In This Issue
TMS Plans Programming with German Materials Society
As part of a Memorandum of Understanding (MOU) recently signed between TMS and Deutsche Gesellschaft für Materialkunde (DGM/German Materials Society), TMS will co-sponsor the Light Weight Metals symposium, co-organized by 2017 TMS President David DeYoung, at DGM’s Materials Science and Engineering conference (MSE 2018) in Darmstadt, Germany, September 25–27, 2018. The MOU outlines a path forward to providing greater collaborative opportunities between the volunteers of both societies, in service to the advancement of the global materials science and engineering community. DGM will help organize a similarly themed symposium at the TMS 2019 Annual Meeting & Exhibition in San Antonio, Texas, March 10–14, 2019.
DeYoung is co-organizing the Light Weight Metals symposium at MSE 2018 with Jürgen Hirsch, RWTH Aachen University, Institute of Physical Metallurgie and Metal Physics, Germany. The symposium is now accepting abstracts that cover the design and tailoring of monolithic and of composite cast and wrought metals and alloys, as well as the manufacturing of semi-finished and finished products with such processes as DC casting, rolling, extrusion, sheet-metal forming and joining, shape casting, powder metallurgy, and technologies for their recycling and reuse. The focus of the symposium is on structural use.
Abstract submissions for this symposium will be accepted through February 28. MSE 2018 will be held in Darmstadt, Germany, September 25–27, 2018.
Learn more about submitting an abstract for MSE 2018
Other aspects of the TMS-DGM agreement under development include a student exchange program, joint professional development activities, and collaboration on funded roadmapping studies and special projects.
MS&T18 Now Accepting Abstracts
For 2018, the Metallurgy & Materials Society (MetSoc) of the Canadian Institute of Mining, Metallurgy & Petroleum will join the four MS&T partnering societies—ACerS, AIST, ASM, and TMS—to present Materials Science & Technology 2018 (MS&T18), which will also feature programming by NACE International.
TMS members are invited to present their work alongside their colleagues from these five partnering organizations. Abstracts are now being accepted in 12 theme areas:
- Additive Manufacturing
- Ceramic and Glass Materials
- Electronic and Magnetic Materials
- Failure Analysis
- Fundamentals, Characterization, and Computational Modeling
- Iron and Steel (Ferrous Alloys)
- Materials-Environment Interactions
- Processing and Manufacturing
- Special Topics
MS&T18 will be held October 14–18, 2018, in Columbus, Ohio.
Abstracts are due March 15. Learn more about the MS&T18 Technical Program and submit an abstract
Task Force Continues Work of the Materials Data Infrastructure Study
A task force convened at TMS headquarters in January to determine how to take action on the recommendations presented in the study, Building a Materials Data Infrastructure: Opening New Pathways to Discovery and Innovation in Science and Engineering,
which was published in May by TMS on behalf of the U.S. National Science Foundation.
The task force was made up of a group of 14 subject matter experts from the materials community and beyond. Some participated in developing the original MDI study, but many new individuals were also brought in to bring a more diverse perspective.
Participants were (pictured, back row, left to right): David Martinsen,
American Chemical Society (Retired); William Joost,
Pratt & Whitney; John Perkins,
National Renewable Energy Laboratory; Charles Ward,
Air Force Research Laboratory; Thomas Proffen,
Oak Ridge National Laboratory; Ian Foster,
University of Chicago; Ramona Walls,
CyVerse/University of Arizona; Jed Pitera,
IBM; Elif Ertekin,
University of Illinois. Pictured, front row, left to right are: Zach Trautt,
National Institute of Standards and Technology; Anita de Waard,
Elsevier; William Harris,
Zeiss; Taylor Sparks,
University of Utah; Scott Miller,
The task force worked to prioritize recommendations from the report and to identify immediate next steps. A total of 16 action plans were developed to drive progress in activating, coordinating, and sharing best practices among the community of data producers, data consumers, infrastructure developers, and policymakers.
Download your free copy of Building a Materials Data Infrastructure
Journal of Electronic Materials Announces Editorial Team Changes
Three new section editors have been added to the Journal of Electronic Materials
) editorial team: Wojciech Jadwisienczak,
Ohio University; Manh-Huong Phan,
University of South Florida; and Dan Ricinschi,
Tokyo Institute of Technology, Japan. JEM
also congratulates John D. Baniecki,
Fujitsu Laboratories, Japan, who will be moving from a section editor to senior editor position with the journal. Editor-in-Chief Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute, and section editor Tom Bieler, Michigan State University, will continue in their current roles.
Published in partnership with the Institute of Electrical and Electronics Engineers (IEEE), the Journal of Electronic Materials
) reports on the science and technology of electronic materials while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials.
To learn more about the Journal of Electronic Materials
and how to submit a paper for an upcoming issue, visit the TMS Journals web page