TABLE OF CONTENTS

CHALCO AND RUSAL JOIN TOP ALUMINUM COMPANIES AT 2005 TMS ANNUAL MEETING
Landmark Aluminum Plenary Session Announces Two New Speakers

ENCORE: FEATURED PRESENTATIONS SESSION PROVIDES REPEAT PERFORMANCES
Popular Papers Re-Presented at Special 2005 TMS Annual Meeting Session

ADVANCE REGISTRATION FOR THE 2005 TMS ANNUAL MEETING CLOSES JANUARY 17
Early Registrants Receive Discounted Rate

HOW TO . . .
. . . Use the TMS Personal Conference Scheduler

WASHINGTON NEWS FROM THE FEDERATION OF MATERIALS SOCIETIES
White House Urged to Better Measure Offshore Outsourcing

TMS APPOINTS NEW REPRESENTATIVE TO ABET BOARD OF DIRECTORS
TMS Volunteers Work with ABET to Evaluate College and University Programs

NEW BOOK: REWAS 2004 PROCEEDINGS NOW AVAILABLE
Three-Volume Book Set Can Be Purchased through TMS

TMS COSPONSORS EUROMAT 2005
TMS Organizes Two Symposia at European Conference

Landmark Aluminum Plenary Session Announces Two New Speakers

Two more top global aluminum companies have named representatives to participate in the aluminum plenary session scheduled to be held at the 2005 TMS Annual Meeting in February. The Aluminum Corporation of China (Chalco) has announced that Xiangmin Liu (pictured, left), vice president of Chalco, will represent the company at the session, confirming Chalco's previously announced participation. In addition, Russian aluminum company Rusal has also committed to sending a representative: Valery Matvienko (pictured, right), managing director of the aluminum division of Rusal.

Liu and Matvienko will join the four previously announced speakers from Alcan, Alcoa, Hydro Aluminum, and SUAL in a unique session that discusses the role of technology in the global primary aluminum industry today and in the future. The session is scheduled to be held Tuesday, February 15, 2005. Presentations will be followed by a question and answer session involving both the speakers and the audience.

Popular Papers Re-Presented at Special 2005 TMS Annual Meeting Session

Scheduling conflicts can often cause meeting attendees to miss key paper presentations in their field of interest during the 2005 TMS Annual Meeting. That's why on Wednesday, February 16, TMS is offering attendees a second chance to hear selected high-quality papers they may have missed earlier in the week.

Approximately nine papers presented at various symposia throughout the course of the conference are scheduled to be presented a second time during the Featured Presentations session, a new addition to the TMS technical program in 2005. Meeting attendees can visit the 2005 TMS Annual Meeting web site or the TMS Personal Conference Scheduler for a complete listing of scheduled presentations.

Early Registrants Receive Discounted Rate

Register for the 2005 TMS Annual Meeting by the advance registration deadline to receive a $100 discount on registration fees. All TMS professional members and nonmembers receive $100 off the on-site registration fee by signing up for the meeting before January 17, 2005. The meeting will be held February 13-17, 2005, in San Francisco, California.

Registering on-line is easy. Simply visit the registration section of the 2005 TMS Annual Meeting web site and select the appropriate registration category (TMS Member or Student Member, SME/AIST/SPE Member, Non-Member Student, Exhibit Booth Personnel, or Other Registrant). TMS members and student members will be asked to log in using their member number as the user name and their birth date in the form of MM/DD/YYYY as the password. Logging in will allow members to skip the step of typing in contact information that the society already has on file. The site also contains a downloadable version of the registration form in portable document format that can be printed out, filled in manually, and mailed or faxed to the society. When registering for the meeting, be sure to also secure housing accomodations in San Francisco.

. . . Use the TMS Personal Conference Scheduler

The TMS Personal Conference Scheduler (PCS) is an on-line tool designed to help TMS meeting attendees plan itineraries for upcoming TMS meetings. Individuals planning to attend the 2005 TMS Annual Meeting in February can use the PCS to plan their agendas and identify any potential schedule conflicts before arriving at the meeting. To use this tool, go to pcs.tms.org, where you will be asked to log in. TMS members can log in to the PCS by typing their TMS member number as the user name and their date of birth in the form of MM/DD/YYYY as the password. Nonmembers will need to register in order to use the site.

Once logged in, select the option to "Create a New Schedule." You will be asked to select the meeting you plan to attend from a list of upcoming TMS meetings. Once you have selected a meeting, a schedule of symposia taking place on the first day of the conference, including individual paper titles grouped by sessions, will display on your screen. You can view abstracts of the papers being presented by clicking on the paper titles highlighted in blue. To add a particular paper, session, or entire symposium to your schedule, click on the check boxes next to the symposia, sessions, or papers you wish to attend for that day.

If you choose to attend all the paper presentations of a particular symposium, click on the check box next to the symposium name to select all of the papers. If the symposium spans several days, clicking on this check box will also select papers being presented at this symposium on other days. Similarly, you may choose to schedule all the papers from an individual session by clicking on the session name. You may plan a schedule for other days during the conference by selecting one of the dates listed in the menu to the left of the screen.

At any time, you may view the presentations you have selected by clicking on the "View Capsule Schedule" option from the menu. This capsule schedule will alert you to any scheduling conflicts that may exist. To correct these schedule conflicts, select a day from the left menu to return to the listing of technical presentations. If you are satisfied with the presentations you have selected to attend, you may print out the capsule schedule for easy reference or choose to view (and/or print out) a more detailed version of the schedule, which will include paper abstracts, by clicking on "View Detailed Schedule" from the menu. On future visits to the site, you will be able to access this schedule and make adjustments to it as needed by logging in to the system.

White House Urged to Better Measure Offshore Outsourcing

Better data on outsourcing of American jobs overseas will help save U.S. jobs and create new ones, according to a new report issued by Senator Joe Lieberman (D-CT). "We need better data to understand what we are facing so we can develop effective, long-term strategies to address the offshoring challenge," Lieberman wrote in a letter to the Secretary of Commerce and Secretary of Labor accompanying his report. "Collecting this data is now a national imperative. Without this data, we run the risk of making policy in the dark . . . It is critically important that the Departments of Commerce and Labor regularly measure, track and assess offshore outsourcing data and the impact on U.S. wages, employment, and U.S. competitiveness."

The report, Data Dearth in Offshore Outsourcing: Policymaking Requires Facts, makes five legislative recommendations on extending the Trade Adjustment Assistance Program and requiring reporting from that program as well as other Bureau of Labor Statistics and Commerce Department bodies. This is the latest in a series of reports by the senator on outsourcing issues. Earlier white papers concluded that offshore outsourcing has begun to hit high-end services and R&D jobs. Senator Lieberman says, "We are beginning to send higher skill professional jobs overseas—including engineering, computer chip design and nanotechnology R&D, and with these jobs we may be losing the talent and technology that created the growth of the 1990's." The white paper concluded that "offshore outsourcing of high-end services and R&D jobs could threaten our innovation infrastructure, and therefore our economic prosperity and our national security."

The report is available in portable document format at lieberman.senate.gov/newsroom/whitepapers/Offshoredata.pdf

TMS Volunteers Work with ABET to Evaluate College and University Programs

The Accreditation Board for Engineering and Technology (ABET) has appointed new members to its Board of Directors, including a new representative from TMS. In October, Dennis W. Readey, professor at the Colorado School of Mines and TMS member since 1985, began his three-year term representing TMS on ABET's Board of Directors. J. Wayne Jones, professor at the University of Michigan, will serve as alternate.

TMS has a unique role among materials societies in the accreditation of materials science and engineering (MSE) programs at colleges and universities, being the only materials society to have formal responsibility to provide leadership in the establishment and fulfillment of MSE accreditation standards. When a college or university applies to ABET to have its MSE program accredited, TMS assembles a team of trained volunteer members to evaluate the program. For more information on participating in TMS accreditation activities, contact Gail Miller at gailm@tms.org.

Three-Volume Book Set Can Be Purchased through TMS

TMS announces the availability of its newest publication, the proceedings of the Global Symposium on Recycling, Waste Treatment, and Clean Technology (REWAS '04) held in Madrid, Spain, September 26-29, 2004. The conference was organized by Inasmet, the European Commission, INPL-Nancy, the Mining and Material Processing Society of Japan, and TMS.

REWAS '04: Global Symposium on Recycling, Waste Treatment, and Clean Technology
I. Gaballah, B. Mishra, R. Solozabal, and M. Tanaka, editors
ISBN 84-95520-03-6
2,958 pp., illus., index, three hardcover volumes
This collection contains the papers presented at REWAS '04, the Global Symposium on Recycling, Waste Treatment and Clean Technology. The conference served as a forum for the world's scientific and technical communities to address the continuing globalization of environmental protection through progress in the recycling technology, re-engineering of the production system, and clean technologies. Technical topics covered in the three volumes include clean technology, monitoring and characterization, general recycling, conversion and reutilization, waste stabilization, remediation, contaminated soils, and treatment of liquid and gaseous effluents. The proceedings also have case studies and economic evaluations of recycling, waste treatment, and clean technology.

Volume I
Order No. 04-1001
Price $75

Volume II
Order No. 04-1002
Price $75

Volume III
Order No. 04-1003
Price $75

Three-Volume Set
Order No. 04-1004
Price $210
Prices include shipping and handling.

To order this title, visit the on-line TMS Document Center or contact TMS Book Representative Susan Sheldon at (724) 776-9000, ext. 256, or by e-mail at ssheldon@tms.org.

TMS Organizes Two Symposia at European Conference

TMS has announced that it will co-sponsor Euromat 2005, the biennial conference sponsored by the Federation of European Materials Societies (FEMS). The conference is organized by various member societies of FEMS; this year's organizers are the Czech Society for New Materials and Technologies, the Metal Science Society of the Czech Republic, and Deutsche Gesellschaft für Materialkunde. More than 70 symposia are planned for the conference, including two organized by TMS: Advances in Very Long Life Fatigue Behavior in Structural Materials and Bulk Metallic Glasses. Symposia are still accepting abstract submissions. Abstracts are due by January 31, 2005.

The conference is scheduled for September 5-8, 2005 in Prague, Czech Republic. For more information, write to euromat@fems.org.

ABOUT e-NEWS

TMS e-News is a monthly e-mailed newsletter that provides information on The Minerals, Metals & Materials Society's membership, meetings, publications, and other activities of interest.

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EDITORS' CHOICE

The editors of TMS publications select the must-read papers from the latest editions:

DECEMBER JOM: "The Government Is Here to Help: A Small Business Perspective" by Warren H. Hunt, Jr.
Public-private partnerships between government and industry have been increasingly used as a vehicle for defining and executing R&D activities. Stimulus of smaller technology enterprises in particular is important, and this article explores this topic from the policy level as well as from organizations "on the ground." The story in brief: challenges and opportunities. [READ]

DECEMBER JOM: "Understanding Management of Computational Process Modeling and Simulations" by Michael Wadsley
The use of computational process modeling and simulation has become widespread as the real cost of computers has decreased and their capabilities have increased. However, many science and engineering university faculties have failed to treat this area as a formal undergraduate discipline. The result has been generally a self-taught approach by professionals to both the practice and the management of modeling and simulation. This article describes process modeling and simulation techniques and applications. [READ]

DECEMBER JOM: "JOM World Nonferrous Smelter Survey, Part II: Platinum Group Metals" by Rodney T. Jones
The platinum group metals (PGMs) are a family of six grayish to silver-white metals with close chemical and physical affinities: platinum, iridium, osmium, palladium, rhodium, and ruthenium. This article, the second in a series of industry surveys, provides a comprehensive look at PGM producers worldwide, with details on smelters, converters, and furnaces. The download is delivered as a .zip file that comprises a PDF of the article and the original Excel spreadsheet.[READ]

DECEMBER MMTA AND MMTB: "Nanotechnology: Scientific Challenges and Societal Benefits and Risks" by A.D. Romig, Jr., T.A. Michalske, and R.J. Floran
This article, published in the December issue of both MMTA and MMTB, is based on the 2003 Distinguished Lecture in Materials and Society given by A.D. Romig Jr. The field of nanotechnology is developing rapidly, as are its practical applications in society. In this article, the authors give examples that demonstrate the enormous potential that exists for this new class of materials, and for devices with critical dimensions of less than 100 nm. The authors also identify some of the challenges that need to be faced in order to fully realize the practical benefits of nanotechnology and discuss possible risks that may come with this new technology. [READ]

DECEMBER MMTA: "Characterization of Retrogression and Reaging Behavior of 8090 Al-Li-Cu-Mg-Zr Alloy" by K.S. Ghosh, K. Das, and U.K. Chatterjee
An 8090 Al-Li-Cu-Mg-Zr alloy in the peak-aged (T8) temper was subjected to retrogression treatment at temperatures above and below the d' (Al₃Li) solvus line and immediately reaged to various tempers. [READ]

