ABOUT THE
COVER
One of the most hotly debated issues for the U.S. Congress is the
role of
government in science and technology. How much government is too much? How much
is too little? This issue attempts to provide insight into these issues through
Letters to the Editor, News & Update, and the governmental emphasis topic
that begins on page 12. The cover photo of the U.S. Capitol was supplied by the
U.S. House of Representatives' Office of Photography.
Opinion:
Why the U.S. Government Should Continue Funding Advanced Technology
Program [pp. 14-15]
Robert A. Schiffman
Interview:
The Journal Talks with Congress's Robert S. Walker and George E. Brown,
Jr. [pp. 16-19]
Conference Review:
Megatrends in Manufacturing
IV: Perspectives on Metalworking and the
Government's Role [pp. 20-21]
James J. Robinson
Overview:
The Multichip Module as a Board-Level Package [pp. 27-30]
David B. Knorr
Testing and Analysis:
Characterizing the Temperature Dependence of Electronic Packaging-Material
Properties [pp. 31-35]
Chia-Yu Fu and Charles Ume
Research Summary:
A New Reduced-Oxide Soldering Activation Method [pp. 36-41]
D.M. Tench, D.P. Anderson, P. Jambazian, P. Kim, J. White, D. Hillman, G.K.
Lucey, T. Gher, and B. Piekarski
Research Summary:
Recovering Metals from Hydrometallurgical Residues [pp. 46-47]
M.G. Sánchez Loredo, G.J. Román-Moguel, and F. de J.
Carrillo Romo
Research Summary:
Recovering Flake Graphite from Steelmaking Kish [pp. 48-51]
L.J. Nicks, F.H. Nehl, and M.F. Chambers
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