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Journal of Electronic Materials

The mission of TMS is to promote the global science and engineering professions concerned with minerals, metals, and materials.
OUR LATEST ISSUE    

Cover

JEM HOME PAGE

TABLES OF CONTENTS

SPECIAL ISSUES

BACKGROUND ON JEM

EDITORIAL PLANS &
CALLS FOR PAPERS


AUTHOR GUIDELINES

SUBSCRIPTIONS

 
JEM STAFF

INTERIM EDITOR

Suzanne E. Mohney
Pennsylvania State Univ., Materials Sci. & Eng. Dept., 109 Steidle Bldg., University Park, PA 16802-5005; phone (814)863-0744; fax (814)865-2917; e-mail mohney@ems.psu.edu.

EDITOR EMERITUS

Theodore C. Harman
Massachusetts Institute of Technology, Lincoln Laboratory, 244 Wood Street, Lexington MA 02420-9108; phone (781)981-4418; fax (781) 981-0122; e-mail tharman@11.mit.edu.
SECTION EDITORS
 
L.J. Brillson
Electronic Materials Reviews
Ohio State Univ., 205 Dreese Laboratory, Neil Avenue, Columbus, OH 43210-1272; phone (614)292-8015; fax (614) 292-7596; e-mail brillson.1@osu.edu

B.W. Wessels
Electronic Materials Letters
Dept. of Materials Science and Engineering, Northwestern Univ., 2225 N. Campus Drive, Evanston, IL 60208; phone (847) 491-3219; fax (847) 491-7820; e-mail b-wessels@northwestern.edu

ASSOCIATE EDITORS

Ishwara Bhat
Crystal Growth
Rensselaer Polytechnic Inst., ECSE Dept., JEC 6003, Troy, NY 12180-3590; phone (518) 276-2786; fax (518) 276-6261; e-mail bhati@rpi.edu

L.J. Brillson

Interfaces and Contacts
Ohio State Univ., 205 Dreese Laboratory, Neil Avenue, Columbus, OH 43210-1272; phone (614) 292-8015; fax (614) 292-7596; e-mail brillson.1@osu.edu

Sinn-wen Chen
Packaging and Interconnects
National Tsing Hua Univ. Chemical Engineering Dept., 101 Kuang-fu Road, Sec. 2, Hsin-chu 3000, Taiwan; phone +886-3-572-1734; fax +886-3-571-5408; e-mail swchen@che.nthu.edu.tw

Kurt G. Eyink
Materials Integration
Wright-Patterson Air Force Base, AFRL/MLPO, Room 131, 3005 Hobson Way, WPAFB, OH 45433-7707; phone (937) 656-5710; fax (937) 656-7788; e-mail kurt.eyink@wpafb.af.mil

Darrel Frear
Packaging and Interconnects
Freescale Semiconductor, 2100 E. Elliot Road, Tempe, AZ 85284; phone (480) 413-6655; fax (480) 413-4511; e-mail darrel.frear@freescale.com.

Rachel S. Goldman
Defects and Nanocharacterization
Univ. of Michigan, Dept. of Materials Science & Eng., 2300 Hayward Street, Ann Arbor, MI 48109-2136; phone (734) 647-6821; fax (734) 763-4788; e-mail rsbold@engin.umich.edu.

William C. Mitchel
Electronic & Optical Characterization
Wright-Patterson Air Force Base, AFRL/MLPS, Rm. 243, 3005 Hobson Way, WPAFB, OH 45433-7707; phone (937)255-4474; fax (937)255-4913; e-mail william.mitchel@wpafb.af.mil

Richard P. Schneider
Compound Semiconductor Growth II
Infinera, 1322 Bordeaux Road, Sunnyvale, CA 95089; phone (408) 572-5429; fax (408) 572-5343; e-mail rschneider@infinera.net

Robert Stahlbush
Growth and Characterization of Wide Bandgap Semiconductors
Naval Research Lab., Code 6881, Washington, D.C. 20375; phone (202-767-3357; fax (202) 404-7194; e-mail stahlbush@nrl.navy.mil

Susanne Stemmer
Dielectrics and Ferroelectrics
Univ. of California, Materials Dept, Santa Barbara, CA 93106-5050; phone (805) 893-6128; fax (805) 893-8502; e-mail stemmer@mrl.ucsb.edu

Michael Tischler
Silicon-Based Heterostructures
OCIS Technology LLC, 4138 E. Mercer Lane, Phoenix, AZ 85028; phone (602)317-6249; e-mail tisch@ocistech.com

EDITORIAL OVERSIGHT COMMITTEE

L.J. Guido
Virginia Tech, Dept. of Materials Science and Engineering, Blacksburg, VA 24061; phone (540) 231-3551; fax (540)231-8919; e-mail louis.guido@vt.edu.

James L. Merz
Univ. of Notre Dame, 203 B Cushing Hall, Notre Dame, IN 46556-5637; phone (574)631-3111; fax (574) 631-0651; e-mail jmerz@nd.edu.

Laura S. Rea
Wright-Patterson Air Force Base; AFRL/MLPS, Sensor Materials Branch, 3005 P St. Room 243, WPAFB, OH 45433-7707; phone: 937.255.4474 ext 3213; fax: 937.255.4913; e-mail: laura.rea@wpafb.af.mil

T.D. Sands
Purdue University, School of Materials Engng., 501 Northwestern Ave, W. Lafayette IN 47907-2044; phone (765) 796-6105; fax (765) 494-1204; e-mail tsands@purdue.edu.

