JOM Editorial Calendar - Topic Details

Solidification Behavior in the Presence of External Fields: Part I

Manuscript Submission Deadline: May 01, 2020
Guest Editor: Lang Yuan
Co-Guest Editors: Andrew Kao
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Sponsored By: Solidification
Publication Date: October 2020
Keywords: Advanced processing; modeling and simulation; solidification fundamentals, external fields; defects
Scope: The introduction of external fields, including electromagnetic fields, ultrasonic excitation, and mechanical shearing to solidification processes can significantly alter solidification behavior. This encompasses a wide range of applications in casting, welding, remelting, and additive manufacturing processes that have been explored in industry to refine grains, homogenize segregation, prevent defect formation, and break up agglomeration of particles. Publications focused on new scientific discoveries, engineering advancement and industrial applications are solicited under this topic.
Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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