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2003 TMS Annual Meeting & Exhibition: Workshop on Tin Whiskers
ANNUAL MEETING MENU
Cause and Effect
Date: Sunday, March 2, 2003
Location: San Diego Convention Center, Room 11
Moderator: Dr. William Boettinger, NIST
Sponsored by: National Electronic Manufacturing Initiative (NEMI); National Institute of Standards and Technology (NIST); The Minerals, Metals & Materials Society (TMS)
Tin whiskers have been known for 50 years, and many mitigation strategies have been used to assure reliability in electronic assemblies. Most of these strategies involved the addition of lead to the tin coating. With the movement toward lead-free solders and coatings, the concern with pure tin coatings has once again come to the fore.
Many theories have been advanced as to the cause of tin whiskers, primarily based on stress in the tin layer. But fundamental modeling of the actual mechanism of whisker formation is not known, or at best, not agreed on by the scientific community. Without this basic model, it is not possible to assure long life cycle end users that they will not be subject to whisker formation and subsequent system failures.
This workshop is intended to bring together the key researchers on tin whiskers, compare work that has been done, and see if a consensus can be developed on a basic model, or define the work that will reach such a consensus. The end goal is to provide direction to the industry that will assure long-life cycle applications they will not be subject to tin whisker failures.
For further information on this free workshop, contact William Pfahl, NEMI, at telephone: (703) 834-2084 or e-mail: rpfahl@NEMI.ORG.
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