Recommended Readings: Properties and Reliability of Lead-Free Solders

Provided Courtesy of Materials Technology@TMS

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The following are recommended readings on properties and reliability of lead-free solders from

an advisory group of TMS subject matter experts | | | | |
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TECHNICAL AREA | PAPER TITLE | AUTHOR(S) | SOURCE | | |
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Mechanical Properties and Fatigue | Effects of Cooling Rate on Creep Behavior of a Sn-3.5Ag Alloy | F. Ochoa, X. Deng, and N. Chawla | J. Elec. Mater., vol. 33, 2004, pp. 1596-1607. | [view abstract] | |
| Creep Deformation Behavior of a Sn-3.5Ag Solder/Cu Couple at Small Length Scales | M. Kerr and N. Chawla | Acta Mater., vol.  52, 2004, pp. 4527-4535 | [view abstract] | |
| Deformation Behavior of (Cu, Ag)-Sn Intermetallics by Nanoindentation | X. Deng, N. Chawla, K.K. Chawla, and M. Koopman | Acta Mater., vol.  52, 2004, pp.  4291-4303. | [view abstract] | |
| Thermomechanical Fatigue Behavior in Sn-Ag Solder Joints | T. S. Choi, K. N. Subramanian, J. P. Lucas | J. Electr. Mater., vol. 29, no. 10, 2000, pp. 1249-57. | [view abstract] | |
| Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads | M. Date and K.N. Tu | J. Mater. Res., Vol. 19 (10), 2004, pp. 2887-2896. | [view abstract] | |
| Application of Asymmetrical Four Point Bend Shear Test to Solder Joints | O. Unal, I.E. Anderson, J.L. Harringa, R.L. Terpstra, B.A. Cook and J.C. Foley | J. Electron. Mater., Vol. 30,  2001, pp. 1206-1213. | [view abstract] | |
Mechanical Modeling | Microstructure-Based Modeling of Deformation in Pb-free Solders | N. Chawla and R.S. Sidhu | J. Mater. Sci. – Materials in Electronics, Special Issue on Pb-free Solders, 2007. | [view paper] | |
| Deformation Analysis of Lap Shear Testing of Solder Joints | Y.-L. Shen, N. Chawla, E.S. Ege, and X. Deng | Acta Mater., vol. 53, 2005, pp. 2633-2642. | [view abstract] | |
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