TABLE OF CONTENTS

INTRODUCING MATERIALS TECHNOLOGY@TMS . . .
. . . An On-Line Community for Networking, Sharing Knowledge, and Exchanging Resources

HOW TO . . .
. . . Contribute to Materials Technology@TMS

FROM OUR SPONSOR: KEYENCE
The Fusion of Digital Technology and Microscopy

TMS MEMBERS RECEIVE ACCESS TO NEW TECHNICAL JOURNALS . . .
. . . Through Partnership with Springer

LAST-MINUTE PLANNERS WELCOME!
On-Site Registration for TMS 2007 and Continuing Education Courses Opens this Weekend

TOP TEN . . .
. . . Things to Do at the TMS 2007 Annual Meeting & Exhibition

STAY UP TO DATE WITH TODAY . . .
. . . the Newsletter of the TMS 2007 Annual Meeting

FROM OUR SPONSOR: EDAX-TSL INTRODUCES THE NEW HIKARI EBSD DETECTOR FOR HIGH-SPEED ACCURATE EBSD DATA COLLECTION
Hikari: Electron Backscatter Diffraction at 200 Indexed Patterns per Second for Scanning Electron Microscopy

TMS PARTNERS WITH FEMS ON EUROMAT 2007
Abstracts Still Being Accepted for September Conference

WASHINGTON NEWS FROM THE FEDERATION OF MATERIALS SOCIETIES
A Flurry of R&D Budget Activity

. . . An On-Line Community for Networking, Sharing Knowledge, and Exchanging Resources

As the TMS 2007 Annual Meeting is about to begin, the society today unveils a web-based interface that will provide many of the benefits of the annual meeting year round to members around the world. Materials Technology@TMS provides an on-line community where materials science and engineering professionals can gather to exchange knowledge, discuss technical issues, share resources, and network with peers.

The site is divided into six inaugural technology areas:

• Education
• Integrated Computational Materials Engineering
• Lead-Free Solders
• Magnesium
• Materials for Nuclear Power
• Superalloys

. . . Contribute to Materials Technology@TMS

There are many ways to contribute to the technical exchange taking place on the Materials Technology@TMS web site. You can, for example, submit a resource to the digital resource center; post comments, discussion topics, or questions to the discussion board; or submit information on an upcoming conference.

To submit a resource, first log in to the Materials Technology@TMS web site. TMS members can use the username and password they typically use to log in to other TMS sites, such as the TMS Document Center or the Members-Only web site. Nonmembers can create a registration (at no charge) for the site, which will allow them to log in on future visits.

To submit a link, a digital resource, or other item to the site, go to "Submit a Resource" under the User Tools menu. This page will provide further instructions and requirements for submitting a site resource.

To participate in the discussion board, select one of the six technical communities. From the home page of that community, click on the "Discussion Board" button in the upper right corner of the screen. Then chat away with new friends and colleagues from throughout the world.

For each community, a moderator monitors the content being posted on the site to determine that all the information that appears on the Materials Technology@TMS site is useful and appropriate for the materials science and engineering community.

The Fusion of Digital Technology and Microscopy

The Keyence VHX-500 advanced Digital Microscope incorporates a host of technological innovations. With a depth-of-field 20x greater than conventional microscopes and 3-D Image Composition, VHX-500 imaging performance positions it with high-end optical systems. Additional features include Halation Correction for glare elimination, a pushbutton console, real-time/on-screen measurements and 3-D Surface Profiling with color topographic displays. The system's 18 mega-pixel CCD camera can be handheld for large target observation. Details and specs.

. . . Through Partnership with Springer

Access to technical journals, discounts on publications, links to reference citations, and early on-line availability of articles are some of the benefits that TMS members can expect in 2007, as a result of TMS's new partnership with science and technology publisher Springer.

Springer is now managing subscriptions—but not content—for the TMS journals, JOM, Journal of Electronic Materials, and Metallurgical and Materials Transactions A and B. For TMS members, this agreement comes with a number of benefits, including access to other Springer journals related to materials science and engineering and discounted rates on Springer publications. All journal subscribers will notice a number of new benefits, such as the ability to easily link to citations for resources cited in the text of journal articles and to receive early access to articles through Springer's On-Line First service, which publishes articles on-line as soon as they are ready for publication in TMS archival journals.

Although JOM will be available in electronic format through the Springer site, the page-turning version of the magazine will still be viewed through the JOM web site.

