TABLE OF CONTENTS

Last Call for the TMS 2010 Annual Meeting
Conference Begins February 14

Create an Itinerary for TMS 2010 . . .
. . . and Send it to Your Mobile Device

Top Ten . . .
. . . Presentations and Events to Add to Your Conference Itinerary

Recycle, Connect, and Compete
Sponsors Make TMS Meeting Events Possible

FROM THE KNOWLEDGE RESOURCE CENTER:
Light Metals and Other TMS 2010 Annual Meeting Books

View TMS, MSE & Me Video Entries
Winner to Be Announced at TMS 2010

Staff Changes at TMS
Robinson Named Deputy Executive Director; Carolla to Lead Finance and Operations

Look Who's 40!
Metallurgical and Materials Transactions Celebrates 40 Years

JOM Reader Poll
How Has Technology Impacted the Olympics?

Nominate Colleagues for Prestigious Awards . . .
. . . from the U.S. National Academy of Engineering

More Help in a Challenging Economy
Positions Available

Washington News from the Federation of Materials Societies
New Corporate Research Postdoc Fellowships for Engineers

You Ought to Know
Abstract Deadlines and Meeting Information for January

Conference Begins February 14

In just a few weeks, the TMS 2010 Annual Meeting will begin in Seattle, Washington. More than 3,400 materials scientists and engineers from around the world will gather at TMS 2010 to network, share technical developments, and discuss the challenges faced by the profession.

For those who haven't yet registered for the conference, it's not too late. Last-minute planners can register on-site beginning at 11:00 a.m. on Sunday, February 14, at the Washington State Convention Center in Seattle. Use the housing section of the TMS Annual Meeting web site to find hotels with available rooms near the convention center.

For those who have registered for the conference, this issue of TMS e-News offers a number of suggestions for making the most of your meeting experience. So read on . . .

. . . and Send it to Your Mobile Device

In addition to more than 2,700 technical presentations at 56 symposia, the TMS 2010 Annual Meeting will include networking activities, an extensive exhibition, special lectures, short courses, and poster displays. Don't miss a single event by planning ahead with the TMS Personal Conference Scheduler (PCS). Through PCS, attendees can view every presentation and event planned for the TMS 2010 Annual Meeting, select the ones they plan to attend, and compile a personal itinerary for the week's activities. This tool even alerts users to schedule conflicts.

This year, PCS also includes a new feature: the ability to send a completed itinerary to a mobile device. Once a schedule is compiled, the user simply clicks on the "Email My Schedule" tab and types in the address to which the information should be sent. A simplified, personalized schedule listing the name, date, time, and location for each event the user has selected will be instantly sent to the e-mail address, so that users may access their schedule through cell phones or personal digital assistants while on site at the meeting.

Need help deciding what to add to your schedule? The Top Ten list in this issue of TMS e-News has a few suggestions.

. . . Presentations and Events to Add to Your Conference Itinerary

10. Career Forum: This special session, sponsored by the TMS Young Leaders Committee, provides a view of various career paths in the materials field. Particularly good for students, young professionals, and those considering a career change.

9. Young Leader Presentations: The TMS 2010 Early Career Faculty Fellow, Xingbo Liu, will discuss "Energy Materials—Past, Present, and Future" at the Young Leaders Tutorial Luncheon Lecture, while the Japan Institute of Metals International Scholar Yukio Takahashi of Osaka University in Japan plans the talk, "Development of Coherent X-Ray Diffraction Miscroscopy and Its Application in Materials Science."

8. Division Speakers: Rodney Boyer of Boeing Commercial Airplanes will deliver the Extraction & Processing/Materials Processing & Manufacturing Division Luncheon Lecture, "Titanium: Its Attributes, Characteristics and Applications." At the Light Metals Division Luncheon Lecture, Century Aluminum's Wayne Hale hopes to help answer the question, "Aluminum—Are We There Yet?" Tickets for the luncheons can be purchased at the on-site registration desk. The 2010 Extraction & Processing Division Distinguished Lecture, "Alloy Formation during Electrochemical Cementation Reactions," will be delivered by J. Brent Hiskey of the University of Arizona.

7. The Aluminum Industry—Perspectives on Our Future: The TMS Light Metals Division kicks off its programming with a morning-long session that examines current and long-term challenges and opportunities for the aluminum industry. Eight presentations will be delivered by research and industry leaders.

6. A Visit to the Exhibit Hall: Stop by the Energy Materials Initiative booth to learn about a new partnership between TMS and ASM International that aims to help members of the materials community share research that will lead to improved energy security, energy efficiency, and reduced greenhouse gas emissions.

