TABLE OF CONTENTS

TMS NAMES FIRST EARLY CAREER FACULTY FELLOW
Ryan K. Roeder of the University of Notre Dame Wins New Award

SOHN SYMPOSIUM ATTRACTS INTERNATIONAL PARTICIPATION . . .
. . . From Presenters and Sponsors Throughout the Materials Community

FROM OUR SPONSOR: EDAX EDS-EBSD MULTIPHASE ANALYSIS
The Power of EDAX-TSL Orientation Imaging Microscopy (OIM™) and the Patented ChiScan Technology

DISTINGUISHED LECTURER ANNOUNCED FOR MS&T '06
Registration for Fall Conference Is Now Open

SPOTLIGHT ON . . .
. . . Electronic Packaging and Interconnection Materials Committee

HOW TO . . .
. . . Add a Company Listing to the JOM Recycling Technical Directory

TMS 2007 CALL FOR PAPERS
Present Your Paper before a Global Audience of Science and Engineering Professionals

TMS MEMBERS RECEIVE DISCOUNTED RATES . . .
. . . on Materials Science and Engineering Publications from DEStech

WHAT SHOULD A PE KNOW?
TMS Seeks Input in Developing Professional Engineer Exam

INTERNATIONAL SPECIALTY CONFERENCE SOLICITS PAPERS . . .
. . . on Very High-Cycle Fatigue

WASHINGTON NEWS FROM THE FEDERATION OF MATERIALS SOCIETIES
Innovation Bills Moving in Congress

Ryan K. Roeder of the University of Notre Dame Wins New Award

At the 2006 TMS Annual Meeting in March, TMS established the Early Career Faculty Fellow Award to recognize an accomplished academic professional who has the capability to broaden the existing technological profile of TMS. Ryan K. Roeder, an assistant professor in the Department of Aerospace and Mechanical Engineering at the University of Notre Dame, was selected as the first winner of the award, which is open to assistant professors at academic institutions.

Roeder will receive financial support from the TMS Foundation to attend the 2007 and 2008 TMS Annual Meetings. At the 2007 meeting, Roeder will present the TMS Young Leader Tutorial Luncheon lecture on the topic of materials research in multidisciplinary, application-driven technology. For the 2008 meeting, Roeder plans to develop a multidisciplinary symposium on biomaterials.

. . . From Presenters and Sponsors Throughout the Materials Community

The Sohn International Symposium on Advanced Processing of Metals and Materials has drawn enthusiastic response from the international professional community. This conference, which focuses on three equally important topics—principles, technologies, and industrial practice—boasts the following numbers:

• 530 abstracts have been received from primary authors in 55 countries and co-authors in more than 80 countries
• 55 sessions are planned on non-ferrous high-temperature extraction and processing; iron and steel making; aqueous, electrochemical processing, and molten salts; nano, composite, refractory, and polymer materials; recycling, recovery, and waste treatment; sulfide smelting; and legal, management, and environmental issues
• 104 professional societies and organizations worldwide are co-sponsoring this TMS specialty conference, which is supported financially by Ausmelt, FLOGEN Technologies Inc., Korea Institute of Geosciences and Mineral Resources, Korea Zinc, LS-Nikko, Outokumpu, Posco, Umicore, and Xstrata
• The proceedings are published in nine volumes (available at the meeting)

The Power of EDAX-TSL Orientation Imaging Microscopy (OIM™) and the Patented ChiScan Technology

Have you ever performed an energy dispersive X-ray analysis (EDS) or an electron backscatter diffraction (EBSD) scan and not been able to conclusively identify all the phases with one technique alone? Only EDAX has the patent for simultaneous EBSD-EDS data analysis at each map pixel with the goal to identify a single, unique phase. EDAX Multiphase Analysis first harnesses the proven analytical properties of the EDAX-TSL OIM™ products: pattern fit, confidence index, and triplet indexing. EDAX then adds EDS elemental information to decisively discriminate between crystallographic similar phases to yield an unparalleled phase solution. There is no limitation to the number of phases that can be considered for a potential match. Multiphase Analysis provides the user with flexibility and quality data analysis to bring a unique solution to your materials analysis problems.

Imitation is the best form of flattery, but only EDAX's patented Multiphase Analysis product provides Results with Confidence.