On-Site Registration for TMS 2007 and Continuing Education Courses Opens this Weekend

More than 3,000 materials scientists and engineers have already signed up for the TMS 2007 Annual Meeting in Orlando, Florida, promising to make this one of the biggest meetings in the society's history. It's not too late to join. On-site registration for the conference opens at 11 a.m. on Sunday, February 25, the official start of the TMS 2007 Annual Meeting. To register, go to Atlantic Hall C in the Walt Disney World Dolphin hotel. Registration is open daily from Sunday to Thursday morning.

This year's conference also offers six continuing education courses in conjunction with the meeting. With the exception of the Furnace Systems Technology Workshop, which is sold out, openings are still available for all the meeting short courses, workshops, and tutorials. Attendees can register at the continuing education registration desk from 7:30–8:30 on Saturday and Sunday mornings.

See you in Orlando.

. . . Things to Do at the TMS 2007 Annual Meeting & Exhibition

This year, as TMS celebrates 50 years as a member society of the American Institute of Mining, Metallurgical and Petroleum Engineers, the TMS Annual Meeting travels to one of its most popular (and most fun) destinations: Disney World. In honor of the occasion, some particularly interesting (and fun) activities are planned for this year's meeting. Here are ten suggestions to make the most of this momentous meeting:

10. Make a Schedule: With the sheer number of papers being presented at the TMS 2007 Annual Meeting (more than 2,300 at last count), having a game plan will be helpful. TMS has an on-line personal conference scheduler (link below) to help you do just that.

9. Check out the Hammocks: Getting to all those presentations may tire you out, so between sessions, stop for a nap on the hammocks by the pool at the Swan and Dolphin hotel.

8. Cheer on the Students: On Sunday, teams of students will face off at the first annual Materials Bowl, answering materials science and engineering questions in pursuit of the grand prize: $2,500.

7. Join a Technical Committee: More than 30 TMS technical committees will be holding meetings in Orlando. All conference attendees are invited to join and contribute their ideas for the future of the society. See the at-meeting program for a list of committees, times, and locations.

6. Walk to Epcot: This playground for the scientific mind is just around the bend from the Swan & Dolphin hotel.

5. Say Farewell: If you see Alexander Scott, wish him well. After more than 35 years with TMS—most of them as executive director—Scott will retire after this year's annual meeting.

4. Review the Past 50 Years in Materials: Start each day with some of the most prestigious professionals in MSE, who will present overviews on the past, present, and future of the field during a series of 8 a.m. plenary sessions. (Note: There's free breakfast and no conflicting programming.)

3. Visit the exhibit hall: It's a full house this year, with 214 exhibit booths representing 152 companies from more than 20 countries exhibiting products and services from around the world.

2. More specifically, Visit the JOM Booth: Those prominent speakers from the plenary sessions will make guest appearances at the booth each day around lunch time. And you can test out the new Materials Technology@TMS site (if you haven't already).

1. Count Down the Top Ten Material Moments: What better way to end a top ten list than with a top ten list? At the Monday morning plenary breakfast session, TMS will count down the ten greatest moments in materials science and engineering history, as determined by voters. If you're at the session, you'll hear it first.

. . . the Newsletter of the TMS 2007 Annual Meeting

The TMS 2007 Annual Meeting begins Sunday, and you can stay up to date on all the latest news—at the meeting or from home. The Today: TMS 2007 newsletter will report on meeting activities, such as the countdown of the top ten Material Moments at the Monday morning plenary presentation and the winners of the first annual student Materials Bowl on Sunday. It will also report on decisions made at the conference and provide key meeting statistics.

Today will be distributed daily to meeting attendees, but it will also be posted on the TMS meeting website, which will be accessible through TMS OnLine for the duration of the conference. Check in daily for the latest updates and stay up-to-date with important news from TMS 2007.

Hikari: Electron Backscatter Diffraction at 200 Indexed Patterns per Second for Scanning Electron Microscopy

The Hikari high-speed detector provides the fastest EBSD pattern collection rate available with a high degree of sensitivity. The Hikari performs EBSD scans at 200 indexed points per second (pps) at indexing success rates of greater than 99%. The numerous applications for Hikari include analysis of all crystal structures and crystalline materials and minerals. Coupled with the powerful functionality of Orientation Imaging Microscopy (OIM), Hikari is an asset for microstructural analysis in both industrial and research lab environments.

EBSD detector controls are embedded within the OIM Data Collection software, providing a high degree of usability for novice analysts and offering the power and flexibility desired by advanced users. The Hikari is yet another example of EDAX technology that provides Results with Confidence.

For more information on Hikari and other EDAX products contact us at 201-529-4880 or via E-mail at info.edax@ametek.com. Please visit our website.

Abstracts Still Being Accepted for September Conference

This fall, TMS will partner with the Federation of European Materials Societies (FEMS) to present programming at the FEMS Euromat 2007 conference, to be held September 10–13 in Nürnberg, Germany. This collaboration is one of many recent partnerships between TMS and international materials societies.