5. Continuing Education: Several continuing education courses will be offered in conjunction with the meeting, and spaces are still available in these classes. Contact Nate Natale to reserve a space or register on-site for a course at TMS 2010.

4. "ADVANCing Women in Engineering:" At the 2010 Women in Science Breakfast Lecture, Eve A. Riskin will discuss her experience working as director of the ADVANCE Center for Institutional Change at the University of Washington. The lecture is free, but attendees must register in advance.

3. Award-Winning Lecturers: The University of California's Robert Ritchie will deliver the 2010 Institute of Metals/Robert Franklin Mehl Lecture, "Nature-Inspired Structural Materials;" University of California Professor Emeritus Didier deFontaine will give the 2010 William Hume-Rothery Award Lecture, "How Hume-Rothery's Work Led to Computational Thermodynamics;" and WorleyParsons's Zeljka Pokajcic will present "Designing Crushing and Grinding Circuits for Improved Energy Efficiency" for the Vittorio de Nora Prize Lecture.

2. "Carbon Fiber Composites Research and Development at Automobili Lamborghini:" This Lunch and Learn talk by Automobili Lamborghini's Luciano DeOto and the University of Washington's Paolo Feraboli focuses on new materials for the legendary Lamborghini sports car. Attendees will be invited to view a Lamborghini in the exhibit hall.

1. Networking Receptions: Don't just listen to presentations; talk with the presenters and those who work in your field at the conference's networking receptions. The President's Welcoming and Poster Session is open to all attendees, and ten additional networking receptions are planned in conjunction with individual symposia.

Find times and locations for each of these events through the TMS Personal Conference Scheduler.

Sponsors Make TMS Meeting Events Possible

At the TMS Annual Meeting, premiere green sponsor Fives Solios will make it possible for attendees to recycle their conference programs and badge holders at the end of the week. Wahl Refractory Solutions will keep Wi-fi access flowing in the exhibit hall, and Stellar Materials, Inc. will sponsor the Cyber Center computers available to attendees on-site, so they can stay in touch with news and e-mail throughout the conference.

Many of the convenient services and special events offered at the TMS 2010 Annual Meeting will be made possible through sponsorship funding from these and other companies in the materials science and engineering field. In addition to the companies mentioned above, the following organizations have pledged their support for annual meeting events:

• Alcoa will sponsor the 2010 Materials Bowl student competition.
• BP Coke, B&P Process, Harbison-Walker Refractories, Pamas & Company, and FLSmidth will sponsor services and giveaways that welcome attendees to the meeting.
• FEI, Jacobs Consultancy, Bechtel Canada, Hatch, Koch Carbon, Koppers, MK Electron, SEC Carbon Ltd (Sumitomo), and Skamol AS and Elken A/S will sponsor networking receptions, coffee breaks, and snacks to help attendees to refresh between technical sessions.

Light Metals and Other TMS 2010 Annual Meeting Books

Light Metals 2010
Edited by John A. Johnson

Light Metals 2010 presents the most up-to-date information on the state of primary aluminum science and technology. It's a mix of practical applied technology and hard science, which is invaluable to the global aluminum industry as it strives to cut costs and increase profitability. Areas covered include:

• Alumina and Bauxite
• Aluminum Reduction Technology
• Cast Shop for Aluminum Production
• Electrode Technology for Aluminum Production
• Aluminum Hot Rolling/Aluminum Cold Rolling and Strip Process

Winner to Be Announced at TMS 2010

In response to TMS's call for entries in the TMS, MSE & Me Video contest, nine groups and individual members created short films that ranged from informative to entertaining to heartfelt. Now, TMS e-News invites its readers to view these creative submissions and post comments that will help the society to determine the contest winners.

The winning entry will receive $2,010, with second and third place winners taking $750 and $250 prizes, respectively. Winners will be announced at the TMS 2010 Annual Meeting, right before the final round of the Materials Bowl, sponsored by Alcoa, on February 14.

Visit ChannelTMS on YouTube through the link below by February 1 to view the films.

Robinson Named Deputy Executive Director; Carolla to Lead Finance and Operations

At TMS Headquarters, a restructuring of the executive department of TMS resulted in the following high-level staffing changes:

Robinson Named Deputy Executive Director

James J. Robinson has been promoted from chief operating executive to the newly created position of deputy executive director of TMS. He now manages all staff and society resources in executing the society's day-to-day operations in a growth-oriented and financially responsible manner while aiding the Executive Director, Warren H. Hunt, Jr., in supporting the Board of Directors. Robinson has been with TMS for 25 years, serving in a number of capacities, including editor of JOM and Director of Knowledge Management and Communication.

