This book has been developed as a resource to be used in developing a solder joint reliability assessment. Topics include: the mechanics of solder alloy interconnect; microstructural influences on the mechanical properties of solder; interfaces and intermetallics; constitutivemodels; prediction of solder joint geometry; life prediction and accelerated testing; thermomechanical modeling of solder joints - numerical considerations; applications - through-hole; surface mount solder joints under thermal, mechanical, and vibration conditions. The purchase price is US$279 from Springer.

LAST UPDATE: 2/12/2007

SOURCE: Frear, D.R., Burchett, S.N., Morgan, H.S., Lau, J.H. . Mechanics of Solder Alloy Interconnects. New York, NY: Springer, 1994.

LINK: Mechanics of Solder Alloy Interconnects