TABLE OF CONTENTS

TMS OPENS SUPERALLOYS ARCHIVE
Proceedings from Past Conferences Now Available Free of Charge

HOW TO . . .
. . . Access Additional Archived Papers from TMS

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REGISTER BY FEBRUARY 13 TO RECEIVE $100 OFF . . .
. . . 2006 TMS Annual Meeting On-Site Registration Fees

A HISTORY OF NICKEL TECHNOLOGY
2006 TMS Annual Meeting Symposium Chronicles a Century of Nickel Alloy Developments

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TOP TEN (OR SO) . . .
. . . 2006 TMS Annual Meeting Honorees

SPOTLIGHT ON . . .
. . . The Corrosion and Environmental Effects Committee

WASHINGTON NEWS FROM THE FEDERATION OF MATERIALS SOCIETIES
Report Suggests New Regulatory Framework for Nanotechnology

INVITING TMS MEMBERS TO NOMINATE COLLEAGUES FOR ENGINEERING AWARDS
National Academy of Engineering Prizes Exceed $1 Million

Proceedings from Past Conferences Now Available Free of Charge

Fourteen proceedings from past superalloy conferences are now available to the entire materials community. Through the on-line TMS Document Center, web users can download—free of charge—any papers from past volumes of two long-running TMS conference series: Superalloys (nine volumes published from 1968–2000) and Superalloys 718, 625, 706, and Various Derivatives (five volumes published from 1989–2001).

To access the meeting archives, visit the Superalloys section of the TMS Document Center using the link below. All of the papers in this section (with the exception of the most recent volumes Superalloys 2004 and Superalloys 718, 625, 706, and Derivatives [2005]) can be downloaded without logging into the site or purchasing access. Users can simply click on the red "Use Download Privilege" button to the left of each paper title to download a copy of that paper in portable document format. Access to these archives was made possible through the support of the Seven Springs International Symposium Committee, which sponsors the publication of proceedings for the International Symposium on Superalloys Conference series.

. . . Access Additional Archived Papers from TMS

Though many older TMS publications are no longer available in traditional hardcopy format, many papers from past years' conference proceedings and journals can be accessed in portable document format through the on-line TMS Document Center.

As a general guideline, papers published in TMS journals (JOM, Journal of Electronic Materials, and Metallurgical and Materials Transactions) from late 1997–present can be purchased, in portable document format, through the TMS Document Center. (Electronic subscribers to these journals receive free access to their archives.) Award-winning and frequently requested papers from both books and journals can also be found in the Landmark Papers section of the site.

While the TMS Document Center's resources are extensive, some papers may not be available through this site. To obtain these papers, contact the Linda Hall Library, which houses an extensive collection of books and journals from TMS and other member societies of the American Institute of Mining, Metallurgical and Petroleum Engineers. Users can search the Leonardo catalog through the Linda Hall Library web site to find specific publications. In addition, the library offers customized information services (for a fee) to assist researchers in finding pertinent information. For more information on the library's services, contact reference@lindahall.org.

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. . . 2006 TMS Annual Meeting On-Site Registration Fees

To receive the best rates on meeting registration and hotel arrangements for the 2006 TMS Annual Meeting, to be held March 12–16 in San Antonio, Texas, attendees should submit housing and registration forms to TMS no later than February 13. San Antonio is one of the most popular destinations for TMS meetings, attracting a record 4,537 attendees the last time the society visited in 1998. Using the links below, attendees can register on-line or download copies of the housing and registration forms in portable document format. Printed forms can be faxed to TMS at (724) 776-3770. After February 13, attendees may still sign up for the meeting, but registration prices will go up by $100 and discounted hotel conference rates will no longer be available.

2006 TMS Annual Meeting Symposium Chronicles a Century of Nickel Alloy Developments

History buffs, alloy producers, and end users will get a lesson in the development of nickel alloys and a glimpse into their future at A Century of Nickel Alloy Discovery and Innovation, a single-session symposium at the 2006 TMS Annual Meeting in March. Organizer Lewis Edward Shoemaker thinks the symposium will have wide appeal, due to its focus on application. For his presentation on Monel metal, Shoemaker is taking advantage of his company's vast archives to compile a visually interesting history of the metal's development and uses. Pictured is an early 1920s laundry delivery truck that uses Monel hardware and trim, from Shoemaker's presentation. It was taken from the archives of Special Metals Corporation, formerly the International Nickel Company, which first patented Monel metal in 1906.

The first half of the session will examine the development of various alloys, while the second half will look to the alloys' future. A panel of representatives from five or six end-use industries (such as automotive, aerospace, and chemical processing) will discuss possible future directions for nickel alloys in the next century.

