TABLE OF CONTENTS

ABSTRACT DEADLINE EXTENDED . . .
. . . to July 31 for TMS 2008 Annual Meeting

TMS MEMBERS HELP THE HISTORY CHANNEL CREATE MODERN MARVELS
New Documentary on Aluminum Airs Wednesday Night in the U.S.

FROM OUR SPONSOR: KEYENCE
Everything You'd Like to Know about Digital Microscopy

COMMERCIALIZATION OF NANOMATERIALS CONFERENCE . . .
. . . Announces Keynote Speakers from Government and Industry

TMS PLANS TWO NEW WEBINARS . . .
. . . on Environmental Impact of Electronics and Progress in Lead-Free Solders

WHAT'S NEW AT MATERIALS TECHNOLOGY@TMS:
A Look at the Lead-Free Solders Community

HOW TO . . .
. . . Access Your On-Line TMS Journal Subscriptions through Springer

MEMBERSHIP PAGE GETS AN UPDATE . . .
. . . Making it Easier than Ever to Invite a Colleague to Join

FROM OUR SPONSOR: DHL
TMS Members Receive Discounted Rates on DHL Shipping

NITRIDE SEMICONDUCTOR CONFERENCE GOES TO LAS VEGAS
Nearly 700 Presentations Are Planned for September Conference

LOCAL CHAPTER PLANS AUGUST SYMPOSIUM . . .
. . . on Computational Materials Design

PRECIOUS METALS PROCESSING SYMPOSIUM . . .
. . . Announces Key Speakers for October Meeting

WASHINGTON NEWS FROM THE FEDERATION OF MATERIALS SOCIETIES
Appropriations Face Veto Threats; NSF to Fund "Materials World Network"

. . . to July 31 for TMS 2008 Annual Meeting

TMS has extended the deadline to submit an abstract for the TMS 2008 Annual Meeting to July 31. The 2008 conference, which will be held March 9–13 in New Orleans, Louisiana, is now accepting abstracts for more than 50 symposia in the areas of light metals; extraction, processing, structure, and properties; and emerging materials.

In addition, for 2008 TMS is planning several all-invited symposia for a new programming track: Materials and Society 2008: Global Energy, Environment, and Infrastructure. This programming will look at materials developments necessary to meet societal needs in a number of areas, such as clean energy, infrastructure, and professional development. With planned participation from international partner materials societies, this programming is expected to draw a large and diverse crowd of materials scientists and engineers from throughout the world to the TMS 2008 Annual Meeting.

To view a complete listing of planned symposia and to submit an abstract, click on the link to CMS-Plus, the on-line TMS conference and proceedings management system.

New Documentary on Aluminum Airs Wednesday Night in the U.S.

On Wednesday night in the United States, the History Channel will air the newest installment of its Modern Marvels documentary series. This episode, which will focus on aluminum, may just feature some familiar faces from the TMS membership.

The Modern Marvels camera crew spent a day in the laboratories of the Metal Processing Institute (MPI) of the Worcester Polytechnic Institute, interviewing MPI's director (and 2007 TMS vice president) Diran Apelian and filming at the facilities of MPI's Advanced Casting Research Center, which conducts basic and developmental research on aluminum and light metals. (Pictured is Apelian explaining a demonstration of aluminum's low melting point during filming of the Modern Marvels program.)

Though no one, except the folks at Modern Marvels, knows for sure what content will make it into the final episode, this episode should still prove interesting to TMS members with an interest in aluminum. The hour-long program will look at the discovery of aluminum, the properties of this metal, and its many uses.

Everything You'd Like to Know about Digital Microscopy

This comprehensive 36-page illustrated digital microscopy guide contains in-depth information on microscope setup, imaging and measurement. Includes details on illumination methods and effects, lens types and light principles, zoom lenses, depth-of-field and digital focusing techniques. Learn about digital image processing and how you can use it to improve images, how to utilize a digital microscope on a network, network applications, communications software and more. Quick download.