If you think Multiphase Analysis can solve your problem(s) contact EDAX at 201-529-4880 or E-mail us at info.edax@ametek.com. For more information on EDAX please visit our website www.edax.com.

Registration for Fall Conference Is Now Open

Joel P. Clark, professor of materials systems and founder of the Materials Systems Analysis Laboratory at the Massachusetts Institute of Technology, has been selected to deliver the 2006 ASM/TMS Joint Lecture at Materials Science & Technology 2006 (MS&T '06). Clark, whose research and teaching focus on developing methods to analyze the competitive position of materials and processes in specific applications, will give the presentation "Economic and Environmental Issues Associated with the Selection, Manufacturing, and Use of Materials."

MS&T '06 is the multi-society collaboration that combines the resources of TMS, the American Ceramic Society, ASM International, and the Association for Iron & Steel Technology. Registration for this conference is now open. To receive the early registration discount rate, register by September 25. For more information on this upcoming conference, see the July issue of JOM.

. . . Electronic Packaging and Interconnection Materials Committee

With a European ban on lead in electrical and electronic equipment set to be implemented in July, lead-free materials and technologies are a hot topic—and a key focus of programming and publications for the Electronic Packaging and Interconnection Materials Committee of TMS. The committee presented a series of papers on lead-free implementation in the June issue of JOM and is planning to participate in several upcoming symposia on the topic.

For MS&T '06, to be held in October, members of the Electronic Packaging and Interconnection Materials Committee are helping to organize the symposium Lead-Free Soldering: It Is Here to Stay—Applications, Alloy Development, and Impact. For the 2007 TMS Annual Meeting, the committee is now accepting submissions for the Pb-Free Electronic Solders: Alloy Design, Characterization, and Service Reliability symposium, as well as for a symposium on advanced metallizations and interconnect technologies in honor of Prof. K.N. Tu's 70th Birthday.

Each year, in conjunction with the TMS Annual Meeting, the committee also holds a Lead-Free Technology Workshop where industry and academic participants meet to discuss industrial needs. Presentations from the 2006 workshop will be available for download soon from the on-line TMS Document Center.

To become involved with the Electronic Packaging and Interconnection Materials Committee, part of the TMS Electronic, Magnetic & Photonic Materials Division, contact the TMS Technical Committee Liasion.

. . . Add a Company Listing to the JOM Recycling Technical Directory

To complement the technical content of its August issue, JOM plans to publish a directory of companies working in the recycling industries. You can add your company's listing to the technical directory—the fifth in a series published by JOM—free of charge through the JOM web site.

To submit your company listing, go to the JOM Technical Directory web site. Scroll to the bottom of the page and click on the button to "Add/Edit Listing." Here, you will be prompted to enter your company's contact information, a company description, and brief explanations of featured products. Once this form is submitted, the information will be forwarded to a TMS staff member for approval prior to publication. To be included in the print version of the August JOM Technical Directory on recycling, please submit your company listing no later than June 28.

The JOM technical directories are free resources for the materials science and engineering community. There is no charge to submit a listing or to view previously published directories on-line. For more information, contact Trudi Dunlap at tdunlap@tms.org.

Present Your Paper before a Global Audience of Science and Engineering Professionals

TMS 2007 136th Annual Meeting & Exhibition:
Linking Science and Technology for Global Solutions

February 25-March 1, 2007 • Walt Disney World Swan and Dolphin Hotel • Orlando, Florida, USA

The TMS annual meeting draws authors and attendees in the top of their fields from all corners of the world. You are invited to be among the presenters contributing to this respected technical program by submitting your abstract online today at cmsplus.tms.org.

This interdisciplinary meeting presents programming in three topical areas:

• Light Metals
• Extraction, Processing, Structure and Properties
• Emerging Materials

. . . on Materials Science and Engineering Publications from DEStech

Through a new agreement with DEStech Publications, TMS members can now purchase selected DEStech books and CD-ROMS at a 10% discount through the TMS Document Center. The publishers have hand-picked 11 titles especially for TMS readers, dealing with the topics of advanced materials science and technology, plastics/polymers, reliability engineering, and laser technology. Primarily a collection of hard- and soft-cover books, this selection also includes the CD-ROM set Painter and Coleman on Polymers.This two-disc set comes with a supplemental workbook and provides a comprehensive introduction to polymers.

