receives up to $500 for travel expenses to attend the meeting and luncheon to accept the award. Recipients are known as MPMD Scholars.
Structural Materials Division Scholarship
Supported By: TMS Structural Materials Division
Two $2,500 scholarships are available to full-time undergraduate applicants in their sophomore or junior years, who are majoring in metallurgical and/or materials science and engineering with an emphasis on the science and engineering of load-bearing materials, including studies into the nature of a material’s physical properties based upon its microstructure and operating environment. Awards are presented at the TMS Annual Meeting and Exhibition, and up to $500 is available for each recipient’s travel expenses. Scholarship recipients are known as SMD Scholars.
Eligibility and Judging Requirements
- The applicant must be a student member of Material Advantage.
- Applicants must be undergraduate sophomores or junior unless
- Applicants must be enrolled full time in a metallurgical/materials science engineering program at a qualified college or university.
- Relatives of members of the funding committee/division are not eligible.
- Submitted coursework must be relevant to the scholarship for which the student is applying.
Scholarship recipients are chosen by specially appointed selection committees. The following judging criteria are employed:
- Relevance of Coursework/Experience to division's focus
- Scholarship Application
- Academic Achievement
- Activities in and out of School, Including Work Experience
- Personal Profile Statement
- Letters of Recommendation
How to Enter
Submission Deadline: The submission deadline is March 15th of each year.
- Applicants must submit their typed information on the Scholarship Application Form. Applications are accepted via e-mail: email@example.com, or postal mail.
- Applications for TMS scholarships are to be made by the students themselves.
- Photocopies of the official Scholarship Forms may be reproduced locally.
- In addition to information requested on the Scholarship Form, applicants must attach an individual statement of 200
words or less, typed, double-spaced, describing career plans,
reports on special projects, leadership roles, work experience,
and community involvement. This is an opportunity for the applicant
to convey specific career plans relating to a particular area
- Evidence of academic achievement (including rank in class) is
an important factor; therefore, a transcript or facsimile of recent
academic record and current GPA is required.
should include three official Recommendation
Forms from educators or employers.
may apply for up to two scholarship programs. This
must be indicated at the bottom of the Scholarship Application
Please Note: All application materials MUST be submitted together in one packet. Individually submitted scholarship application materials will not be accepted.
For More Information...
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