. . . Announces Keynote Speakers from Government and Industry

Speakers from industry, government, finance, and the global nanomaterials community are scheduled to present featured addresses at Commercialization of NanoMaterials 2007, a forum for the discussion of high-volume production of nanomaterials products. The following keynote presenters are scheduled to speak at the conference, which will be held November 11–13 in Pittsburgh, Pennsylvania:

• E. Clayton Teague, director of the Federal National Nanotechnology Coordination Office, will discuss the National Nanotechnology Initiative in the United States.
• Scott Livingston, managing director of Axiom Capital Management Inc., will discuss Wall Street, investing, and nanomaterials.
• Andy Hannah, president and chief executive officer of Plextronics Inc., will look at successful nanotechnology startups.
• Mike Doyle, a member of the U.S. Congress from Pennsylvania, will provide an overview of Congressional perspectives on the subject.

. . . on Environmental Impact of Electronics and Progress in Lead-Free Solders

Historically, performance and cost considerations have been the key concerns in materials selection for consumer products, but what if we could elevate environmental considerations to the same level as performance and cost? And if consumers have to spend more for environment-friendly products, how much will they be willing to support this shift? In September, researchers will discuss these questions in Materials Science and Policy for Environmentally Benign Electronics, a new webinar from TMS.

The webinar features three presentations that grew from an article in the July issue of JOM, "Public Health and Environmental Benefits of Adopting Lead-Free Solders" by Oladele A. Ogunseitan, a professor of public health and social ecology and director of the Industrial Ecology Research Group at the University of California. Ogunseitan organized the webinar, which features the following presentations:

• "Challenges in Innovation toward Environmentally Sustainable Materials," by Johnny Lincoln and Andrew Shapiro
• "Materials Recycling and Reuse: Gauging Consumer Preferences and Deploying Appropriate Incentives and Legislation," by Jean-Daniel Saphores and Julie Schoenung
• "Science and Policy Issues in Environmental and Public Health Accounting through Material Life Cycles," by Oladele Ogunseitan and Tak Hur

A Look at the Lead-Free Solders Community

The lead-free solders community, one of six technical communities on the Materials Technology@TMS web site, contains a number of valuable digital resources. Recently, a Moderator's Choice column has been added to the site to help direct users to some of the site's top resources, as selected by lead-free solders community moderator Todd Osman. Visitors to the site can use the Moderator's Choice column as a guide to some of the site's top offerings and can then explore the Digital Resources Center section of the site for additional resources.

Osman's current recommendations include two Knowledge Packets, which are compilations of key resources on particular lead-free solders topics that include JOM articles, presentations from TMS Annual Meetings, and useful weblinks. The two packets look at the topics of Physical Metallurgy of Solders and Solder Interfaces and Thermomechanical Fatigue of Solders.

Another key resource recently added to the site are presentations from the 2007 State of the Art Lead-Free Technology Workshop, an yearly workshop held at TMS Annual Meetings. The lead-free community provides TMS members with access to previous editions of this workshop, as well, but the 2007 presentations are the first to include audio to accompany the slides presented at the workshop.

In the coming months, the site will build on recent Annual Meeting and JOM coverage of lead-free solders. Future highlights will include webinars on sustainability and technical progress. Additionally, plans are underway to develop a series of webcasts highlighting the development and application of lead-free solder technologies.

. . . Access Your On-Line TMS Journal Subscriptions through Springer

TMS has partnered with Springer Business and Science Media to present on-line PDF versions of its journals—Metallurgical and Materials Transactions A and B, the Journal of Electronic Materials, and JOM.

All the information needed to access journal subscriptions through Springer can be found at the TMS Members-Only web site. To access electronic subscriptions to TMS journals, members should begin by logging in to the Members-Only web site. From there, clicking on the option "Read Journals" from the menu on the left side of the page will bring members to the TMS Journal Gateway, a page with more information on the new service from Springer that provides links to accessing on-line subscriptions.

A key benefit to this new partnership with Springer is that subscribers to archival journals receive access to additional Springer journals related to their areas of interest. For example, Journal of Electronic Materials subscribers are able to access 14 additional journals, while Metallurgical and Materials Transactions subscribers have access to 12 additional materials science and engineering journals.

While the TMS member journal, JOM, can be viewed through the Springer site, TMS will continue to publish this journal in digital, "page-turning" format, as well. Both reading options can be accessed through the TMS Members-Only web site.

. . . Making it Easier than Ever to Invite a Colleague to Join

Preparing for another round of dues renewals in the fall, TMS has revised its membership home page to provide members and potential members with a concise overview of the services that TMS offers at various levels of membership.

