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13th International Conference on Defects —
Recognition, Imaging and Physics in Semiconductors (DRIP XIII)
Welcome to the DRIP XIII Conference
TMS is proud to sponsor the 13th International Conference on Defects — Recognition, Imaging, and Physics in Semiconductors.
As the semiconductor technology has matured, so have the techniques for detection, identification and imaging of defects. Decreasing feature size, increasing wafer size and purity level, reduction of layer thickness and introduction of new materials have presented new challenges at every stage of semiconductor technology development. This evolution of the field continues today, and the new challenges will be the focus of DRIP XIII.
For more than 20 years, DRIP conferences have focused on all aspects of defects in semiconductors including point, line, planar and volume defects studied by a variety of techniques. This comprehensive approach has allowed for a discussion of the multifaceted effects of growth, processing and device fabrication and their interrelationships.
DRIP XIII will be held September 13-17, 2009, at the Oglebay Resort & Conference Center in Wheeling, West Virginia, and follow in the footsteps of recent conferences held in Beijing and Berlin. View information from previous conferences:
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