Third State of Art Lead-free Technology Workshop

Provided Courtesy of Materials Technology@TMS

Sponsored by the TMS Electronic Packaging and Interconnect Materials Committee.  Organized by Fay Hua, Intel Corporation. | | |
PAPER TITLE | AUTHOR(S) | VIEW PRESENTATION |
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Advances in Sn-Ag-Cu and Sn-Ag-Cu-X Alloy Development  for Pb-free Electronic Solder Applications | Iver E. Anderson, Joel Harringa, Jason Walleser and David Rehbein, Iowa State University | Launch Presentation |
Interfacial Evolution between Solder and Metallization | Kwang-Lung Lin, National Cheng-Kung University | Launch Presentation |
Alternate Pb Free Solder Alloys for High Strain Rate Mechanical Loading Conditions | Ahmer Syed, Amkor Technology | Launch Presentation |
Conductive Anodic Filament Formation | Laura J.Turbini, University of Toronto | Launch Presentation |
Nano-Enabled Low Temperature Lead-free Solders for Advanced Electronic Packaging | Alan Rae, Gregory Berube and Suv Sengupta, NanoDynamics, Inc., | Launch Presentation |
Challenges of Densification in Electronics Packages and Assembly | Fay Hua, Intel Corporation | Launch Presentation |

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