When visiting the new site, check out the "Invite a Colleague to Join" portion of the site, which allows current members to easily alert a colleague to the benefits of TMS membership. If that colleague decides to become a member of TMS as a result, the referring member will receive a $20 discount on their 2008 membership dues. If the new colleague chooses to join on-line, he or she will receive instant access to the benefits of TMS membership.

For 2008, all members will have access to the new member benefits introduced throughout the year in 2007, including access to all the resources on the Materials Technology@TMS web sites and to journal subscriptions through Springer. For TMS members who subscribe to archival journals, this partnership means access to additional technical journals. See the "How To" article in this issue of TMS e-News for more information.

TMS Members Receive Discounted Rates on DHL Shipping

TMS members can save up to 25% on DHL's full suite of shipping services, including DHL Next Day, DHL 2nd Day, DHL Ground, and international delivery services.

As a special offer, TMS members who open a new DHL account today will receive a $25 DHL Savings Certificate* after you send three shipments with your new account.

Call 1-800-MEMBERS (1-800-636-2377, 8am-7pm EST) today to speak with a dedicated Member Service Representative or visit www.1800members.com/tms to set up your free account.

*$25 savings certificate offer is subject to terms and conditions. All services may not be available in all areas and are subject to DHL Terms and Conditions as published at www.dhl-usa.com. Please consult www.dhl-usa.com for service availability.

Nearly 700 Presentations Are Planned for September Conference

In September, TMS will host the 7th International Conference of Nitride Semiconductors (ICNS-7), a specialty conference that will cover all aspects of Group-III Nitride Semiconductors. As of now, nearly 700 presentations, in the form of both oral presentations and poster displays, are planned for the conference, which will be held at the MGM Grand Hotel in Las Vegas, Nevada, September 16–21.

Registration for this conference is now open. Attendees who register by August 27 will receive a $100 discount off the regular registration rate; each full conference registrant will receive a copy of the conference proceedings on CD-ROM.

The preliminary technical program can be viewed now through the conference web site. Late news submissions will be accepted through August 31 at CMS-Plus, the on-line abstract management system. The ICNS conference series has been running since 1995, with the most recent conference held in Bremen, Germany, in 2005.

. . . on Computational Materials Design

On August 20–21, the Eastern New York chapters of TMS and ASM International will co-sponsor the symposium Computational Materials Design in Niskayuna, New York. GE Global Research will host the event, where a series of invited speakers from industry, universities, and national laboratories will offer presentations on:

• Fundamentals of Computational Materials Design
• Materials Design—From Theory to Practice
• Materials Chemistry—Microstructure Design
• Material Properties—Performance Design

. . . Announces Key Speakers for October Meeting

In October, TMS will partner with the Society for Mining, Metallurgy and Exploration (SME) and the International Precious Metals Institute (IPMI) to present the symposium Precious Metals Processing: Advances in Primary and Secondary Operations. The symposium will run from October 3–6 in Tucson, Arizona. Three plenary speakers and two luncheon speakers have been lined up for the occasion. The plenary session will feature the following presentations:

• "Montana: Mining the Treasure State: A Prospective on Future Growth" by Debra Shea, Montana Mining Association
• "You Want it When?" by James Komadina, Gold Fields
• "Mercury Issues in Gold Mining" by John Mudge, Newmont Mining Corporation
• "A Brief Overview of Secondary Precious Metals Recovery and Refining" by Robert Jacobsen, Sabin Metals

Appropriations Face Veto Threats; NSF to Fund "Materials World Network"

Appropriations In Excess of Administration Request Face Veto Threats

Congress is moving toward final passage of appropriations bills for the U.S. Department of Energy, National Science Foundation, and National Institute of Standards and Technology that exceed the administration's request for funding for R&D programs included in the President's American Competitiveness Initiative (ACI). Those funding levels, along with other increases in the larger appropriations bills that include these programs, are likely to trigger vetoes when they reach the President's desk, probably in September. The administration is, however, signaling willingness to sign legislation that would reflect the increases in funding requested in the ACI. White House officials suggest that the science and technology community should be urging senators and representatives to accept the ACI figures "post-veto."

