As depicted in the technical program through the Conference Management System, the conference will provide a forum for topics of current interest and significance in the areas related to the preparation and characterization of electronic materials. Individuals actively engaged or interested in electronic materials research and development are encouraged to attend this meeting. For more detail, see the press release on the technical program.
THE 40th ELECTRONIC MATERIALS CONFERENCE
TRAVEL AND DESTINATION INFORMATION
AIRLINE DISCOUNT INFORMATION
CAR RENTAL DISCOUNT INFORMATION
CHARLOTTESVILLE AREA MAP
UNIVERSITY OF VIRGINIA AREA MAP
SCHEDULE OF EVENTS
|1998 EMC CHAIRS|
General Chair: Thomas Kuech, University of Wisconsin, Department of Chemical Engineering, 1415 Johnson Drive, Madison, WI 53706; telephone (608) 263-2922; fax (608) 265-3782; e-mail firstname.lastname@example.org.
Program Chair: Michael R. Melloch, School of Electrical and Computer Engineering, Purdue University, 1285 Elec. Eng. Bldg., West Lafayette, IN 47907-1285; telephone (765) 494-3528; fax (765) 494-6441; e-mail email@example.com.
|INVITED ORGANIZERS FOR THE 1998 EMC|
|Cammy Abernathy, University of FLorida; Carol Ashby, Sandia National Labs; Toshio Baba, NEC Corporation; Supriyo Bandyopadhayay, University of Nebraska; Len Brillson, Ohio State University; Julia Brown, Hughes Research Labs; Jeremy Burroughes, Cambridge Display Technology, Ltd.; Greg Charache, Lockheed Martin; Jürgen Christen, Otto-van-Guericke, Universitat Magdeburg; Kathy Doverspike, Cree Research; Bernard Gil, University of Montpelier II Ulrich Goesele, MPI of Microstructure Physics; Mark S. Goorsky, University of California, Los Angeles; Marian Hargis, Mellwood Laboratories; Derek Houghton, SiGe Microsystems Technology; Julia Hsu, University of Virginia; Qing Hu, Massachusetts Institute of Technology; James Ibbetson, University of California, Santa Barbara; Andrew D. Johnson, DERA; Eli Kapon, Swiss Federal Institute of Techology; Takashi Kawakubo, Toshiba Corporation; David Kotecki, IBM; Yu-Hwa Lo, Cornell University; Hiroyuki Matsunami, Kyoto University; Richard H. Miles, SDL, Inc.; Robert Mirin, NIST; Suzanne Mohney, Pennsylvania State University; Patricia Mooney, IBM; Karen Moore, Motorola, Inc.; Manasori Murakami, Kyoto University; Shuji Nakamura, Nichia Chemical Industries; Mathias Passlack, Motorola; Gerhard Pensi, University of Erlangen; Laura Rae, United States Department of Defense; Steven A. Ringel, Ohio State University; Larry B. Rowland, Sterling Semiconductor, Inc.; Lars Samuelson, Lund University; Ben Shanabrook, Naval Research Labs; J. Richard Shealy, Cornell University; Dwight Streit, TRW; Michael A. Tischler, Epitronics; Charles Tu, University of California, San Diego; Parvez Uppal, Sanders, Lockheed Martin; Martin Walther, Fraunhofer-Institut Freiburg; Rainer Waser, RWTH; Edward T. Yu, University of California|
|ELECTRONIC MATERIALS COMMITTEE|
|OFFICERS: Thomas Kuech, Chair, University of Wisconsin; Timothy Sands, Past Chair, University of California, Berkeley; Michael Melloch, Vice Chair, Purdue University; Eugene Fitzgerald, Secretary, Massachusetts Institute of Technology; Ilesanmi Adesida, Treasurer, University of Illinois; Darrel Frear, Chair EMPMD, SEMATECH; Ted C. Harman, JEM editor, Massachusetts Institute of Technology, Lincoln Laboratory; MEMBERS: Rajaram Bhat, Bellcore; Robert Biefeld, Sandia National Laboratories; Dieter Bimberg, Technical University, Berlin; April Brown, Georgia Institute of Technology; Constance Chang-Hasnain, University of California, Berkeley; Ralph Dawson, Sandia National Laboratories; Russ Dupuis, University of Texas, Austin; Randall Feenstra, Carnegie Mellon University; Evelyn Hu, University California; Vassilis Keramidas, Bellcore; L.C. Kimerling, Massachusetts Institute of Technology; Leslie Kolokziejski, Massachusetts Insitutue of Technology; James Merz, University of Notre Dame; Theodore Moustakas, Boston University; Diego Olego, Phillips Laboratories; Fred Pollak, Brooklyn College of City University of New York; Akio Saski, Osaka Electro-Communication University; Jim Speck, University of California, Santa Barbara; Michael Spencer, Howard University; Gregory Stillman, University of Illinois; Steve Stockman, Hewlett-Packard Co.; James Sturm, Princeton University; Ray Tsui, Motorola, Inc.; Chris Van de Walle, Xerox Palo Alto Research Center; Kang Wang, University of California; Bruce Wessels, Northwestern University; Laura Wills, Hewlett-Packard Co.; Jerry Woodall, Purdue University; Eli Yablanovitch, University of California, Los Angeles; Alex Zunger, NREL|
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