Meeting Resources
3rd World Congress on High Entropy Alloys (HEA 2023)

November 12–15, 2023

Omni William Penn Hotel • Pittsburgh, Pennsylvania, USA

Submit an Abstract

The 3rd World Congress on High Entropy Alloys (HEA 2023) is a cross-disciplinary technical forum designed to share the latest research advances in single-phase and multiphase metallic, intermetallic, and ceramic high entropy materials for functional or structural applications. HEA 2023 will feature highly focused technical talks on topics that include, but are not limited to, fundamental theory of alloy design, computational modeling and simulation, properties, processing, and applications of high entropy alloys.

Networking opportunities will also offer attendees a chance to informally discuss the latest developments in high entropy alloys, while also making valuable professional connections. The congress will attract research leaders from industry, government, and academics from across the globe, as well as students and postdocs interested in the science and engineering of metallic materials and high-performance alloys. Scientists and engineers will be convened to facilitate linkages and collaborations on this promising technology, to hopefully lead to widespread application and adoption of these materials.

IMPORTANT DATES

Abstract Deadline:
June 16, 2023

Discount Registration Deadline:
September 27, 2023

Housing Deadline:
October 12, 2023

Congress Dates:
November 12–15, 2023

RESOURCES
You Might Also Be Interested In

Congress Sponsors and Organizers

This conference is sponsored by the Structural Materials Division, Mechanical Behavior of Materials Committee, Alloy Phases Committee, and High Temperature Alloys Committee and is being organized by the following individuals:
Chair Andrew Detor, DARPA, USA
Programming Chair
Organizing Committee
Amy Clarke, Colorado School of Mines, USA
Martin Heilmaier, Karlsruhe Institute of Technology, Germany
Keith Knipling, Naval Research Laboratory, USA
Elizabeth Opila, University of Virginia, USA
Oleg N. Senkov, MRL Materials Resources LLC and Air Force Research Laboratory, USA
C. Cem Tasan, Massachusetts Institute of Technology, USA
Mike Titus, Purdue University, USA

Join Our E-mail List

Complete this short form if you are interested in receiving HEA e-mail updates from TMS.

Sign Up for Updates

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770