NSF to Fund "Materials World Network"

The U.S. National Science Foundation (NSF) has issued a solicitation for a program to foster collaboration in materials and condensed matter research between investigators in the United States and their counterparts abroad. It includes joint activities between NSF and funding organizations in Africa, Asia, Europe, and other regions. The NSF will accept proposals from U.S. universities and colleges for collaboration on projects having clear relevance to fundamental materials and condensed matter research supported by the NSF Division of Materials Research. Consideration also will be given to support of activities such as workshops, meetings, brief personnel exchanges, etc. Priority will be given to proposals that build upon and expand current cyber infrastructure capabilities, such as remote use of instrumentation, database creation and use, visualization and virtual experimentation, virtual networking, etc., to enhance and advance the international collaboration.

ABOUT e-NEWS

TMS e-News is a monthly e-mailed newsletter that provides information on The Minerals, Metals & Materials Society's membership, meetings, publications, and other activities of interest.

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News Editor:
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EDITORS' CHOICE

The editors of TMS publications select the must-read papers from the latest editions:

July JOM: " Public Health and Environmental Benefits of Adopting Lead-Free Solders " by Oladele A. Ogunseitan
After more than 7,000 years of wide-spread use, lead is figuratively sinking in contemporary industrial ecology and global societal commerce. But, despite the long research history of documenting the detrimental impacts of lead use and of legislative initiatives to phase lead out of various products and processes, the United States currently has no federal mandate comparable to the European Union's "restriction of the use of certain hazardous substances in electrical and electronic equipment" banning the sale of new electrical and electronic equipment containing specified levels of six major toxic materials, including lead. Without a strong environmental agenda leaning toward preventive strategies, concerns about demonstrated public health effects often prove to be strong motivators of U.S. materials use policy. This article assesses various ways in which universal adoption of lead-free solders, coupled with additional material restrictions, may have tangible benefits for public health and the environment, and how these benefits may help secure true innovation in material selection and product design for the environment. [READ]

July JOM: " The Development of the COST 531 Lead-Free Solders Thermodynamic Database " by A. Kroupa, A.T. Dinsdale, A. Watson, J. Vrestal, J. Vizdal, and A. Zemanova
The methods for modeling the thermodynamic properties of multicomponent systems are described in this article. The rules for creating a consistent database for muticomponent systems are described in general terms and documented in relation to the thermodynamic database for lead-free solders, developed within the scope of European Cooperation in the Field of Scientific and Technical Research Action 531. New assessments and reassessments of the Bi-Sn-Zn, Cu-Ni-Sn, and Ag-Cu-Sn systems are shown as examples illustrating the application of the database for the modeling of lead-free solder materials. [READ]

July JOM: " Measurements of Experimentally Grown 3-D Xenon Multiplets and Comparative Phase-Field Simulations " by H.M. Singer, I. Singer, and J.H. Bilgram
Experimentally observed growth morphologies (dendrites, doublons, and seaweed) of three-dimensional (3-D) xenon crystals during free growth into pure supercooled melt were investigated in this study. Measurements of the 3-D reconstruction of dendrites were compared to analytical predictions and scaling parameters were determined. For two different phase-field models morphology diagrams were derived and compared to analytical model calculations. By using special initial conditions it is possible to reproduce the growth morphologies found in these experiments. [READ]

Materials Technology@TMS: Education: " A Memo to the Budding Professor " by Priyadarshan Manohar
While you were studying . . . Professor Priyadarshan Manohar addresses professors whose own academic studies took place in a dramatically different learning environment than the ones in which they now find themselves teaching. This spotlight article, which takes the form of a personal memo to professors, offers advice—and understanding—on engaging students using the newest available tools. [READ]

Materials Technology@TMS: Integrated Computational Materials Engineering: " Two New Webcasts Provide ICME Education Tools " by Kelly Roncone Zappas
This month, two new webcasts have been made available from TMS in the area of Integrated Computational Materials Engineering (ICME), with a third planned for release later this summer. "CyberDesign & Infrastructure for Multiscale Modeling and Simulations" and "Integrating Forward Simulation and Inverse Design of Materials" are the two newest webcasts from TMS, presented by experts in the field from Mississippi State University and the Pennsylvania State University. Next month, a third presentation is planned on materials informatics. [READ]

Materials Technology@TMS: Lead-Free Solders: " Lead-Free Solders: Reliability and Other Issues a Year after the Legislation " by Srinivas Chada
This article provides a review of papers presented in the July issue of JOM on lead-free solders. The papers were organized by Srinivas Chada of Medtronic Microelectronics Center for the TMS Electronic, Magnetic & Photonic Materials Division's Electronic Packaging and Interconnection Materials Committee. [READ]