DECEMBER MMTA: "Role of Carbon and Alloying Elements in the Formation of Bainitic Ferrite" by M. Hillert, L. Höglund, and J. Agren
One approach to the prediction of the carbon content of austenite, remaining after the precipitation of bainitic ferrite, is based on the assumption that bainitic ferrite during growth inherits the carbon content of the parent austenite. An alternative approach is based on the assumption that bainitic ferrite grows with a low carbon content and there is no major difference between Widmanstätten ferrite and bainitic ferrite. The two approaches are now compared using information from alloyed steels with considerable amounts of Si, where the formation of cementite is retarded. [READ]

DECEMBER MMTA: "Widmanstätten Ferrite Plate Formation in Low-Carbon Steels" by Dominic Phelan and Rian Dippenaar
The mechanism by which Widmanstätten ferrite plates nucleate and grow in low-carbon steels has been studied. In-situ laser scanning confocal microscopy observations, optical microscopy, and electron backscattered diffraction techniques have been used to characterize the relationship between grain boundary allotriomorphs and Widmanstätten ferrite plates. [READ]

DECEMBER MMTB: "Yield Behavior of Commercial Al-Si Alloys in the Semisolid State" by Q.Y. Pan, D. Apelian, and A.N. Alexandrou
Systematic experimental work and modeling efforts have been conducted to characterize the yield behavior of commercial aluminum alloys in the semisolid state. In this study, extensive compression experiments were performed to measure the yield stress of semisolid aluminum slurries at high solid fractions (0.5 to 1.0), and a cone penetration method was employed to measure yield stress at low solid fractions (<0.5). [READ]

DECEMBER MMTB: "Thermomechanical Finite-Element Model of Shell Behavior in Continuous Casting of Steel" by Chunsheng Li and Brian G. Thomas
A coupled finite-element model, CON2D, has been developed to simulate temperature, stress, and shape development during the continuous casting of steel, both in and below the mold. The model simulates a transverse section of the strand in generalized plane strain as it moves down at the casting speed. [READ]

DECEMBER JOURNAL OF ELECTRONIC MATERIALS: "The Application of Lead-Free Solder to Optical Fiber Packaging" by S. Ou, G. Xu, Y. Xu, and K.N. Tu
To achieve precise, hermetic, and reliable optoelectronic packaging, we studied a novel technology for bonding fibers to v-grooved chips by metallic soldering. Multilayered metallization of Ti/Au, Ti/Cu/Au, or Ti/Ni/Au has been prepared to improve the poor bonding nature of solder on oxide surface. The eutectic 43Sn57Bi (wt.%) alloy, having a melting point of 139°C, was selected to bond the fibers to v-grooved chips. The alignment and adhesion test results show that the precision packaging by soldering has a satisfied reliability in the range of working temperature from -40°C to 85°C. The metallic solder bonding is hermetic, and hence, it can isolate the optical device from ambient environment. [READ]

DECEMBER JOURNAL OF ELECTRONIC MATERIALS: "The Effects of Electroplating Parameters on the Composition and Morphology of Sn-Ag Solder" by J.Y. Kim, J. Yu, J.H. Lee, and T.Y. Lee
The Sn-Ag solder was electrodeposited from a bath that basically is composed of tin sulfate (SnSO₄), silver nitrate (AgNO₃), and thiourea (CH₄N₂S), acting as a complexing agent to silver. The composition and morphology of electrodeposited Sn-Ag solder were studied in terms of silver concentration in bath current density, duty cycle, and additives. [READ]

MEETINGS CALENDAR

Programs, on-line registration, and more:

2005 TMS ANNUAL MEETING & EXHIBITION
San Francisco, CA
Feb. 13-17, 2005

SOLID-SOLID PHASE TRANSFORMATION IN INORGANIC MATERIALS
Phoenix, AZ
May 29-June 3, 2005

2005 ELECTRONIC MATERIALS CONFERENCE
Santa Barbara, CA
June 22-24, 2005

ENVIRONMENTAL DEGRADATION OF MATERIALS IN NUCLEAR SYSTEMS-WATER REACTORS
Salt Lake City, UT
Aug. 14-18, 2005

INTL CONFERENCE ON SILICON CARBIDE AND RELATED MATERIALS
Pittsburgh, PA
Sept. 18-23, 2005

MS&T '05
Pittsburgh, PA
Sept. 25-28, 2005

INTL SYMPOSIUM ON SUPERALLOYS 718, 625, 706 AND DERIVATIVES
Pittsburgh, PA
October 2-5, 2005

NEWSWIRES