With FEMS, TMS is developing programming on the following topics:

• Materials for Extreme Environments
• Advanced Metallic Materials
• Microstructural Characterization Techniques
• Mechanical Testing and Mechanical Characterization
• Materials Modeling on all Length Scales
• Materials for Aerospace Applications

A Flurry of R&D Budget Activity

In the space of two weeks culminating on February 15, Congress received U.S. President George W. Bush's proposed fiscal year (FY) 2008 budget, the House Science Committee held a flurry of hearings, and both the House and Senate passed a modified continuing resolution providing funding for the federal government through the rest of the current fiscal year. The rather dizzying spate of action on the whole bodes better than expected for the science and engineering community, although much remains to be done.

On the positive side, the continuing resolution provides increases for the components of the American Competitiveness Initiative (ACI)—the National Science Foundation (NSF), the Office of Science in the Department of Energy, and the laboratory programs of the National Institute of Standards and Technology (NIST)—but only about half of what the administration had requested for FY 2007 as the beginning of budget doubling for those agencies. The ACI agencies also fared well in the administration's proposed FY 2008 budget—up a combined 7.2% over the FY 2007 request—but funding for the rest of the federal R&D portfolio continues a downward trend in terms of real dollars. In a series of hearings before the House Science Committee, Democrats and Republicans expressed both support for and frustration over the president's proposals. Committee Chair Bart Gordon (D-TN) said that while the proposed budget "includes some important funding increases, it lacks the priorities and consistency to ensure our competitiveness now and in the long run." Committee members were especially critical of the administration's continuing preference for Department of Education over NSF programs for K–12 math and science education, elimination of NIST's Advanced Technology Program, and flat funding for the NIST Manufacturing Extension Partnerships.

ABOUT e-NEWS

TMS e-News is a monthly e-mailed newsletter that provides information on The Minerals, Metals & Materials Society's membership, meetings, publications, and other activities of interest.

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News Editor:
Kelly Roncone

EDITORS' CHOICE

The editors of TMS publications select the must-read papers from the latest editions:

MATERIALS TECHNOLOGY@TMS: " Materials Technology@TMS: Your Education Resource " by Cathy Rohrer
The education community on the Materials Technology@TMS web site offers a forum for materials science and engineering educators to share resources and ideas, including books, course notes, classroom exercises, tutorials, videos, and web resources. In this article, Cathy Rohrer, the moderator for the education community, introduces users to the possibilities of this new on-line resource for materials science and engineering educators. [READ]

MATERIALS TECHNOLOGY@TMS: " ICME Community on Materials Technology@TMS " by Cathy Rohrer and Todd Osman
The Integrated Computational Materials Engineering (ICME) community at Materials Technology@TMS provides a forum for individuals interested in ICME to network, share ideas, and develop the use of integrated computational methods within the academic and industrial materials communities. In this article, Materials Technology@TMS moderators Cathy Rohrer and Todd Osman introduce visitors to the possibilities of this new, interactive web site where members of the ICME community can share software, databases, literature, case studies, and ideas. [READ]

MATERIALS TECHNOLOGY@TMS: " Lead-Free Solders " by Todd M. Osman
As the use of lead-free solders becomes increasingly important, the materials technology behind these solders becomes more and more in demand. This article, by site moderator Todd M. Osman, provides an overview of the technology and an introduction to the lead-free solders community at Materials Technology@TMS, which focuses on the metallurgy of lead-free solders and the underlying material principles for new alloy development and application. Through this site, researchers, manufacturers, and end users can develop and share materials knowledge. [READ]

MATERIALS TECHNOLOGY@TMS: " The Magnesium Community on Materials Technology@TMS " by Lynne Karabin
This article, by site moderator Lynne Karabin, provides an overview of magnesium and its uses and an introduction to the magnesium community on Materials Technology@TMS. The article presents some information on the site's initial content, which includes basic metallurgy, processing, alloys, and physical and mechanical behavior, and provides visitors with a guide to the site's basic benefits, as well as its future possibilities. [READ]

MATERIALS TECHNOLOGY@TMS: " Nuclear Power and Materials Technology@TMS " by Todd M. Osman
Rising energy costs and global warming concerns have sparked increased interest in global energy strategies. In this article, site moderator Todd M. Osman looks at future directions for nuclear energy and the associated materials challenges. This article provides an overview of how the materials for nuclear power community within the Materials Technology@TMS web site can provide users with background information, discussion forums, and resources to stay up-to-date in this technology area. [READ]

