TABLE OF CONTENTS

NOVEMBER'S TOP TEN . . .
. . . Reasons to Attend the 2005 TMS Annual Meeting

PRELIMINARY TECHNICAL PROGRAM APPEARS IN NOVEMBER JOM
Updates to the 2005 TMS Annual Meeting Program Available through the TMS Personal Conference Scheduler

TMS ANNUAL MEETING PROCEEDINGS ARE HEADING FOR BOOK AND JOURNAL PUBLICATION
Books Now Available for Presale through the TMS Document Center

TMS FOUNDATION RAFFLES GOLF CLUBS
Contribute to the Future of the Materials Profession and Win a Set of Callaway Golf Clubs

HOW TO . . .
. . . Submit a Paper to a TMS Symposium

PARTICIPATE IN THE FUTURE LEADERSHIP OF THE SOCIETY
Members are Invited to Submit 2006-2009 Board of Directors Nominations

STUDENT CHAPTER DEVELOPMENT CONFERENCE OPENS COMMUNICATION BETWEEN STUDENTS
Networking, Brainstorming, and Orientation Session Held at MS&T '04

NEW BOOK: PROCEEDINGS OF S2P ON CD-ROM
September Conference Proceedings Available through TMS

TMS JOURNALS DEBUT ON INGENTACONNECT WEB SITE
New Site Provides Benefits to Institutional Journal Subscribers

WHAT PEOPLE ARE READING ON TMS ONLINE
A Look at TMS's Most Popular On-Line Destinations

. . . Reasons to Attend the 2005 TMS Annual Meeting

Need a good reason to attend the 2005 TMS Annual Meeting in February? Here are ten.

10. Large Selection of Short Courses, including a hands-on aluminum smelter simulation course

9. High-Profile Plenary Speakers at the Computational Thermodynamics and Phase Transformations Symposium and the 6th MPMD Global Innovations Symposium

8. Luncheon Lectures: Carnegie Museum of Art curator and senior director of Noranda Inc./Falconbridge Limited speak at division luncheons

7. Feature Presentations: Popular papers re-presented in a special encore session, Wednesday, February 16

6. Hot-Topic Sessions: Covering the hot topics of industrial energy reduction and globalization of materials R&D

5. Biological Materials Science and Engineering Symposium: Featuring high-profile plenary speakers

4. 2005 TMS Exhibition, which has already surpassed the 2004 exhibition by attracting 130 companies from 20 countries

3. Installation of the First Female TMS President: In 2005, TMS will inaugurate its first female president: Tresa Pollock

2. Global Aluminum Plenary Session: An unprecedented gathering of high-ranking executives from the world's top five aluminum companies

1. JOM's Rubbish Deconstruction League Competition: Watch otherwise well-mannered professional and student members play with junk and talk trash in the TMS Annual Meeting Exhibit Hall

Find more information on these meeting highlights, as well as registration and housing information, at the 2005 TMS Annual Meeting web site.

Updates to the 2005 TMS Annual Meeting Program Available through the TMS Personal Conference Scheduler

Subscribers may have noticed that the November issue of JOM was unusually hearty due to the inclusion of the 2005 TMS Annual Meeting preliminary technical program, which featured a record number of planned presentations. Readers can use this preliminary program to select sessions of interest and then make a trip to the on-line Personal Conference Scheduler (PCS) to check for any updates that are made to the preliminary program.

The Personal Conference Scheduler allows meeting attendees to plan itineraries before arriving at the meeting venue. The scheduler will alert users to potential schedule conflicts and to any presentations that have been cancelled or re-scheduled. TMS members can log in to the PCS by typing in their TMS member number as the user name and their date of birth in the form of mm/dd/yyyy as the password. Nonmembers will need to register in order to use the site. Once logged in, users can create a personalized and printed conference schedule with the most current information available.

Books Now Available for Presale through the TMS Document Center

The proceedings of the 2005 TMS Annual Meeting will be presented as a mix of traditional hardcover and softcover books, books on CD-ROM, and special sections or issues of TMS journals.

