Electronic Packaging and Interconnection Materials Committee

JOM Topics

The following topics appear in recent issues of JOM under the sponsorship of our committee.
Date: December 2018
Lead Organizer: Chris Gourlay
Co-Organizer:
Topic Title: Recent Progress with Lead-Free Solder Interconnects
Date: June 2017 (Paper Submission De
Lead Organizer:
Co-Organizer:
Topic Title: Progress with Lead-Free Solders
Date: November 2016
Lead Organizer:
Co-Organizer:
Topic Title: Progress with Lead-Free Solders
Date: October 2015
Lead Organizer:
Co-Organizer:
Topic Title: Progress with Lead-free Solders
Date: November 2014
Lead Organizer:
Co-Organizer:
Topic Title: Progress with Lead Free Solders
Date: October 2013
Lead Organizer:
Co-Organizer:
Topic Title: Progress with Lead-free Solders
Date: July 2012
Lead Organizer:
Co-Organizer:
Topic Title: Pb-free Solders
Date: October 2011
Lead Organizer:
Co-Organizer:
Topic Title: Progress with Lead-Free Solders
Date: July 2010
Lead Organizer:
Co-Organizer:
Topic Title: Lead-Free Soldering and Reliability of Interconnects in Electronic Packages
Date: June 2009
Lead Organizer:
Co-Organizer: