Advanced Technology for Electronic Packaging and Interconnection Materials
Access all papers from this issue
...
This topic is no longer accepting submissions.
Manuscript Submission Deadline:
December 01, 2023
Publication Date: June 2024
Keywords: Advanced Materials, Electronic Materials, Intermetallics, Joining, Thin Films and Interfaces
Scope: Advanced progress in device requires developing new materials and technologies to meet the electrical, thermal, mechanical, reliability and sustainable environment demands. The special topic will address current research in new and existing materials for emerging technology of interconnection and electronic packaging.
Call for Papers:
Download