New Director of Finance and Operations

Adrianne Carolla has joined the society as the director of the new Finance and Operations Department. Carolla will serve the society in a number of ways including volunteer leader support, financial strategy, long-range budgeting, disaster preparedness, and contract management. Prior to joining TMS, Carolla served as executive director of the Air & Waste Management Association in Pittsburgh, Pennsylvania.

Both Robinson and Carolla are certified association executives (CAEs), a professional designation granted to fewer than five percent of association professionals by ASAE and The Center for Association Leadership.

Metallurgical and Materials Transactions Celebrates 40 Years

In 2010, the archival journal Metallurgical and Materials Transactions turns 40 years old. To celebrate this landmark anniversary, publishers TMS, ASM International, and Springer are planning several special issues focusing on topics like materials for energy applications (including nuclear energy). Classic articles published in the journal over the past 40 years will also be featured regularly on the Met Trans web site.

Remember, all TMS members can access both Metallurgical and Materials Transactions A and B through the Springer site as a benefit of membership. So make sure your TMS membership is up-to-date, bookmark the link below, and check the site often throughout the year for special issues and featured articles from Metallurgical and Materials Transactions, a publisher of leading research in materials science and metallurgy since 1970.

How Has Technology Impacted the Olympics?

The February issue of JOM includes a cover story about the use of advanced materials in the Olympic games (which will be held in Vancouver, just hours away from the TMS 2010 Annual Meeting in Seattle, Washington), and notes the controversy that can result when athletes are too reliant on technology to improve their performances. This month, JOM asks, what effect has materials science had on the competitive spirit of the Olympics?

• Little impact: Superior athletes will prevail regardless of the equipment they use.
• Moderate impact: Technology can provide the push needed for a good athlete to become a winner.
• Significant impact: Advanced materials have given an unfair edge to the teams that can afford the best technology.

. . . from the U.S. National Academy of Engineering

Each year, the U.S. National Academy of Engineering (NAE) presents awards recognizing outstanding engineers for their dedication to their discipline, as well as for their development (or shared involvement) of an engineering invention or process that has greatly improved humanity. TMS encourages its members to nominate their TMS colleagues for the following prestigious awards for engineering achievement.

Charles Stark Draper Prize
This prize honors an engineer whose accomplishment has significantly impacted society by improving the quality of life, providing the ability to live freely and comfortably, and/or permitting the access to information. The Draper Prize award recipient receives a $500,000 cash award, and the prize recognizes achievements in all engineering disciplines. NAE members and non-members worldwide are eligible to receive this prize.

Bernard M. Gordon Prize for Innovation in Engineering and Technology Education
The intent of the Gordon Prize is to recognize new modalities and experiments in education that develop effective engineering leaders. The focus is on innovations such as curricular design, teaching methods, and technology-enabled learning that strengthen students' capabilities and desire to grow into leadership roles. The Gordon Prize recipient receives a $500,000 cash award, half granted to the recipient and the remainder granted to the recipient's institution to support the continued development, refinement, and dissemination of the recognized innovation. NAE members and non-members who are U.S. citizens or permanent residents of the United States, and who currently are and have been substantially engaged in their engineering and scholastic work in institutions within the United States, are eligible for the Gordon Prize.

For more information on how to nominate a colleague for these prestigious awards, click on the link below.

Positions Available

This month, the classified section of the JOM web site includes the following job postings for materials scientists and engineers:

Technical and Program Development Leader: TMS, Warrendale, PA

R&D Metallurgist: Magnesium Elektron North American (MENA)

Meta-Find: Metallurgical, Materials, and Welding Engineers in the areas of R&D, Q.C. Production, Sales & Marketing

Visit the JOM Classifieds page for details on these and other job opportunities.

New Corporate Research Postdoc Fellowships for Engineers

The National Science Foundation, working through the American Society for Engineering Education, has launched the Corporate Research Postdoctoral Fellowship for Engineers Program to allow 40 highly qualified recent engineering Ph.D. recipients to conduct innovative research at some of the nation's foremost-performing companies.

