The Mechanics of Stresses and Strains Engineered by Interfacing Materials and Their Effects
Manuscript Submission Deadline:
December 01, 2018
Co-Organizers: Shen Dillon
Publication Date: May 2019
Keywords: Characterization, mechanical properties, modeling and simulation, synthesis and processing
Scope: Interfacing materials have dramatically altered their respective electronic, optical, and electrical properties. These modifications have been mainly caused by introduced lattice mismatches that are manifested in the form of stresses and strains. It is these stresses that alter materials properties via modifying carrier mobility and modulating bandgap. It is crucial, therefore, to understand the underlying mechanics of stress formation and its evolution by focusing on various characterization techniques, statistical models, and correlation to enhanced properties.
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