For more information on this and other DEStech publications from TMS, visit the "New Books" section of the TMS Document Center's "Proceedings, Textbooks, and Papers" department.

TMS Seeks Input in Developing Professional Engineer Exam

TMS is the materials society responsible for writing and administering the national professional engineer (P.E.) examination for metallurgical engineers. In this role, TMS must periodically re-evaluate the knowledge and skills needed to practice the discipline of metallurgical engineering. TMS is now surveying the materials community to determine the skills deemed necessary for an engineer with a bachelor's degree and four years of practical experience to succeed in today's work environment. As part of the evaluation process, TMS has proposed renaming the exam Metallurgical and Materials Engineering and is exploring the extent to which the exam should be expanded to include other materials.

The input of materials professionals is essential to this exploration. To show the society's appreciation, TMS will enter all qualified survey participants into a drawing to receive free meeting registrations, publications, and memberships from TMS. The on-line survey can be accessed using the link below. Please contact Nellie Luther, TMS professional affairs coordinator, for more information.

. . . on Very High-Cycle Fatigue

CMS-Plus, the on-line TMS Conference and Proceedings Management System, is now accepting abstracts for a new TMS specialty conference: the Fourth International Very High Cycle Fatigue Conference.

The conference, to be held August 19–22, 2007 on the campus of the University of Michigan, will provide an opportunity for the global fatigue community to present and discuss the latest experimental and theoretical research on the fatigue behavior of structural materials in the very high cycle regime. The first three iterations of this international conference were held in Paris, Austria, and Japan. Prospective authors are invited to submit a 150-word abstract through CMS-Plus by October 2, 2006.

Innovation Bills Moving in Congress

The House Science Committee reported out two bills that address the education and workforce segments of U.S. President George W. Bush's American Competitiveness Initiative (ACI). After fact-finding hearings earlier this year, the Republicans on the committee had introduced their legislative package as three bills. Weeks of negotiation led to the full committee's approval of a consolidation of the bills into two measures which incorporated proposals by the panel's Democratic members. The Early Career Research Act authorizes programs at the National Science Foundation (NSF) and the Department of Energy's Office of Science to provide grants to early career researchers to conduct high-risk, high-return research. The bill also expands an NSF program that helps universities acquire high-tech equipment to be shared by researchers and students. H.R.5358, the Science and Mathematics Education for Competitiveness Act, would address science, math, and engineering education at all levels, from K-12 through graduate school.

Taking a more aggressive tack, the Senate Commerce Committee approved a bill which creates new programs that go beyond the ACI. S.2802 would establish a President's Council on Innovation and Competitiveness charged with developing an agenda for promoting innovation in the public and private sectors. It would authorize the president's request for increased funding for the NSF, and would authorize NSF grants to community colleges for new technical apprenticeship and mentoring programs. Moving beyond the administration's request, the bill would require NASA to establish an executive council with oversight over distribution and management of basic research activities and an institute to manage aeronautical research programs.

ABOUT e-NEWS

TMS e-News is a monthly e-mailed newsletter that provides information on The Minerals, Metals & Materials Society's membership, meetings, publications, and other activities of interest.

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News Editor:
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EDITORS' CHOICE

The editors of TMS publications select the must-read papers from the latest editions:

JUNE JOM: "Titanium Investment Casting Defects: A Metallographic Overview" by J.D. Cotton, L.P. Clark, and H.R. Phelps
Although titanium castings have been used in aerospace structures for decades, those uses have largely been in secondary applications. Expanding the use of titanium castings in critical applications would be encouraged by a better understanding of investment casting defects in titanium alloy systems. This paper describes several types of casting-related defects that are identified as potentially affecting the design life of a structure: inclusions, voids, and weld repair defects. [READ]

JUNE JOM: "The Basics of Modern Semi-Solid Metal Processing" by Frank Czerwinski
In the search for a single-step manufacturing process for components with various shapes, sound structural integrity, and properties comparable to the wrought state at a low cost similar to casting, semi-solid processing may provide the solution. Although semi-solid processing is already a viable manufacturing method, it is still under intensive development and a critical breakthrough is still expected. This article provides the characteristics of semi-solid processing, including historical and technical backgrounds, major concepts, and commercialization examples. [READ]