The session begins at 2 p.m. on Monday, March 13. The proceedings are planned for publication in the September issue of JOM.

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. . . 2006 TMS Annual Meeting Honorees

We couldn't choose just ten. At the 2006 TMS Annual Meeting, eleven symposia will be held to honor the lives and work of influential materials scientists and engineers. All have made significant contributions to the field; therefore, this month's top ten salutes those professionals honored by symposia in alphabetical order according to their last names.

Martin Blackburn: A titanium alloy-themed symposium will be held in memory of Blackburn's wit, wisdom, and work in modern physical metallurgy and behavior of titanium alloys.

David Brandon: For his 70th birthday, colleagues and friends will honor Brandon's research interests over the past five decades with a symposium on advanced materials and characterization.

Mysore A. Dayananda: In celebration of his 70th birthday, a symposium on multi-component/multi-phase diffusion will honor Dayananda's contributions to materials, including his work in training and educating students.

William Gerberich: Gerberich's long-time colleagues, friends, and students working in the broad area of deformation and fracture will gather to celebrate his 70th birthday.

John Hunt: A symposium will honor Hunt's seminal contributions to the science and technology of solidification in a career that spans more than forty years at Cambridge University, Bell Laboratories, and Oxford University.

Arthur McEvily: For his 80th birthday, a symposium will honor McEvily's seminal contributions to the theoretical and experimental aspects of fatigue and fracture over the last 50 years.

James Morris: Colleagues and friends will honor Morris's long-term contributions to the study of the physical and mechanical metallurgy of aluminum alloys produced by wrought processing methods.

Amiya Mukherjee: On the occasion of his 70th birthday, Mukherjee's contributions to the understanding of process-structure-property relationships in the behavior of structural materials from the micro- to the nano-scale will be honored.

Pradeep Rohatgi: A symposium on solidification processing of metal-matrix composites will honor the Wisconsin Distinguished Professor of Engineering.

Gary Sandrock, Louis Schlapback, and Seijirau Suda: This year's Advanced Materials for Energy Conversion symposium will honor three international scientists who have made major contributions in the development and understanding of metal hydrides: Sandrock (from the United States), Schlapback (from Switzerland), and Suda (from Japan).

Monroe Wechsler: A symposium will honor Wechsler's contributions on radiation effects, phase transformations, and deformation fundamentals.

Many of these symposia have associated honorary dinners. Tickets can be purchased for these events through the 2006 TMS Annual Meeting registration form.

. . . The Corrosion and Environmental Effects Committee

The TMS Corrosion and Environmental Effects Committee (CEEC) is designed to call awareness to the issue of corrosion and the environmental degradation of materials by interaction with the environment, according to committee chair Raul B. Rebak. "Our membership is not large but our members are very active," said Rebak.

Current Activities
The committee's work is featured in the January issue of JOM, where Vimal Desai, advisor to JOM from the CEEC, organized a series of four papers on high-temperature protection issues. The committee will appear on the pages of JOM again in August 2006 with a suite of papers on Hydrogen Fuel Cells, organized by Z. Gary Yang. At the 2006 TMS Annual Meeting, the committee is sponsoring the following symposia:

• Effects of Water Vapor on High-Temperature Oxidation and Mechanical Behavior of Metallic and Ceramic Materials
• Materials in Clean Power Systems: Applications, Corrosion, and Protection.

Report Suggests New Regulatory Framework for Nanotechnology

The Woodrow Wilson International Center has released a report by Terry Davies, former assistant administrator of the Environmental Protection Agency, which calls for a new regulatory approach to nanotechnology. David Rejeski, director of the Wilson Center's Project on Emerging Nanotechnologies, said that "if nanotechnology is to succeed, there needs to be a dialogue around the proactive approach Davies suggests. Government, business, and citizen groups need to exchange views and discuss options to assure the American public that as nanotechnology matures, any adverse health and environmental effects will be identified and prevented or controlled."

Davies' report concludes that nanotechnology is difficult to address using existing regulations such as OSHA, FDA, and major environmental laws such as the Clean Air Act, Clean Water Act, Toxic Substances Control Act, and Resource Conservation and Recovery Act. Therefore, a new law may be required to manage potential risks of nanotechnology. The law would require manufacturers to submit a sustainability plan which would show that the nanotech product will not present an unacceptable risk. Davies acknowledges that "the political obstacles to passing new legislation are very large." The report also describes several mechanisms to encourage beneficial applications of nanotechnology, including research, tax breaks, acquisition programs, and regulatory incentives. It then outlines institutional needs in four areas: international harmonization, foresight capability, research on adverse health and environmental effects, and public participation.