MATERIALS TECHNOLOGY@TMS: " Superalloys: Materials Technology@TMS " by Todd M. Osman
TMS has always been a central resource for information on superalloys technology. In this article, Todd M. Osman, moderator for the superalloys community at Materials Technology@TMS, provides an overview of superalloys technology and an introduction to the resources available on the site and the possibilities for future knowledge sharing through Materials Technology@TMS. [READ]

FEBRUARY JOM: " Yesterday, Today, and Tomorrow " by Various Authors
In February, JOM presents a series of seven articles looking at the past, present, and future of the materials science and engineering profession. Following a look at the evolution of the materials science profession and professional over the past 50 years, the papers go on to cover the evolution of technology for each of the five broad technical areas encompassed by TMS: extraction and processing, light metals, structural materials, materials processing, and electronic materials. The series ends with a look to the future of materials science and engineering. Shorter presentations based on these articles, by Julia Weertman, Michael G. King, James W. Evans, Jeffrey Wadsworth, Alan I. Taub, et al., R. Stanley Williams, and Diran Apelian, will be presented during the plenary breakfast series at the TMS 2007 Annual Meeting. [READ]

JANUARY JOURNAL OF ELECTRONIC MATERIALS: " Strength of Soldered Joints Formed under Microgravity Conditions " by B. Thomas, A. Atkinson, and R.J. Dashwood
Experiments have been carried out to compare the mechanical strength of joints soldered with Sn-Ag-Cu under different gravitational conditions. Joints soldered under microgravity (produced during a parabolic flight) have lower strength (by 32% in this case) than similar joints formed under normal gravity. Electron microscopy has shown that this is due to a larger volume of residual porosity (14%) in the joints formed in microgravity compared with <1% for joints formed in normal gravity. The residual porosity in joints formed in microgravity is mainly within the bulk of the solder, with some microporosity in the Cu₆Sn₅ intermetallic layer near the copper interfaces. The porosity not only weakens the joint, but also biases the failure path away from the intermetallic layer and into the bulk of the solder. These observations show that gravitational buoyancy is important for the expulsion of flux and flux residues from soldered joints. [READ]

Programs, on-line registration, and more:

Processing Materials for Properties-III (PMP-III)
Bangkok, Thailand
December 7-10, 2008

2nd International Conference on Thermomechanical Simulations and Processing of Steel (SimPro'08)
Ranchi, India
December 9-11, 2008

TMS 2009 Annual Meeting
San Francisco, California
February 15-19, 2009

5th International Materials Symposium (MATERIAiS 2009)
Lisbon, Portugal
April 5-8, 2009

Offshore Technology Conference 2009
Houston, Texas
May 4-7, 2009

International Deep Drawing Research Group Conference 2009 (IDDRG 2009)
Golden, Colorado
June 1-3, 2009

Electronic Materials Conference (EMC 2009)
University Park, Pennsylvania
June 24-26, 2009

European Metallurgical Conference 2009 (EMC2009)
Innsbruck, Austria
June 28 - July 1, 2009

Engineering Solutions for Sustainability: Materials and Resources, An International Workshop
Lausanne, Switzerland
July 22-24, 2009

14th International Conference on Environmental Degradation in Nuclear Power Systems
Virginia Beach, Virginia
August 23-27, 2009

Conference of Metallurgists (COM 2009) Nickel-Cobalt 2009
Sudbury, Ontario, Canada
August 23-26, 2009

Thermec 2009: Sixth International Conference on Advanced Materials and Processes
Berlin, Germany
August 25-29, 2009

Defect Recognition Image Processing (DRIP) XIII
Abstracts due: 3/15/2009
Wheeling, West Virginia
September 13-17, 2009

2009 International Symposium on Liquid Metal Processing and Casting
Abstracts due: 1/15/2009
Sante Fe, New Mexico
September 20-23, 2009

5th International Conference on Science and Technology of Ironmaking (ICSTI'09)
Shanghai, China
October 19-22, 2009

Materials Science & Technology 2009 Conference and Exhibition (MS&T'09)
Pittsburgh, Pennsylvania
October 25-29, 2009

TRANSFAC '09 - International Conference on Innovative Solutions for the Advancement of the Transport Industry
Detroit, Michigan
October 31 - November 3, 2009

TMS 2010 Annual Meeting
Seattle, Washington
February 14-18, 2010

Copper 2010
Hamburg, Germany
June 6-10, 2010

Electronic Materials Conference 2010
Notre Dame, Indiana
June 23-26, 2010

Materials Science & Technlogy 2010 Conference and Exhibition (MS&T'10)
Houston, Texas
October 17-21, 2010

Superalloys 2012: Twenfth International Symposium on Superalloys
Champion, Pennsylvania
September 9-13, 2012

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