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New U.S. Manufacturing Innovation Institutes Announced

Posted on: 02/26/2014
President Barack Obama announced the teams selected for two new U.S. Department of Defense (DoD)-led manufacturing innovation institutes on February 25. Each institute serves as a regional hub, intended to bridge the gap between applied research and product development by bringing together companies, universities, and other academic institutions, with federal agencies co-investing in key technology areas.

The Lightweight and Modern Materials Manufacturing Innovation (LM3I) team is headquartered in Detroit and led by EWI. The long-term goal of the LM3I Institute will be to expand the market for and create new consumers of products and systems that utilize new, lightweight, high-performing metals and alloys by removing technological barriers to their manufacture. The 60-member consortium includes the following members:

Industry/Business: ABS, AEM, ALCOA Technology, Boeing, Comau, Easom Automation, EWI, Fabrisonic, Flash Bainite Steel, GE, Honda North American Services, Huys, Infinium, Inc., Innovative Weld Solutions, ITW, Lockheed Martin, Luvata, Materion, MesoCoat, MTI, NanoSteel Company, Optomec, Phoenix Integration, PowderMet, RealWeld, RTI International Metals, SaCell, Southwest Research Institute (SWRI), Steel Warehouse Co., ThermoCalc, TIMET, Trumpf, Inc., UTRC, Wolf Robotics.

Universities: Colorado School of Mines, Michigan State University, Michigan Tech University, The Ohio State University, University of Kentucky, University of Michigan, University of Notre Dame, University of Tennessee, Wayne State University, Worcester Polytechnic Institute.

Obama also announced the team for the Digital Manufacturing and Design Innovation Institute, which is intended to enable interoperability across the supply chain, develop enhanced digital capabilities to design and test new products, and reduce costs in manufacturing processes across multiple industries. Led by UI Labs and headquartered in Chicago, the consortium includes the following members:

Industry/Business: 3D Systems, ANSYS, Autodesk, Big Kaiser Precision Tooling Inc., Boeing, Caron Engineering Inc., Caterpillar, CG Tech, Cincinnati Inc., Colorado Association for Manufacturing & Technology, Cray, Dassault Systems, Deere & Company, DMG Mori, Evolved Analytics LLC, General Dynamics - Ordnance & Tactical Systems, General Electric, Haas Automation, Honeywell, Illinois Tool Works, Imagecom Inc. (Aspire 3D), International TechneGroup Inc., Kennametal, Lockheed Martin, Microsoft, MSC Software, North American Die Casting Association, National Instruments, Nimbis Services Inc., Okuma, Palo Alto Research Center, Parlec, Procter & Gamble, Product Development & Analysis, PTC, Inc., Rockwell Collins, Rolls-Royce, Siemens, System Insights, The Dow Chemical Company, UPS.

Universities: Colorado University-Boulder, Illinois Institute of Technology, Indiana University, Iowa State University, Missouri University of Science and Technology, Northern Illinois University, Northwestern University, Notre Dame, Oregon State, Purdue University, Rochester Institute of Technology, Southern Illinois University, University of Chicago, University of Illinois at Chicago, University of Illinois at Urbana-Champaign, University of Iowa, University of Louisville, University of Michigan, University of Nebraska-Lincoln, University of Northern Iowa, University of Texas-Austin, University of Wisconsin-Madison, Western Illinois University.

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