Materials Technology@TMS: Magnesium: " Progress in Automotive Magnesium: MRI153M and MRI230D " by Paul McGinty
Paul McGinty of Dead Sea Magnesium discusses how automotive light weighting is key to improving vehicle fuel economy. This article looks at the role of magnesium in this endeavor, with specific updates on magnesium advances at Dead Sea Magnesium. [READ]

Materials Technology@TMS: Materials for Nuclear Power: " Nuclear Waste: A Critical Component of the Materials for Nuclear Power Community " by Todd M. Osman
More and more, nuclear power is being considered as an energy source to meet future demands. With this potential increase in nuclear power use, a key materials issue to be considered is the disposal of nuclear waste. Materials Technology@TMS Moderator Todd M. Osman provides an overview of the topic and a look at the resources available on this topic through the Materials for Nuclear Power community. [READ]

Materials Technology@TMS: Superalloys: " NASA & Superalloys: A Long-Term Commitment " by Michael V. Nathal
NASA has had a long history of research and development in the field of superalloys. The Glenn Research Center, formerly known as Lewis Research Center, has been active in the area of nickel-base alloys for turbine engine components since the 1950s. Michael V. Nathal of the NASA Glenn Research Center provides an overview of NASA's history with superalloys R&D and looks at potential areas of research for the future. [READ]

Programs, on-line registration, and more:

2008 Global Symposium on Recycling, Waste Treatment and Clean Technology (REWAS 2008)
Cancun, Mexico
October 12-15, 2008

2008 Fourth International Conference on Multiscale Materials Modeling (MMM-2008)
Tallahassee, Florida
October 27-31, 2008

Processing Materials for Properties-III (PMP-III)
Bangkok, Thailand
December 7-10, 2008

2nd International Conference on Thermomechanical Simulations and Processing of Steel (SimPro'08)
Ranchi, India
December 9-11, 2008

TMS 2009 Annual Meeting
San Francisco, California
February 15-19, 2009

5th International Materials Symposium (MATERIAiS 2009)
Abstracts due: 10/31/2008
Lisbon, Portugal
April 5-8, 2009

International Deep Drawing Research Group Conference 2009 (IDDRG 2009)
Abstracts due: 12/1/2008
Golden, Colorado
June 1-3, 2009

Electronic Materials Conference (EMC 2009)
University Park, Pennsylvania
June 24-26, 2009

European Metallurgical Conference 2009 (EMC2009)
Innsbruck, Austria
June 28 - July 1, 2009

Conference of Metallurgists (COM 2009) Nickel-Cobalt 2009
Sudbury, Ontario, Canada
August 23-26, 2009

14th International Conference on Environmental Degradation in Nuclear Power Systems
Virginia Beach, Virginia
August 23-27, 2009

Thermec 2009: Sixth International Conference on Advanced Materials and Processes
Abstracts due: 11/7/2008
Berlin, Germany
August 25-29, 2009

Defect Recognition Image Processing (DRIP) XIII
Abstracts due: 3/15/2009
Wheeling, West Virginia
September 13-17, 2009

2009 International Symposium on Liquid Metal Processing and Casting
Abstracts due: 1/15/2009
Sante Fe, New Mexico
September 20-23, 2009

5th International Conference on Science and Technology of Ironmaking (ICSTI'09)
Abstracts due: 10/31/2008
Shanghai, China
October 19-22, 2009

Materials Science & Technology 2009 Conference and Exhibition (MS&T'09)
Pittsburgh, Pennsylvania
October 25-29, 2009

TRANSFAC '09 - International Conference on Innovative Solutions for the Advancement of the Transport Industry
Detroit, Michigan
October 31 - November 3, 2009

TMS 2010 Annual Meeting
Seattle, Washington
February 14-18, 2010

Copper 2010
Abstracts due: 11/30/2008
Hamburg, Germany
June 6-10, 2010

Electronic Materials Conference 2010
Notre Dame, Indiana
June 23-26, 2010

Materials Science & Technlogy 2010 Conference and Exhibition (MS&T'10)
Houston, Texas
October 17-21, 2010

Superalloys 2012: Twenfth International Symposium on Superalloys
Champion, Pennsylvania
September 9-13, 2012

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