The program provides $50,000 toward stipend expenses and $6,500 toward health insurance for each one-year fellowship, and requires that the host corporation pay $25,000 toward the stipend. That means the program fellows will receive a minimum of $75,000 while spending a year at some of the leading-edge corporate laboratories including HP, IBM, and a number of others which have already signed up for the program. Qualifying companies of all sizes are encouraged to register as soon as possible, posting available research positions. Fellowships will be awarded to the first 40 successful matches between the company and an applicant, with the companies making the selection decision. At the time of application, research fellows must hold a Ph.D. awarded in an engineering field within the last three years and be U.S. citizens, U.S. nationals, or permanent residents.

Interested applicants and companies should register in the appropriate category at https://aseensfip.asee.org/, which also lists the current opportunities ranging from postdoc positions researching IT applications to nanometerials to lithium-ion material applications.

Abstract Deadlines and Meeting Information for January

15th International Conference on Metal Organic Vapor Phase Epitaxy (ICMOVPE 2010)
May 23–28, 2010; Lake Tahoe, Nevada
Registration and Housing Now Open
Registration and housing are now open for ICMOVPE 2010, which is cosponsored by TMS. This conference provides a forum for researchers from around the world to discuss and share experiences in the growth, characterization, and device applications of metal organic vapor phase epitaxy. The Hyatt Regency at Lake Tahoe will host this year's event. Visit the Housing and Travel section of the conference web site for more information.

Electronic Materials Conference 2010 (EMC 2010)
June 23–25; Notre Dame, Indiana
Abstracts due February 1
Share your electronic materials research at the premiere annual forum on the preparation and characterization of electronic materials. EMC 2010 is now accepting abstracts. The conference will feature both invited and contributed oral presentations and an exhibit of the latest technology from industry leaders. More than 30 symposia topics are planned, and some of the topical areas in which organizers are soliciting abstracts are Issues for Wide Bandgap Materials, Nanoscale Science and Technology in Materials, and New Areas.

The 7th Pacific Rim International Conference on Advanced Materials and Processing (PRICM 7)
August 1–5, 2010; Cairns, Australia
Abstract Deadline Extended
Over 1,500 abstracts have been submitted for the PRICM 7 conference, and now the conference sponsors have decided to extend the abstract submission deadline. PRICM 7 is jointly sponsored by the Chinese Society for Metals (CSM), The Japan Institute of Metals (JIM), The Korean Institute of Metals and Materials (KIM), Materials Australia (MA), and TMS. The purpose of PRICM is to provide a forum for the exchange of scientific and technological information on materials and processing.

ABOUT e-NEWS

TMS e-News is a monthly e-mailed newsletter that provides information on The Minerals, Metals & Materials Society's membership, meetings, publications, and other activities of interest. For More Information:

TMS News Editor
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Warrendale, PA 15086
T: 724-776-9000
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OPEN ACCESS ARTICLES

The following articles from TMS journals and web sites are available to all readers at no charge. This month’s featured articles are:

JOM: "Laser Shocking of Materials: Toward the National Ignition Facility" by M.A. Meyers, B.A. Remington, B. Maddox, and E.M. Bringa
In recent years a powerful experimental tool has been added to the arsenal at the disposal of the materials scientist investigating materials response at extreme regimes of strain rates, temperatures, and pressures: laser compression. This technique has been applied successfully to mono-, poly-, and nanocrystalline metals and the results have been compared with predictions from analytical models and molecular dynamics simulations. Special flash x-ray radiography and flash x-ray diffraction, combined with laser shock propagation, are yielding the strength of metals at strain rates on the order of 10⁷–10⁸ s^–1 and resolving details of the kinetics of phase transitions. A puzzling result is that experiments, analysis, and simulations predict dislocation densities that are off by orders of magnitude. Other surprises undoubtedly await us as we explore even higher pressure/strain rate/temperature regimes enabled by the National Ignition Facility. [READ]

Journal of Electronic Materials: "The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects" by Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu, and J.W. Morris
The work reported here concerns the effect of an imposed current on the creep of simple Sn-Ag-Cu interconnects. The samples employed were double-shear specimens that contained paired solder joints, 400 μm × 400 μm in cross-section, 200 μm in thickness, on copper. Different representative microstructures were prepared by electromigration and isothermal aging. Samples were tested with and without an imposed current, and at a variety of temperatures. [READ]

Journal of Electronic Materials: "Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu₆Sn₅ Intermetallic Compound" by Eric Buchovecky, Nitin Jadhav, Allan F. Bower, and Eric Chason
We use finite element simulations to quantitatively evaluate different mechanisms for the generation of stress in tin films due to growth of the Cu₆Sn₅ intermetallic phase at the Cu-Sn interface. We find that elastic and plastic behavior alone are not sufficient to reproduce the experimentally measured stress evolution. However, when grain boundary diffusion is included, the model results agree well with experimental observations. Examination of conditions necessary to produce the observed stresses provides insight into potential strategies for minimizing stress generation and thus mitigating tin whisker growth. [READ]

