Lead-Free Solders Workshop 2006 - TMS Annual Meeting 2006, San Antonio, CA, March 12, 2006

Provided Courtesy of Materials Technology@TMS

PRESENTATION TITLE | AUTHOR(S) | | MORE | |
Pb free Challenges | V. Goudarzi | | View Presentation | |

Microelectronic Packaging Materials Microelectronic Packaging Materials Development & Integration Development & Integration Challenges for Lead Free Challenges for Lead Free

V. Wakharkar, and A. Dani

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The Mutual Impact of Lead-free Soldering and Fluxing Technology | N.-C. Lee | | View Presentation | |
Sn-Whiskers: Truths and Myths | J. Osenbach | | View Presentation | |
Deformation and Microstructural Evolution Processes in Lead-Free Sn-Ag Solder Joints due to Creep, Aging and Thermomechanical Fatigue and Preliminary Results on SAC Ball Grid Arrays | T. R. Bieler, E. J. Cotts, L. P. Lehman, A. Zamiri and F. Pourboghart | View Presentation | |

Manufacturing and Reliability of SnAgCu: Issues of "Backward" and "Forward" Compatibility

C. Handwerker, K. Moon, U. Kattner, B. Boettinger, and M. Williams

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What the Electronics Industry Missed for 80 Years … ... Interfacial Void Formation in Solder Joints with Cu Pad Structures during Thermal Aging

D.W. Henderson, P. Borgesen, P. Kondos, I. De Sousa, L. Patry, and L. Yin

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Cross-Interaction between Cu and Ni in Lead-Free Solder Joints | C.R. Kao | | View Presentation | |
Thermomechanical Fatigue and Fracture of Sn-based Solders | K.N. Subramanian and A. Lee | | View Presentation | |
Panel Discussion Summary | F. Hua | | View Presentation | |
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