General Abstracts: Electronic, Magnetic and Photonic Materials Division
Lead Organizer: Long Qing Chen, Pennsylvania State University
A collection of topics will be covered.
General Poster Sessions
Visual presentations on electronic materials will be showcased.
Lead Organizer: Andre Lee, Michigan State University
The symposium covers materials and processes for reliable three-dimensional packaging primarily through silicon via technology.
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IX
Lead Organizer: Chih-ming Chen, National Chung Hsing University
This will be the ninth in a series of TMS symposia addressing the stability, transformation and formation of phases during the fabrication, processing and utilization of electronic materials and devices.
Coatings for Structural, Biological, and Electronic Applications
Lead Organizer: Nuggehalli M. Ravindra, New Jersey Institute of Technology
This forum will stimulate new ideas, identify critical problems, provide promising solutions and assess possible road maps leading to the solutions.
Pb-free Solders and Emerging Interconnect and Packaging Technologies
Lead Organizer: Kwang-Lung Lin, National Cheng Kung University
This symposium will cover solder materials and technology, solder interconnects, solder materials behavior and interconnects for emerging technologies.