Register for one or more of these educational events using the TMS 2007 Annual Meeting registration form.
Furnace Systems Technology
ABOUT THIS WORKSHOP
Date(s): Monday, Tuesday and Wednesday, Feb. 26, 27 and 28
Gain practical knowledge from this comprehensive review of combustion technology and equipment used in aluminum cast houses to improve your existing systems. Learn from industry leaders as they showcase techniques to:
Thermcon Ovens B.V./Junkers
Register for this workshop through the online TMS 2007 Annual Meeting & Exhibition registration form. Cost: $200 members; $250 nonmembers.
Session 1: Combustion Process Learn About
Basics of the combustion chemical process
Results concerning available heat to the process
Impact of preheated air on the process
Resulting emissions from the process
Available heat transfer mechanisms
Types of burners and control systems to enhance the transfer of energy and maintain an efficient operation
Session 2: Melters and Holders Learn About
Furnace types commonly used in the cast house for melting and holding metal
Style furnaces and combustion/control systems used for different processes
Expected melt rates, fuel efficiency and emissions
Session 3: Process Furnaces Learn About
Lower temperature process furnaces and heat transfer mechanisms that affect productivity and efficiency of furnaces
Burner types, control schemes, effective circulation requirements and purging requirements necessary for successful operation and the resulting expected fuel efficiency and emissions
Session 4: Additional Furnace Considerations Learn About
Additional requirements and ancillary devices used to improve furnace performance and productivity
Refractory linings and common practices
Benefits and costs of oxyfuel
Mechanisms behind dross formation and limiting metal loss
State-of-the-Art Lead-Free SolderTechnology
ABOUT THIS WORKSHOP
Date and Time: Sunday, Feb. 25 • 8 a.m. to 6 p.m.
With demand in electronics trending towards faster, smaller and cheaper products built with ROHS compliant lead-free solders, this one day Pb-free technology workshop will include up-to-date technology reviews and identify gaps for future needs for emerging Pb-free technology.
Session 1: Pb-Free BGA Interconnect Scaling Effects Learn About
Second level Pb-free interconnects and prediction of benefits, limitations, technology gap, and reliability risks as packages are getting smaller
Newly designed Pb-free solders that could potentially meet emerging technology needs
Session 2: Scaling of Flip Chip Interconnects High performance of electronics demands low K dielectrics used in the die to reduce cross talk. Integration of low K into the package is still a challenge. Smaller joints and higher current density also set flip chip joints under very complicated stress condition.
Learn About Mechanical stress, electrical current and chemical interactions, and their effects on reliability prediction
Register for this workshop through the online TMS 2007 Annual Meeting & Exhibition registration form. Cost: $0 full conference registrants; $50 all others.
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