Among the books planned for the meeting are the newest editions in the annual EPD Congress, Light Metals, Magnesium Technology, and MPMD Global Innovations series, as well as five additional concurrent conference publications and one post-conference proceedings. A list of 2005 TMS Annual Meeting proceeding volumes, now available for pre-sale, can be found in the Upcoming Books section of the TMS Document Center.

In addition, TMS Letters, which published its inaugural issue following the 2004 TMS Annual Meeting, has released plans to publish proceedings from thirteen symposia presented at the 2005 TMS Annual Meeting. Papers from selected symposia will also be published in special issues of the Journal of Electronic Materials and in issues of Metallurgical and Materials Transactions.

For a complete guide to the publication plans for individual symposia, see the Technical Program Overview on the 2005 TMS Annual Meeting web site.

Contribute to the Future of the Materials Profession and Win a Set of Callaway Golf Clubs

For a $20 donation, the TMS Foundation is offering donors a one in 500 chance of winning a set of Callaway golf clubs during the 2005 TMS Annual Meeting. Only the first 500 paid entries will be accepted for the raffle, and the winner will receive a set of Callaway Big Bertha titanium woods, Callaway X-16 Pro-Series irons, and a Callaway Big Bertha cart bag. The winner will be drawn on February 16, during the 2005 TMS Annual Meeting. While the winner does not need to be present to claim the prize, the owner of the winning ticket will receive a $500 cash bonus if he or she is a registered attendee of the meeting.

The TMS Foundation supports a variety of initiatives to encourage education in the materials science and engineering field, including scholarships and awards to aid outstanding science and engineering students and the TMS Young Leader program to encourage leadership in young professionals. Donations will go toward funding programs to prepare future generations of professionals for leadership roles in the international minerals, metals, and materials community.

. . . Submit a Paper to a TMS Symposium

To submit a paper to be presented at a TMS symposium, begin by visiting the on-line TMS conference management system, recently upgraded and renamed CMS-Plus. Once on the site, it will be necessary to log in. TMS members can log in by typing their TMS member number as their user name and their birthdate in the form of mm/dd/yyyy in the password box at the top of the screen. Nonmembers should select the "Register as a New User" option from the menu on the left of the screen to create a user name and password.

Once logged in, click on the "Submit an Abstract" option from the menu. Choose the meeting and then the specific symposium for which you would like to submit an abstract. Then scroll through the abstract submission form and follow the instructions provided. When finished you will be given the option to preview your abstract, submit it for consideration in the symposium, save it to submit at a later time, or cancel the abstract submission.

On future visits to the site, users who log in to the system can click on the "Presenter/Author Tools" option on the left side of the screen to view any abstracts or manuscripts they have submitted through CMS-Plus.

The following TMS conferences are currently accepting abstract submissions through CMS-Plus:

Solid-Solid Phase Transformation in Inorganic Materials
Abstracts Due by December 1, 2004

2005 Electronic Materials Conference
Abstracts Due by February 3, 2005

Superalloys 718, 625, 706, and Derivatives
Abstracts Due by February 15, 2005

International Conference on Silicon Carbide & Related Materials
Abstracts Due by March 15, 2005

MS&T '05
Abstracts Due by March 15, 2005

Members are Invited to Submit 2006-2009 Board of Directors Nominations

As a member-driven society, TMS encourages its members to be actively involved in every decision the society makes, particularly in the selection of its leaders. That's why the TMS Nominating Committee is asking members to nominate qualified candidates to fill four position openings on the Board of Directors for the 2006-2009 term. This is an opportunity for members to make their voices heard at the highest level of the society.

From nominations submitted by TMS members, the Nominating Committee will select candidates to fill the four open Board of Directors positions: vice president, financial planning officer, membership development director, and programming director. The nominees will be selected during the 2005 TMS Annual Meeting in February and presented to the TMS membership for approval in the July issue of JOM.

