Continued advances in microelectronics assembly and packaging means thinner and smaller devices that operate at higher bandwidth and power density. Challenges in warpage, thermal management, thermal expansion mismatches, three-dimensional structure, and efficiency must be addressed. With new embedded packaging technologies, plastic and hybrid electronics, and additive manufacturing/3D printing, new roadblocks arise.
This workshop will address new demands on interconnection materials at all levels, including traditional and novel lead-free solders, conductive adhesive, whisker mitigation, solders and epoxies for the automotive sector, reinforcing epoxy, substrates, package reliability, and failure analysis.
University research groups studying solder metal alloys and 3D microelectronics and those working in the microelectronics and materials industry would benefit from attending this workshop.
This course will offer attendees a clear articulation of industry needs and interests in future research, as well as a clearer sense of the frontiers of packaging research.
Register for this course through the TMS2020 registration form.
Remember to register for the conference and any short courses by January 17 for the best rates.