Andrew J. Steckl
Univ. of Cincinnati, Nanoelectronics Laboratory, 899 Rhodes Hall, Cincinnati, OH 45221-0030; phone (513) 556-4777; fax (513) 556-7326; e-mail a.steckl@uc.edu

Jerry M. Woodall
Yale University, Dept. of Electrical Engineering, 513 Becton Center 15 Prospect St., PO Box 208284, New Haven, CT 06520-8284; phone (203) 432-4298; fax (203) 432-6420; e-mail: jerry.woodall@yale.edu

PRODUCTION EDITOR

Shirley A. Litzinger
TMS, 184 Thorn Hill Road, Warrendale, PA 15086; phone (724) 776-9000, ext. 228; fax (724) 776-3770; e-mail litzinger@tms.org.

SUBSCRIPTIONS

TMS Customer Service
184 Thorn Hill Road, Warrendale, PA 15086; phone (724) 776-9000, ext. 251; fax (724) 776-3770; e-mail crc@tms.org.

About JEM

The Journal of Electronic Materials (JEM) is a monthly archival publication that reports on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, insulators, and optical and display materials.

Published by by the Electronic, Magnetics & Photonic Materials Division of The Minerals, Metals & Materials Society (TMS) and the Institute of Electrical and Electronics Engineers (IEEE) for the past 35 years, JEM strives to publish papers of interest to both non-specialists and specialists in the electronic materials field.

WHO PUTS JEM TOGETHER?

Articles that appear in JEM are reviewed, selected, and edited by peers in the field who serve as voluntary members of the editorial board or the board of associate editors or as section editors. Generally, they are members of the Electronic Materials Committee of TMS or are members of IEEE. In addition, a professional copy editor and graphic artist assemble the approved papers for publication. The table features the names of some of the people who are involved with JEM.

WHAT DOES JEM CONTAIN?

The journal contains peer-reviewed technical papers detailing critical new developments in the electronics field, as well as invited and contributed review papers on topics of current interest, designed to enable those in the field of electronics to keep abreast of activities in areas vital to their own technical interests.

Some of the editorial topics covered so far in 2006 have included special issues on group III nitrides, Sic, and ZnO; the 2005 U.S. workshop on the physics and chemistry of II-VI materials; and phase stability, phase transformations, and reactive phase formation in electronic materials. Regular issue topics have included new applications for semiconductors, magnetic alloys, insulators, and optical and display materials.

There are four types of papers in JEM:

  • Regular issue papers deal with new and original research work.
  • Letters are research papers.
  • Reviews are lengthy papers that cover a certain area of research.
  • Special issue papers are so designated when ten or more papers on new and original research on the same topic are presented in the same issue; special section papers include six to nine papers concerned with research on the same topic.

A schedule of upcoming issue topics is available.

JEM also publishes the entire program of abstracts, as well as selected papers, from the annual electronic materials conference, a TMS specialty meeting. As the TMS Electronic, Magnetic & Photonic Materials Division views the journal as its primary means of publication, symposia proceedings and special issues covering significant advances or critical topics are frequently published as a supplement to the "regular" issue archival papers.

These conference proceedings issues are available for individual purchase, as are all other in-stock back issues of the journal, for as little as $25 each.

WHO READS JEM?
 

Written for practicing members of the international electronic materials field, JEM has approximately 1,500 subscribers. The subscribers include TMS members, IEEE subscribers, and individuals who are affiliated with neither society. The majority of subscribers are professional materials scientists and engineers within the field from industry, government, or academia.

HOW CAN I SUBMIT AN ARTICLE?

Only manuscripts submitted through the on-line system at http://jems.edmgr.com will be considered for publication. Anyone wishing to publish in JEM should adhere to the instructions set forth in the Author Guidelines. The guidelines detail communication contacts and manuscript preparation.

WHAT IS THE MANUSCRIPT REVIEW PROCESS?

All papers for JEM are reviewed by two qualified referees to determine the suitability of the paper for publication. The editor makes the decision to accept or reject a paper based on the referees' comments. An author may be asked to revise his or her manuscript to address concerns raised by one of the reviewers or the editor. The length of time that passes between the submission of a paper and its publication may vary based on the paper topic and other factors (e.g., amount of revisions needed or the length of time paper is reviewed by appropriate editor). Authors are also given the opportunity to review the typeset version of their accepted manuscript before it is published. This review is solely for detecting typographical errors.

DOES JEM HAVE PAGE CHARGES?

Like many other scientific and technical journals, JEM depends on author page charges to offset publication costs. Therefore, a charge of $110 per printed page is levied on authors for all papers published. In exchange, 100 reprints of the paper are supplied to the author without additional charge.

HOW CAN I SUBSCRIBE TO JEM?

A variety of options for both electronic and hard-copy subscriptions are available. Entire issues are also available for individual purchase, as are the individual articles (in portable document format).

For more detail, visit the Subscriptions Department.

DOES JEM ACCEPT ADVERTISING?

No.

 

A publication of The Minerals, Metals & Materials Society (TMS) and the Institute of Electrical and Electronics Engineers (IEEE). Direct questions to publications@tms.org.