Lead-Free Solders Workshop 2005 - TMS Annual Meeting 2005, San Fancisco, CA, February 13, 2005

Provided Courtesy of Materials Technology@TMS

PRESENTATION TITLE | | AUTHOR(S) | MORE |
Opening Remarks: TMS Workshop of Pb-Free | Ravi Mahajan | View Presentation |
Uses and Risks of Lead in Products - Summary of Policy Study for the EC | Arnold Tucker | View Presentation |
Impacts of RoHS (e.g., Pb) on Electronic Products | John H. Lau | View Presentation |
Lead-Free Flip Chip Technology Potentials and Pitfalls | Roger A Quon | View Presentation |
Trends and Technical Requirements in Electronic Packaging | Darrel Freer | View Presentation |
Packaging Technology Trends and Lead Free Challenges | C. Michael Garner, Fay Hua, Nagesh Vodrahalli, Ashay Dani, Tom Debonis, Raiyo Aspandiar and Gary Brist | View Presentation |
Reactions Between Electroless Ni(P) and Sn-3.5Ag and Its Effects on Mechanical Reliability | Yoon -Chul Sohn and Jin Yu | View Presentation |
Electromigration in Flip Chip Solder Joints | | J. W.Nah and K. N. Tu | View Presentation |
Overview: Mechanical Properties of Pb-Free Solders | J. W. Morris, Jr. | View Presentation |
Near Ternary Sn-Ag-Cu Solder Joints; Microstructure, Thermal Fatigue and Failure Mechanisms | Sung K. Kang | View Presentation |
Sn-Zn Based Low Temperature Lead-Free Solder and Current Status of Lead-Free Soldering in Japan | Katsuaki Suganuma, Keun-Soo Kim, Kenji Toyofuku, Katsumi Yamamoto, Kouichi Hagio | View Presentation |
Nano Interconnects and Nanoscale Solder Bonding | Sungho Jin | View Presentation |
2005 TMS Pb-Free Technology Workshop Discussion Brief Summary | Fay Hua | View Presentation |
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