A nomination packet, containing a nominee statement form filled out by the candidate, letters of endorsement for the nominee, and the nominee's biography, must be submitted to TMS for a candidate to be considered for the position by the TMS Nominating Committee. To obtain a nominee statement form and for more details on the process, contact Gail Miller at gailm@tms.org or by phone at (724) 776-9000, ext. 238.

Networking, Brainstorming, and Orientation Session Held at MS&T '04

During September's MS&T '04 meeting, student members had the opportunity to share ideas with other student chapters and to familiarize themselves with the new Material Advantage Student program, which includes the participation of TMS, ASM International, and the American Ceramic Society, at the Student Chapter Development Conference.

Representatives from participating Material Advantage chapters gave presentations about events that their chapters sponsored throughout the year in order to share ideas for chapter activities with one another. The students also participated in roundtable discussions focusing on such topics as networking, internships, and involvement with professional chapters. All attendees were given handbooks on the new joint student program and led through a presentation of the program's on-line benefits through the Material Advantage web site.

"The conference was an excellent way to answer questions about the Material Advantage program and the three parent societies, ACerS, ASM International, and TMS," wrote Clarissa Yablinsky, former chapter chair of the Carnegie Mellon University student chapter and leader of the conference's roundtable discussion on internships. "The students left with new contacts and many new and improved ideas."

September Conference Proceedings Available through TMS

TMS announces the availability of its newest publication, the proceedings of the Eighth International Conference on Semi-Solid Processing (S2P) of Alloys and Composites, held September 21-23, 2004, in Limassol, Cyprus.

S2P: SEMI-SOLID PROCESSING OF ALLOYS AND COMPOSITES CD-ROM
D. Apelian, A. Alexandrou, G. Georgiou, J. Jorstad, and M. Makhlouf, editors
This CD-ROM presents proceedings from the conference organized by the Worcester Polytechnic Institute and the Metals Processing Institute. The S2P International Conferences are dedicated to the science and processing technology of semi-solid processing of metals, and are a forum for scientists, engineers, and manufacturing specialists to exchange information, disseminate knowledge, and develop a mutual perspective about topical fundamental issues. The 2004 conference was organized in four distinct areas following the thematic context established by the keynote presentations: Industrial Applications, Modeling and Rheology, Microstructure, and Properties and Processing. Papers are organized according to these four areas, as well as the session in which the paper was presented. The CD includes the 92 papers presented at the conference and an additional 18 papers that were accepted but not presented.

Order No. 04-0900-CD * Weight 1 lb
Member Price: $65; Student Price: $65; List Price: $90

To order this title, visit the on-line TMS Document Center or contact TMS Book Representative Susan Sheldon at (724) 776-9000, ext. 256, or by e-mail at ssheldon@tms.org.

New Site Provides Benefits to Institutional Journal Subscribers

Institutional electronic subscribers to the TMS journals JOM, the Journal of Electronic Materials, and Metallurgical and Materials Transactions A and B will now be able to access their electronic subscriptions through IngentaConnect. Previously maintained as two separate sites, Ingenta.com and IngentaSelect.com, IngentaConnect will provide added value, primarily to institutions such as libraries or laboratories that subscribe to multiple journals. IngentaConnect will allow institutional TMS journal subscribers to link easily to articles referenced in TMS journals, provided that the institution also subscribes to the journal in which the referenced article appears. IngentaConnect houses a collection of some 17 million academic and professional research articles from 28,000 publications.

Articles from both current issues and archives of TMS journals will be available to IngentaConnect users through subscriptions and individual article purchases. IngentaConnect maintains archives for JOM and the Journal of Electronic Materials to 2001 and Metallurgical and Materials Transactions A and B to 1999.

TMS journals have been available through Ingenta-managed sites since 2002. Users who previously accessed data from the Ingenta and IngentaSelect sites will be directed to the IngentaConnect site; both individual and institutional subscriptions will transfer to the new IngentaConnect system. Customers who purchase subscriptions via subscription agencies will be able to provide their user identification information to their agency and their subscriptions will be transferred.

