Date: Sunday, March 19, 2023
Time: 8:00 a.m. to 5:00 p.m.
This annual Lead-Free Solders and Interconnect Technology Workshop provides the latest development and research studies on interconnect materials and electronic packaging technologies. Due to the miniaturization and multi-functional trends for electronic packages, the key materials used in different levels of packaging have dramatically changed or experienced severe service conditions. Three-dimensional (3D) and 2.5D interposer-related technology show a fast trend in the industry looking for more fundamental mechanisms to be explored. In addition to the 3D technology in multi-stacking packages and interconnects, new methodologies like additive manufacturing with embedded interconnects are new areas for further research and development. But with these introductions of new technologies, researchers in this field have agreed that fundamental studies are needed to go further, from a materials perspective, to improve the service capability of the new materials and assemblies. This workshop will both introduce new technology trends and address deep-dive discussion topics for industry and academia.
This workshop will address current R&D in packaging materials and processes, including lead-free solders, alternative interconnects, conductive adhesives, epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability, and failure analysis.
Topics to be covered may include:
Tae-Kyu Lee, Cisco
Albert Wu, National Central University
Nilesh Badwe, Intel
Kazuhiro Nogita, University of Queensland
You can register for this workshop through the TMS2023 registration form.
Remember to register for the conference and any short courses by January 31 for the best rates.