Recommended Readings: Lead-Free Solders Physical Metallurgy and Alloy Development

Provided Courtesy of Materials Technology@TMS

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The following are recommended readings regarding alloy development and metallurgy of  lead-free solders from | | | |
an advisory group of TMS subject matter experts | | | | |
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TECHNICAL AREA | PAPER TITLE | AUTHOR(S) | SOURCE | | |
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Alloy Development | Metallurgy of Low Temperature Pb-Free Solder for Electronic Assembly | J. Glazer | International Materials Reviews, vol. 40, no. 2, 1995, pp. 65- 93. | [view abstract] | |
| Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review | J. Glazer | J. Electr. Mater., vol. 23, no. 8, 1994, pp. 693-700. | | |
| Microstructure and Mechanical Behavior of Novel Rare Earth-Containing Pb-free Solders | M.A. Dudek, R.S. Sidhu, N. Chawla, and M. Renavikar | J. Elec. Mater., vol. 35, 2006, pp. 2088 - 2097. | [view abstract] | |
| Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys | K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker | J. Elect. Mater., vol. 29,  2000, p. 1122. | [view abstract] | |
| Microstructure and Mechanical Properties of Lead-free Solder Joints Used in Microelectronic Applications | S.K. Kang, P.A. Lauro, D.-Y. Shih, D.W. Henderson and K.J. Puttlitz | IBM J. Res. & Dev. , vol. 49 (4/5), 2005, p. 607-620. | [view paper] | |
| Physics and Materials for Lead-free Solders | K.N. Tu, A.M. Gusak, and M. Li | J. Appl. Phys., vol. 93 (3),  2003, pp. 1335-1353. | [view abstract] | |
| Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications | I.E. Anderson | J. Mater. Sci: Mater. Electron, vol. 18:55-76,  2007, pp. 55-76. | [view paper] | |
Intermetallic Formation | Influence of Initial Morphology and Thickness on Growth and Evolution of Cu6Sn5 and Cu3Sn Intermetallics During Thermal Aging of Sn-Ag Solder/Cu Joints | X. Deng, G. Piotrowski, J.J. Williams, and N. Chawla | J. Elect. Mater., vol. 32, 2003, pp. 1403-1413. | [view abstract] | |
| Intermetallic Growth Behavior of Low and High Melting Temperature Solder Alloys | D. R. Frear and P. T. Vianco | Metall. Trans., vol. 25A, 1994, pp. 1509-1523. | [view abstract] | |
Tin Whisker Formation | Mechanism and prevention of spontaneous tin whisker growth | K. N. Tu, J. O. Suh, A. T. C. Wu, N. Tamura, and C. H. Tung | Mater. Trans., vol. 46 (11), 2005, pp. 2300-2308. | [view abstract] | |
| Whisker and Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits | W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, M.E. Williams, and G.R. Stafford | Acta Mater., Vol. 53, 2005, pp. 5033-5050. | [view abstract] | |
| Sn-Whiskers: Truths and Myths | J. Osenbach, J. M. DeLucca, B. D. Potteiger, A. Amin, and F. A. Baiocchi | Journal of Materials Science: Materials in Electronics, vol. 18(1-3), 2007, pp. 283-305. | [view paper] | |
| A History of Tin Whisker Theory: 1946-2004 | G. T. Clayton | SMTAI International Conference, September 26-30, 2004 | [view paper] | |
Dissolution of Metals | Cu Substrate Dissolution in Eutectic Sn-Ag Solder and Its Effect on Microstructure | S. Chada, R. A. Fournelle, W. Laub and  D. Shangguan | J. Elect. Mater.., vol. 29, no. 10, 2000, pp. 1214-1221. | [view abstract] | |
Electromigration | Electromigration in Pb-free SnAg3.8Cu0.7 solder stripes | Y. C. Hsu, C. K. Chou, P. C. Liu, Chih Chen, D. J. Yao, T. Chou, and K. N. Tu, | J, Appl Phys. Vol. 98 (3): Art. No. 033523, 2005 | [view abstract] | |
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