JOM Editorial Calendar - Topic Details

Low-temperature Technology for Electronic Packaging and Interconnects

Manuscript Submission Deadline: October 01, 2021
Guest Editor: Albert T Wu
Co-Guest Editors: Babak Arfaei
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Publication Date: May 2022
Keywords: Electronic Materials, Joining, Molten Metal and Solidification, Phase Transformations, Powder Technology, Low-temperature Materials
Scope: This special topic focuses on low-temperature technology for electronic packaging and interconnects.
Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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