A Look at TMS's Most Popular On-Line Destinations

While most web surfers know which pages they regularly visit on the TMS web site, they rarely know what their colleagues are viewing. This month, we take a peek at the web statistics gathered by TMS in October to find the hottest spots on the TMS web site.

With more than 40,000 file requests in October, the TMS On-Line home page was the most frequently visited page on the TMS web site.

Three articles published in JOM made the top ten list of most frequently viewed pages: "Toy Story: Materials Engineering at Play" from the December 2002 issue; "Practical Engineering in TV's Impractical Engineering Shows: Monster Garage and Junkyard Mega-Wars" from the October 2003 issue; and "Why Did the World Trade Center Collapse? Science, Engineering, and Speculation" from the December 2001 issue. These and other HTML-enhanced JOM articles can be viewed through the JOM home page.

Other top hits included the 2005 TMS Annual Meeting home page, which was recently updated to include a wealth of information on programming highlights, activities, and registration; the general TMS Meetings home page, which provides a list of upcoming conferences; TMS press releases; the JOM home page; the Career Resource Center index of learning styles; and JOM classified advertisement listings. Explore some of these sites for yourself using the links below.

ABOUT e-NEWS

TMS e-News is a monthly e-mailed newsletter that provides information on The Minerals, Metals & Materials Society's membership, meetings, publications, and other activities of interest.

184 Thorn Hill Road
Warrendale, PA 15086
USA
T: 724-776-9000
F: 724-776-3770

News Editor:
Kelly Roncone

EDITORS' CHOICE

The editors of TMS publications select the must-read papers from the latest editions:

NOVEMBER JOM: "SpaceShipOne, the Ansari X Prize, and the Materials of the Civilian Space Race" by Maureen Byko
When SpaceShipOne rocketed into history in October, it was not an exhibition of new technology. But it was good enough. Good enough to travel 100 km into space. Good enough to return to Earth safely. And good enough to win $10 million, and possibly, change the way the world approaches space travel. This article provides details about the X Prize competition and some teams that participated.[READ]

NOVEMBER JOM: "Sheet Gamma TiAl: Status and Opportunities" by Gopal Das, H. Kestler, H. Clemens, and P.A. Bartolotta
Gamma TiAl alloys have attractive properties such as low density, high-temperature strength, and high modulus, oxidation, and burn resistance. As a result, these alloys have the potential to replace heavier superalloys in aircraft engine components. Gamma TiAl alloys were investigated in the 1950s but were too brittle for thermo-mechanical processing. However, interest in this class of material rekindled with several U.S. aerospace programs: the National Aerospace Plane, the Integrated High Performance Turbine Engine Technology, and Enabling Propulsion Materials/High Speed Civil Transport, as well as German hypersonic technology programs. Intense metallurgical and metal processing research during the last two decades led to significant progress in this area. As a result, gamma TiAl alloys are now available in all conventional product forms: ingots, forgings, extrusions, and sheets. This article reviews the current status of sheet gamma TiAl technology and its future opportunities. [READ]

NOVEMBER JOM: "Eutectic Solidification and Its Role in Casting Porosity Formation" by L. Lu, K. Nogita, S.D. McDonald, and A.K. Dahle
Understanding and controlling the eutectic solidification process in Al-Si alloys permits prediction of the formation of casting porosity, eventually leading to methods for its control and elimination. In addition, it enables control of eutectic structure, silicon morphology, and eutectic grain size to further improve the alloy properties. This paper presents the current understanding of eutectic solidification in hypoeutectic Al-Si foundry alloys and the relationship between eutectic solidification and porosity formation. New concepts in engineering eutectic solidification are also explored. [READ]