JUNE JOM: "Flash-Assist RTP for Ultra-Shallow Junctions" by D.M. Camm, J.C. Gelpey, T. Thrum, G.C. Stuart, and S. McCoy
This paper discusses the engineering of ultra-shallow junctions for advanced semiconductors using an annealing technique called Flash-Assist RTP™ (fRTP). This technique offers effective process times in 1–10 ms. A discussion on the evolution of rapid thermal processing (RTP) based on the thermal response time of the heat source and wafer is presented. Technical innovations required for fRTP are discussed including why an extremely powerful flash lamp is essential for this application. It is shown that a process engineer can more or less independently control diffusion and activation over a wide range, enabling the formation of junctions meeting future requirements of semiconductor manufacturers. [READ]

JUNE METALLURGICAL AND MATERIALS TRANSACTIONS A: "Metallurgical and Materials Transactions A" by Various Authors
The June issue of Metallurgical and Materials Transactions A (MMTA) has 12 papers that were presented at the Hillert Symposium, which was held at the Royal Institute of Technology in Stockholm to celebrate Professor Hillert's 80th birthday. The topic was "Thermodynamics and Kinetics of Migrating Interfaces in Steels and Other Complex Alloys." A paper on the topic of the Two Phase Equilibrium of Individual nanoparticles by Schamp and Jesser is one of the three papers on transformations. This editor thinks it is important that papers on nanoparticles be published in established journals like MMTA and not only in specialized journals. This enables the general readership of our journal to learn about the field of nano-science and also to contribute their understanding to the new (but also old) field of nano-science. Other papers in the fields of mechanical behavior, surface treatment, solidification, materials processing, composite materials, and light metals are also in this 330-page issue. [READ]

Programs, on-line registration, and more:

2006 ELECTRONIC MATERIALS CONF.
University Park, PA
June 28–30, 2006

THERMEC 2006
Vancouver, Canada
July 4–8, 2006

2006 SOHN INT'L SYMPOSIUM
Early Registration Deadline: Aug. 7, 2006
San Diego, CA
Aug. 27–31, 2006

6th EURO. CONF. ON SILICON CARBIDE AND RELATED MTL'S
Newcastle, UK
Sept. 3–7, 2006

COMMERCIALIZATION OF NANOMATERIALS 2006
Early Registration Deadline: Aug. 28, 2006
Pittsburgh, PA
Sept. 18–20, 2006

COM 2006: CONFERENCE OF METALLURGISTS
Montréal, Canada
October 1–4, 2006

THIRD INT'L SYMPOSIUM ON IRON CONTROL IN HYDROMETALLURGY
Montréal, Canada
October 1–4, 2006

INT'L SYMPOSIUM ON MAGNESIUM TECHNOLOGY IN THE GLOBAL AGE
Montréal, Canada
October 1–4, 2006

INT'l CONF. ON INNOVATIVE SOLUTIONS FOR THE ADVANCEMENT OF THE TRANSPORT INDUSTRY
San Sebastian, Spain
October 4–6, 2006

MS&T '06
Early Registration Deadline: Sept. 25, 2006
Cincinnati, OH
Oct. 15–19, 2006

INT'L CONF. ON ADVANCES IN MECHANICAL ENGINEERING
Fatehgarh Sahib, India
Dec. 1–3, 2006

2007 TMS ANNUAL MEETING
Abstracts Due: Jul. 15, 2006
Orlando, FL
Feb. 25–Mar. 1, 2007

11th WORLD CONF. ON TITANIUM
Abstracts Due: Aug. 10, 2006
Kyoto, Japan
June 3–7, 2007

EUROPEAN METALLURGICAL CONF. 2007
Abstracts Due: Jul. 31, 2006
Dusseldorf, Germany
June 11–14, 2007

4th INT'L VERY HIGH CYCLE FATIGUE CONF.
Abstracts Due: Oct. 2, 2006
Ann Arbor, MI
Aug. 19–22, 2007

COPPER 2007
Toronto, Canada
Aug. 25–30, 2007

MS&T '07
Detroit, MI
Sept. 16–20, 2007

PRICM 6
Abstracts Due: Jan. 15, 2007
Jeju Island, Korea
Nov. 6–9, 2007

2008 TMS ANNUAL MEETING
New Orleans, LA
Mar. 9–13, 2008

SUPERALLOYS 2008
Champion, PA
Sept. 14–18, 2008

REWAS 2008
Cancun, Mexico
Oct. 12–15, 2008

NEWSWIRES