TMS2018 Professional Development Events

14th Annual Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Lead-Free Solder Workshop

Sunday, March 11, 2018 • 8:30 a.m. to 4:30 p.m.
Phoenix Convention Center
TMS Functional Materials Division; Electronic Packaging and Interconnection Materials Committee
Yan Li, Intel; Ravi Mahajan, Intel; Panat Rahul, Washington State University; Pilin Liu, Intel; Sangil Lee, Broadcom; Minfeng Yu, Georgia Tech; Deepak Goyal, Intel; Kwang-Lung Lin, National Cheng Kung University


Continuing advances in microelectronic, optoelectronic, and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance, and environmental demands placed on interconnects and packaging at all levels. This workshop will address current researches and discuss opportunities and development trends in packaging materials and process, including lead-free solder, alternative interconnects, conductive adhesive, epoxy, substrates, 3D packaging, wafer level packing, quality, reliability, and failure analysis.

Who Attends?

Professors and graduate students in materials science, mechanical engineering, chemistry, physics, chemical engineering, and any other departments interested in microelectronic packaging technology or the semiconductor industry.

Topical Outline

9:00 to 9:30am
Welcome, Program Committee
9:30 to 10:30am
Directions and Opportunities in Advanced Microelectronics Packaging
10:30 to 11:30am
The application of 3D printing to advanced packaging technology
11:30am to 1:30pm
Lunch Break (on own)
1:30 to 2:30pm
Electro migration in interconnects of advanced packages
2:30 to 3:30pm
Thermal Compressive Bonding in advanced packages
3:30 to 4:30pm
Alternative interconnects in advanced packages
4:30 to 5:30pm
Panel discussion: Directions and Opportunities in Advanced Microelectronics Packaging


Registering As Advanced On-site
Member $175 $225
Non-member $225 $275
Student $75 $125