NOVEMBER MMTA: "Effect of Sn on Microstructure and Mechanical Properties of Ti-Base Dendrite/Ultrafine-Structured Multicomponent Alloys" by G. He, J. Eckert, and M. Hagiwara
This article was published in the new Light Metals section of Metallurgical and Materials Transactions A. Ti_57–xCu₁₅Ni₁₄Sn_4+xNb₁₀ (x = 0, 5, or 10) alloys were prepared by copper mold casting. At Sn 4 at. pct, a dendrite/ultrafine-structured multicomponent alloy was obtained, which exhibits 1271 MPa yield strength, 77 GPa Young's modulus, and 2 pct plasticity at room temperature for 3-mm-diameter samples. The cooling rate significantly affects the as-cast microstructure and the mechanical properties. For 5-mm-diameter samples, the alloy exhibits 1226 MPa yield strength, 63 GPa Young's modulus, and 2.5 pct plasticity. At Sn 9 at. pct, Ti-, Sn-, and Nb-rich particles precipitate primarily. This near-hypereutectic alloy composition leads to the precipitation of intermetallics, which deteriorate the mechanical properties and result in the coexistence of ductile and brittle fracture mechanisms. At Sn 14 at. pct, the alloy composition is completely in the intermetallic region, thus inducing the formation of Ti₂Cu, Ti₂Ni, and Ti₃Sn intermetallics. The alloy becomes very brittle because the intermetallic compounds dominate the fracture process. [READ]

NOVEMBER MMTA: "Quantitative Analysis of Texture Evolution of Cold-Rolled Direct-Chill-Cast and Continuous-Cast AA5052 and AA5182 Aluminum Alloys during Isothermal Annealing" by Y.M. Zhao, W.C.Liu, and J.G. Morris
This article was published in the new Light Metals section of Metallurgical and Materials Transactions A. The as-received direct-chill-cast (DC) and continuous-cast (CC) AA5052 and AA5182 hot bands were preheated at 454°C for 4 h, followed by cold rolling to an 80% reduction in thickness. The texture evolution of these cold-rolled samples during isothermal annealing was investigated by x-ray diffraction. The variation in texture volume fractions with annealing time was quantitatively analyzed by using the Johnson–Mehl–Avrami–Kolmogorov (JMAK) equation. The differences in recrystallization textures between the AA5052 and AA5182 alloys and between the DC and CC alloys were compared. It was found that the AA5052 alloy possessed a stronger cube recrystallization texture than the AA5182 alloy for the DC and CC materials. The recrystallization textures of the AA5182 alloy were affected strongly by the annealing temperature. As the annealing temperature increased, the cube recrystallization texture strengthened, whereas the R texture weakened. The annealing temperature had little influence on the recrystallization textures of the AA5052 alloy. The DC AA5052 and 5182 alloys also exhibited stronger cube recrystallization textures than the corresponding CC alloys. For the DC and CC AA5052 alloys, the n value in the JMAK-type equation increased with an increase in the annealing temperature, while the n values varied only slightly with the annealing temperature for the DC and CC AA5182 alloys. [READ]

NOVEMBER MMTA: "Thermodynamic Aspects of the Constitution, Grain Refining, and Solidification Enthalpies of Al-Ce-Si Alloys" by J. Gröbner, D. Mirkovic, and R. Schmid-Fetzer
The ternary Al-Ce-Si phase equilibria were investigated using x-ray diffraction (XRD) methods, metallography, scanning electron microscopy with energy-dispersive x-ray analysis (SEM/EDX) and wavelength-dispersive x-ray microanalysis, and differential thermal analysis (DTA). The focus was on the Al-rich corner and the phases in equilibrium with (Al). A consistent thermodynamic description was developed using the Calphad method incorporating all experimental data. A thermodynamic assessment for the binary Ce-Si system was also performed. Two ternary phases, Ce(Si_1–xAl_x)₂ (t₁) and AlCeSi₂ (t₂), were confirmed. The phase Al₂CeSi₂ (t₄) was sporadically observed, but is apparently metastable. The earlier reported phase Al₄Ce₃Si₆ could not be confirmed. In addition, the enthalpy of solidification of five Al-rich ternary alloys was measured in a differential scanning calorimetry (DSC) heat flux calorimeter. The agreement with the thermodynamic enthalpy calculations is acceptable. The fundamental intricacies involved in calculating a "latent" heat for alloys with a freezing range are pointed out. Various phase diagrams of the Al-Ce-Si system were calculated based on the thermodynamic description. They were used to quantitatively identify possible contributions to the grain refinement potential of Ce in Al-Si alloys due to the phase equilibria. [READ]

