Webinar “Progress in Lead-Free Solders”
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TMS ONLINE | MEMBERS ONLY | SITE MAP Webinar “Progress in Lead-Free Solders” |
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| WEBINAR SCOPE |
Learn about . . . progress in the implementation of lead-free solders from both the industrial and academic perspectives. Industrial use of lead-free solders, work on combating tin whiskers, and the role of solder in three-dimensional packaging are among the topics that will be covered in this webinar.
| WEBINAR RECORDINGS |
The presentations were privately recorded on October 23, 2007, and then made available for playback by registrants immediately afterward. The presentations are recorded rather than broadcast live for two reasons:
1. To avoid the possibility of users encountering technical glitches with their connections that may impair their ability to experience the presentations
2. To recognize that all potential participants worldwide cannot all be available for a fixed-time live event
To keep the interactivity element of the event intact, webinar presenters will monitor this discussion for two months after the event and respond to postings/discussions that may appear here as appropriate.
| PLANNED TOPICS |
"Fundamentals of Tin Whisker Formation"
Presenter: Carol Handwerker, Purdue University
Click here for a free preview of this presentation.
"Industry Issues on Lead-Free Soldering"
Presenter: David Hillman, Rockwell Collins
Click here for a free preview of this presentation.
For more information or to purchase this webinar, visit the TMS Document Center.
| WEBINAR SPONSORS |
This webinar is presented by JOM.
The research presented in this program is sponsored in part by Surface Mount Technology Association.
| FOR MORE INFORMATION . . . |
For additional information about this webinar or any other TMS conference, please complete the TMS Meetings Mailing List Form or contact:
TMS Meeting Services
184 Thorn Hill Road
Warrendale, PA 15086 USA
Tel: (724) 776-9000 x243
Fax: (724) 776-3770
E-mail: mtgserv@tms.org
Progress in Lead-Free Solders