Electronic Packaging and Interconnection Materials Committee

Technical Programming

2018 TMS Annual Meeting & Exhibition: Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder: Organized by Yan Li; Tae-Kyu Lee; Albert T. Wu; Kwang-Lung Lin; Chih Chen; Won Sik Hong; Mehran Maalekian; Kazuhiro Nogita; Christopher Gourlay

Scope: Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in Packaging Materials and Process, including Pb free solder, alternative interconnects, conductive adhesive, epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability, and failure analysis. Topics of interest include, but are not limited to: * Packaging materials and Process for next generation packages, e.g., 3D packaging, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding, automotive and power electronics. * Interconnects for packages, e.g., Pb-free solder, micro bumps, Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive adhesive, optoelectronic interconnects, transient liquid phase bonding, sintered nano-powder joints, and alternative interconnect materials at chip and package levels. *Additive manufacturing and 3D printing for electronics industry * Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), substrate materials and process. * Quality, Reliability, and failure analysis for next generation packages. * Continuing challenges in implementing Pb-free solders for interconnect, plating and thermal interface material (TIM) applications * Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics * Developments in low temperature Pb-free solder alloys and fine pitch solder joints * Electromigration, thermomigration, stress-migration and mechanical effects * Whisker growth in Sn, Sn-based alloys and other metallic systems * Advanced characterization methods as applied to interconnect technology * Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds

2017 TMS Annual Meeting & Exhibition: Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology: Organized by Fan-Yi Ouyang; C. Robert Kao; Albert T Wu; Fay Hua; Yan Li; Babak Arfaei; Kazuhiro Nogita

Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in microstructure-design, processing and properties of new and existing materials for emerging interconnects and Pb-free materials for advanced packaging technologies. Topics of interest include, but are not limited to: * Emerging interconnect materials and technologies, e.g., 3D stacking including through-silicon-vias (TSVs), optoelectronic interconnects, Internet of Things (IoT) and flexible electronics * Continuing challenges in implementing Pb-free solders for interconnect, plating and thermal interface material (TIM) applications * Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics * Developments in low temperature Pb-free solder alloys and fine pitch solder joints * Non-solder interconnect materials at chip and package levels * Electromigration, thermomigration, stress-migration and mechanical effects * Whisker growth in Sn, Sn-based alloys and other metallic systems * Advanced characterization methods as applied to interconnect technology * Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds * Additive manufacturing for electronics industry

2017 TMS Annual Meeting & Exhibition: Frontiers in Materials Science, Engineering, and Technology: An FMD Symposium in Honor of Sungho Jin: Organized by Fay Hua; Tae-Kyu Lee; Young-Ho Kim; Roger Narayan; Choong-un Kim; Nuggehalli Ravindra

This symposium honors Professor Sungho Jin, Winner of the 2016 Acta Materialia Gold Medal Award. It will address Frontiers in Materials Science, Engineering, Technology and Beyond, including recent advancements in electronic, magnetic, optical, superconducting materials, devices and structures, electronic packaging, and MEMS materials and devices, nano-bio materials, and energy related materials. This special symposium is dedicated to the seminal research contributions of Dr. Sungho Jin, to his leadership in materials science worldwide through various professional societies and the University of California – San Diego. Professor Jin is the Professor Emeritus in the University of California – San Diego. Prior to his recent retirement, he was Distinguished Professor of Materials Science in the Departments of Mechanical and Aerospace Engineering at UCSD and held Iwama Endowed Chair. He also served as the Director of the university-wide Materials Science & Engineering Program at UCSD for the past 13 years.

2016 TMS Annual Meeting & Exhibition: Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology: Organized by Albert T. Wu; Yan Li; Kazuhiro Nogita; Christopher Gourlay

Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in microstructure-design, processing and properties of new and existing materials for emerging interconnects with special emphasis on Pb-free materials for advanced packaging technologies. Topics of interest include, but are not limited to:  Emerging interconnect materials and technologies, e.g., 3D stacking including through-silicon-vias (TSVs), optoelectronic interconnects and flexible electronics  Continuing challenges in implementing Pb-free solders for interconnect, plating and TIM applications  Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics  Non-solder interconnect materials at chip and package levels  Electromigration, thermomigration, stress-migration and mechanical effects  Whisker growth in tin, tin-based alloys and other metallic systems  Advanced characterization methods as applied to interconnect technology  Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and IMCs

2016 TMS Annual Meeting & Exhibition: Recent Advancement on Stretchable and Wearable Electronics: Organized by Pooran Joshi; Amit Pandey; Jiahua Zhu; Nuggehalli Ravindra; Catherine Dubourdieu; Madan Dubey

Additive manufacturing and printed electronics technologies employing metal, dielectric, polymer, and ceramic materials have the potential to enable new products and markets. Advanced additive manufacturing and direct-write techniques in combination with rapidly expanding material and device sets and their application range have the potential to meet the cost and performance demands of future manufacturing technologies. The proposed symposium will focus on the emerging additive manufacturing concepts and techniques for the processing of 2D/3D structures and integration of functional electronic components and devices on engineered geometries. Additive manufacturing technology in combination with printed electronics has the potential to define path towards hybrid technology integration of sensors and electronics on engineered 3D geometries. Invited and contributed papers will discuss both the fundamental aspects underlying certain applications and the particular challenges regarding technology, fabrication processes, and reliability. Research fields of interests are related but not necessarily limited to the following topics: - Nanomaterials for 2D/3D additive manufacturing - Additive manufacturing and characterization of 3D structures and geometries - Printed electronics: materials, processes, and fabrication and characterization techniques - Low thermal budget integration of functional inks and 2D/3D materials - Multifunctional flexible and printed electronic devices: sensors, detectors, TFTs, antennas, batteries - Hybrid electronics: merging printed electronics and additive manufacturing

2015 TMS Annual Meeting & Exhibition: Pb-Free Solders and Emerging Interconnect and Packaging: Organized by John Elmer; Yan Li; Andre Lee; Fan-Yi Ouyang; Srini Chada; Kyu-Oh Lee; Kwang-Lung Lin; Christopher Gourlay; Daniel Lewis; Fan Gao

The symposium covers research advances in electronic interconnecting materials and their technologies, with special emphasis on Pb-free solders and new materials and structures for next-generation interconnects. Advances in microelectronic, optoelectronic and nanoelectronic devices continue to require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. In this symposium, emerging interconnect and packaging technologies will be examined, as well as insights into existing technologies,including Pb-free and RoHS-compliant materials and processes. Topics include, but are not limited to: - Interconnect materials, manufacturing, and reliability from chip assembly to printed wiring board level interconnections - Interconnects for emerging technologies, including 3D packaging, through silicon vias (TSVs),wafer level package (WLP),interconnects on flexible electronic modules and nanomaterials technology - Pb-free solder reliability, including tin whisker formation and mitigation, electromigration,thermomigration,thermal aging and stressing, thermomechanical reliability, thermal and mechanical fatigue, and drop performance. - Pb-free solder intermetallic compound (IMC)formation,crystallography, mechanical an physical properties,thermodynamics,and kinetics - Advanced characterization methods as applied to interconnect technology including EBSD,TEM,synchrotron x-ray micro-diffraction, synchrotron and conventional 3D x-ray radiography and computed tomography. - Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics - Fundamental materials behavior including phase transformations,computational thermodynamics,solidification, microstructure evolution, corrosion, mechanical, thermal,and electrical properties of solders and IMCs. - Continuing challenges in implementing Pb-free solders and RoHS-compliant materials including materials compatibility,wetting, phase transformations, void formation and growth, IMC formation, and interconnects on flexible and low temperature substrates.