NOVEMBER JOURNAL OF ELECTRONIC MATERIALS: "Ohmic Contacts to n-Type GaSb and n-Type GaInAsSb" by Robin K. Huang, Christine A.Wang, Christopher T. Harris, Michael K. Connors, and Daniel A. Shiau
An investigation with the objective of improving n-type ohmic contacts to GaSb-based devices is described. This study involves a series of n-GaInAsSb and n-GaSb samples with varying doping, grown on semi-insulating (SI) GaAs substrates. These samples were fabricated into mesa-etched, transfer-length method (TLM) structures, and the specific-contact resistivity and sheet resistance of these layers as a function of majority electron concentration were measured. Extremely low specific-contact resistivities of about 2 × 10^–6 .O-cm² and sheet resistances of about 4 O/ are found for n-type GaInAsSb doped at about 3 × 10¹⁸ cm^–3. [READ]

NOVEMBER JOURNAL OF ELECTRONIC MATERIALS: "Novel Micro-Bump Fabrication for Flip-Chip Bonding" by Takao Ishii and Shinji Aoyama
This paper describes a new bump-fabrication technique for flip-chip connection between a chip and substrate. We propose a novel idea of forming solder microbumps on the substrate and directly bonding bare chips to the substrate. We successfully achieved the new flip-chip connection by using a 0.05Au-0.95Sn solder bump and a hydrogen-plasma reflow technique. Because the method eliminates the need for any process on the chip wafer, it will be very useful in fabricating flip-chip connections for low-cost packaging. [READ]

NOVEMBER JOURNAL OF ELECTRONIC MATERIALS: "Enhancement of Ferromagnetism in the Colossal--Magnetoresistance Layered Manganite La_1.2Ba_1.8Mn_2–xRu_xO₇(x = 0, 0.1, 0.5, and 1)" by Nori Sudhakar, K.P. Rajeev, and A.K. Nigam
Electrical transport and magnetic measurements of the Ru-doped, layered manganite system, La_1.2Ba_1.8Mn_2–xRu_xO₇(x = 0, 0.1, 0.5, and 1), have been carried out in the temperature range of 5–310 K and in the presence of magnetic fields up to 10 T. The magnetic transition temperatures are found to be above room temperature, and colossal magnetoresistance (CMR) is present at low temperatures and even close to room temperature. Magnetoresistance (MR) is found to obey power-law behavior as a function of applied field with an exponent close to 0.5 at low temperatures. [READ]

MEETINGS CALENDAR

Programs, on-line registration, and more:

2005 TMS ANNUAL MEETING & EXHIBITION
San Francisco, CA
Feb. 13-17, 2005

SOLID-SOLID PHASE TRANSFORMATION IN INORGANIC MATERIALS
Phoenix, AZ
May 29-June 3, 2005

2005 ELECTRONIC MATERIALS CONFERENCE
Santa Barbara, CA
June 22-24, 2005

ENVIRONMENTAL DEGRADATION OF MATERIALS IN NUCLEAR SYSTEMS-WATER REACTORS
Salt Lake City, UT
Aug. 14-18, 2005

INTL CONFERENCE ON SILICON CARBIDE AND RELATED MATERIALS
Pittsburgh, PA
Sept. 18-23, 2005

MS&T '05
Pittsburgh, PA
Sept. 25-28, 2005

INTL SYMPOSIUM ON SUPERALLOYS 718, 625, 706 AND DERIVATIVES
Pittsburgh, PA
October 2-5, 2005

NEWSWIRES