National Academy of Engineering Prizes Exceed $1 Million

TMS members are invited to submit nominations for the 2006-2007 National Academy of Engineering (NAE) Awards. Each year, the NAE dedicates more than $1 million to recognizing leaders in engineering for their lifetime dedication to their field and their commitment to advancing the human condition through great engineering achievement and/or through innovation in engineering and technology education.

The NAE is currently accepting nominations for five awards for engineering achievement and innovation:

• The Charles Stark Draper Prize
• The Fritz J. and Dolores H. Russ Prize
• The Bernard M. Gordon Prize for Innovation in Engineering and Technology Education
• The Founders Award
• The Arthur M. Bueche Award

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EDITORS' CHOICE

The editors of TMS publications select the must-read papers from the latest editions:

JANUARY JOM: "Recent Progress in the Coating Protection of Gamma Titanium-Aluminides" by C. Leyens, R. Braun, M. Frohlich, and P.Eh. Hovsepian
Engine designers show continued interest in titanium aluminides based on the intermetallic gamma-TiAl phase as lightweight structural materials to be used at moderately elevated temperatures. Although alloy development has made significant progress in terms of mechanical properties and environmental resistance, protective coatings have been developed that help to extend the lifetime of these alloys significantly. The major challenge of coating development is long-term stability of a protective oxide scale that forms during service for which purpose alumina formation is essential. Furthermore, changes of coating chemistries at high temperatures must be controlled to avoid rapid degradation of the coatings due to diffusional losses into the substrate material and vice versa. [READ]

JANUARY JOM: "Predicting Oxide Stability in High-Temperature Water Vapor" by Elizabeth J. Opila, Nathan S. Jacobson, Dwight L. Myers, and Evan H. Copland
The importance of understanding and predicting the interactions of oxides with water vapor at high temperatures is demonstrated in this article. Methods for observing volatilization phenomena and identifying the chemical formulae for volatile metal hydroxides are discussed. In addition, techniques for obtaining accurate thermodynamic data for gaseous metal hydroxide species are described. Detailed examples of the stability of the principle structural and/or protective oxides chromia, silica, and alumina in high-temperature water vapor are included. [READ]

JANUARY JOM: "The Oxidation Properties of Fourth Generation Single-Crystal Nickel-Based Superalloys" by Kyoko Kawagishi, Hiroshi Harada, Akihiro Sato, Atsushi Sato, and Toshiharu Kobayashi
The fourth-generation nickel-based single-crystal superalloys, which contain large amounts of refractory metals for strengthening and platinum group metals for topologically close-packed phase prevention, show excellent high-temperature strength. However, these alloying elements seem to decrease high-temperature oxidation resistance. In this study, nickel-based superalloys with various amounts of tantalum, rhenium, and ruthenium were examined in isothermal and cyclic exposures at 1,100°C to investigate the effect on the oxide growth rate and resistance to scale spallation. Ruthenium and rhenium were found to degrade the oxidation resistance by the vaporization of their oxide. Tantalum-rich oxide in the spinel layer acts to stabilize ruthenium and rhenium oxide in the scale. The addition of hafnium and yttrium is effective in improving the oxidation resistance of ruthenium-containing nickel-based superalloys. [READ]

JANUARY JOURNAL OF ELECTRONIC MATERIALS: "Wettability of Electroplated Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder" by Yung-Chi Lin, Jenq-Gong Duh, and Bi-Shiou Chiou
Nickel plating has been used as the under bump metallurgy (UBM) in the microelectronics industry. In this study, the electroplating process was demonstrated to be a good alternative approach to produce the Ni-P layer as UBM. The wettability of several commercial solder pastes, such as Sn-3.5Ag, Sn- 37Pb, and Sn-3Ag-0.5Cu solder, on electroplated Ni-P with various phosphorous contents (7 wt.%, 10 wt.%, and 13 wt.%) was investigated. The role of phosphorus in the wettability was probed. The surface morphology and surface roughness in electroplated Ni-P was observed with the aid of both field emission scanning electron microscope and atomic force microscope. The correlation between wettability and phosphorus contents in electroplated Ni-P was evaluated. As the phosphorous contents increased, the surface morphology of the Ni-P deposit was smoother and surface roughness of Ni-P became smaller. The improvement of surface morphology and surface roughness enhanced the wettability of electroplated Ni-P. The interfacial reaction between lead-free solder and electroplating Ni-P UBM was also investigated. [READ]

