Electronic Packaging and Interconnection Materials Committee

JOM Topics

The following topics appear in recent issues of JOM under the sponsorship of our committee.
Date: December 2018
Organized By: Chris Gourlay
Title: Advances in Electronic Interconnection Materials
Date: June 2017 (Paper Submission Deadline: Passed)
Organized By: Babak Arfaei, Chris Gourlay
Title: Recent Progress with Lead-Free Solder Interconnects
Date: November 2016
Organized By: Babak Arfaei
Title: Progress with Lead-Free Solders