Journal of Electronic Materials: "Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints" by Tae-Kyu Lee, Kuo-Chuan Liu, and Thomas R. Bieler
The microstructure evolution of Sn-Ag-Cu solder joints during aging and thermal cycling is studied, with a focus on the tin grain orientation in plastic ball grid array (PBGA) packages. Thermally cycled PBGA packages with a full array of 196 solder joints were examined after being subjected to various pre-conditions. Each PBGA package was polished to obtain plan-view cross-sections of each solder joint. Solder joints were characterized using both polarized optical microscopy and orientation imaging microscopy (OIM). The observations reveal that the distribution of single and multigrain tin microstructure as a function of position in the package is dependent on the sample's preconditions and thermal cycle history. Based on distribution maps from polarized optical microscopy observation, thermal aging has a relatively small impact on the overall fraction of single-grained solder joints. Thermal cycling, however, can cause many single-grained joints to transform into multigrained solder joints. The dependence of the grain structure distribution on different preconditions and evolution of the grain structures during thermal cycling are discussed. [READ]

Metallurgical and Materials Transactions A: "Crystallography of Fatigue Crack Initiation and Growth in Fully Lamellar Ti-6Al-4V" by A.L. Pilchak, R.E.A. Williams, and J.C. Williams
Fatigue crack initiation in titanium alloys is typically accompanied by the formation of planar, faceted features on the fracture surface. In the present study, quantitative tilt fractography, electron backscatter diffraction (EBSD), and the focused ion beam (FIB) have been used to provide a direct link between facet topography and the underlying microstructure, including the crystallographic orientation. In contrast to previous studies, which have focused mainly on the α-phase crystal orientation and the spatial orientation of the facets, the present analysis concentrates on the features that lie in the plane of the facet and how they relate to the underlying constituent phases and their crystallographic orientations. In addition, due to the anisotropic deformation behavior of the three basal slip systems, the orientation of the β phase as it relates to facet crystallography was investigated for the first time. [READ]

Metallurgical and Materials Transactions B: "Wettability of Silicon Carbide by CaO-SiO₂ Slags" by Jafar Safarian and Merete Tangstad
The wettability of silicon carbide by liquid CaO-SiO₂ slags that contain 47 to 60 wt pct SiO₂ was studied using the sessile drop wettability technique. The experiments were carried out in Ar and CO atmospheres. A small piece of slag was melted on SiC substrates under different heating regimes up to 1600°C. It was found that the wetting is not significantly dependent on the temperature and the heating rate. [READ]

Programs, on-line registration, and more:

TMS 2010 Annual Meeting
Seattle, Washington
February 14-18, 2010

5th Aluminium Cast House, Rolling & Extrusion Technology (ALCASTEK 2010)
Mumbai, India
February 25-26, 2010

Recent Trends in Surface Engineering Workshop
Kanpur, India
February 25-28, 2010

Offshore Technology Conference 2010 (OTC .10)
Houston, Texas
May 3-6, 2010

Laser Additive Manufacturing Workshop (LAM 2010)
Houston, Texas
May 11-12, 2010

15th International Conference on Metal Organic Vapor Phase Epitaxy (ICMOVPE 2010)
Lake Tahoe, Nevada
May 23-28, 2010

Copper 2010
Hamburg, Germany
June 6-10, 2010

Electronic Materials Conference 2010 (EMC 2010)
Notre Dame, Indiana
June 23-26, 2010

1st TMS-ABM International Materials Congress
Rio de Janeiro, Brazil
July 26-30, 2010

7th Pacific Rim International Conference on Advanced Materials and Processing (PRICM 7)
Cairns, Australia
August 1-5, 2010

Uranium 2010 Conference
Saskatoon, Saskatchewan, Canada
August 15-18, 2010

10th International Conference on Steel Rolling (ICSR)
Beijing, China
September 15-17, 2010

Lead-Zinc 2010 (in conjunction with Conference of Metallurgists [COM 2010])
Vancouver, BC, Canada
October 3-6, 2010

7th International Symposium on Superalloy 718 & Derivatives
Pittsburgh, Pennsylvania
October 10-13, 2010

Materials Science & Technology 2010 Conference and Exhibition (MS&T'10)
Abstracts due: 3/15/2010
Houston, Texas
October 17-21, 2010

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