JANUARY JOURNAL OF ELECTRONIC MATERIALS: "Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers" by Sinn-Wen Chen, Shih-Kang Lin, and Ching-Feng Yang
A Pb-free composite solder is prepared with a Pb-free solder substrate and a plated-indium layer. The indium layer melts during the soldering process, wets the substrates, and forms a sound solder joint. Since the melting temperature of indium is 156.6°C, lower than that of the eutectic Sn-Pb, which is at 183°C, the soldering process can be carried out at a temperature lower than that of the conventional soldering process. Composite solder joints with three different Pb-free solders, Sn, Sn-3.5 wt.% Ag, and Sn-3.5 wt.% Ag-0.5 wt.% Cu, and two substrates, Ni and Cu, are prepared. The interfaces between the indium layer, Pb-free solder, and Ni and Cu substrate are examined. A good solder joint is formed after a 2-min reflow at 170°C. A very thick reaction zone at the indium/Pb-free solder interface and a thin reaction layer at the indium/substrate interface are observed. [READ]

JANUARY JOURNAL OF ELECTRONIC MATERIALS: "Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu Under-Bump Metallization after Various Reflow Cycles" by Li-Yin Hsiao, Szu-Tsung Kao, and Jenq-Gong Duh
Electroless Ni-P/Cu under-bump metallization (UBM) is widely used in electronics packaging. The Sn3.0Ag0.5Cu lead-free composite solder pastes were produced by a mechanical alloying (MA) process doped with Cu₆Sn₅ nanoparticles. In this study, the detailed interfacial reaction of Sn3.0Ag0.5Cu composite solders with EN(P)/Cu UBM was investigated after reflow. Based on the observation and characterization, the reaction mechanism of interfacial phase transformation between Sn3.0Ag0.5Cu composite solders and EN(P)/Cu UBM after various reflow cycles was discussed and proposed. [READ]

JANUARY METALLURGICAL AND MATERIALS TRANSACTIONS A: "January Metallurgical and Materials Transactions A" by Various Authors
The January issue of Metallurgical and Materials Transactions A has 18 technical publications as well as a selection of seven articles from the Symposium on Processing and Properties of Structural Materials. Oral versions of these papers were presented during the 2003 TMS Fall Meeting in Chicago, Illinois. "The papers capture the recent diverse research carried out in the processing and properties of structural materials. They cover superalloys, refractory alloys, intermetallics, lightweight alloys," said symposium chairs, Khaled Morsi and Viola L. Acoff. Metallurgical and Materials Transactions is pleased to announce that Srikumar Banerjee has been appointed as the journal's newest associate editor. Banerjee is currently the director of the Bhabha Atomic Research Centre in Trombay, Mumbai, India.[READ]

Programs, on-line registration, and more:

SOUTH AFRICAN PYROMETALLURGY 2006
Cradle of Humankind, South Africa
March 5–8, 2006

2006 TMS ANNUAL MEETING
Advanced Registration Deadline: Feb. 13th
San Antonio, TX
March 12-16, 2006

SENSOR-BASED SORTING 2006
Aachen, Germany
March 28–30, 2006

MCWASP 2006
Opio, France
May 28–June 2, 2006

2006 ELECTRONIC MATERIALS CONF.
Abstracts Due: Feb. 3rd
University Park, PA
June 28-30, 2006

THERMEC 2006
Vancouver, Canada
July 4–8, 2006

2006 SOHN INT'L SYMPOSIUM
San Diego, CA
Aug. 27-31, 2006

COM 2006: CONFERENCE OF METALLURGISTS
Montréal, Canada
October 1–4, 2006

THIRD INT'L SYMPOSIUM ON IRON CONTROL IN HYDROMETALLURGY
Montréal, Canada
October 1–4, 2006

INT'L SYMPOSIUM ON MAGNESIUM TECHNOLOGY IN THE GLOBAL AGE
Montréal, Canada
October 1–4, 2006

INT'l CONFERENCE ON INNOVATIVE SOLUTIONS FOR THE ADVANCEMENT OF THE TRANSPORT INDUSTRY
San Sebastian, Spain
October 4-6, 2006

MS&T '06
Abstracts Due: Mar. 15
Cincinnati, OH
Oct. 15-19, 2006

INT'L CONF. ON ADVANCES IN MECHANICAL ENGINEERING
Fatehgarh Sahib, India
Dec. 1-3, 2006

2007 TMS ANNUAL MEETING
Orlando, FL
Feb. 25-Mar. 1, 2007

COPPER 2007
Toronto, Canada
Aug. 25-30, 2007

MS&T '07
Detriot, MI
Sept. 16-19, 2007

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