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07/25/2007 -
Fundamentals of Electrochemical Deposition, Second Edition (2006)
by Milan Paunovic and Mordechay Schlesinger
ISBN 978-0-471-71221-3. Wiley Interscience, Hoboken, New Jersey. 2006. Hardcover. 373 pages. $99.95.
| REVIEWED BY: | Maria Salamon
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Fundamentals of Electrochemical Deposition, 2nd Edition by Milan Paunovic and Mordechay Schlesinger provides a concise introduction to many of the aspects of electrochemical deposition processes and applications. This book is pertinent to the engineer who seeks a better grasp of the theory behind electroplating, or who perhaps wishes to tweak their process in a quantifiable manner to provide predictable results. This edition can also be used as a textbook; example problems are dispersed throughout the text and exercises are included at the end of each chapter.
This book is written such that each chapter may be read independently of the others. This is particularly useful when referencing a specific topic; one does not need to spend time perusing background information. References for the work cited and suggestions for additional reading are provided at the conclusion of each chapter.
This is not a handbook. There are no tables of solution chemistries, concentrations and resulting products, nor are there tables of substrates with pre-deposition treatments. Instead, this book is heavy on equations and the explanations thereof—but all to the end of understanding the electrochemical deposition process and quantifying it, if desired. Taken altogether, the 21 chapters in the book are divided into four concentrations: electrochemical deposition theory, methods, characterization, and applications.
Chapters 1–7 form a firm foundation of the theory behind electrochemistry. The authors go into a great deal of detail to familiarize the novice electrochemist. Explanations are given on the structure of water and how ions interact with water and with other ions in solution. Surfaces, the surface-solution interface, and how they affect both the electrochemical deposition process and the formed material are discussed. Reduction-oxidation potentials and several potentiostatic techniques are explained. Nucleation of the reaction product and the effect of the conditions within the electrochemical cell on the microstructure of the deposited material are detailed as well.
Various electrochemical processes and a further discussion of electrochemical cell conditions and their respective effects are described in Chapters 8–12, inclusive. Electroless and displacement deposition are two of the techniques elaborated upon. The electrochemical deposition of alloys like brass and the use of additives such as brighteners are included.
Chapters 13–18 detail the application of such characterization methods as mass spectrometry and atomic force microscopy to electrochemically deposited structures and materials. The mechanical and magnetic properties of electrochemically deposited material are discussed, as well.
Applications of electrochemical deposition for the fields of semiconductors, microelectronics, biomedical devices, and implants are reviewed in Chapters 19–21. These sections provide a nice overview to illustrate some of the practical, cutting-edge applications of all the material covered in the previous chapters.
Given the scope and complexity of the topic undertaken, this is an excellent book for explaining electrochemical deposition to students, practicing engineers, or scientists who wish to gain an in-depth understanding of these methods. For all of the chapters except one on numerical modeling, an understanding of college-level chemistry would be the only prerequisite for this text. This ease of understanding results from the authors taking the time to deconstruct and explain each concept. My only reservation is that while the authors took the time to include problems at the end of each chapter, they did not provide a set of solutions at the back of the book.
For more on Fundamentals of Electrochemical Deposition, Second Edition, visit the Wiley Interscience web site.
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