Deadline Extended to November 22, 2019
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The following technical topics (as well as other related topics) will be covered during this congress:
The 5th International Congress on 3D Materials Science (3DMS 2020) seeks to provide the premier forum for presentations of current interest and significance to the three-dimensional characterization, visualization, quantitative analysis, modeling, and development of structure–property relationships of materials, as well as big data and machine learning issues associated with 3D materials science (3DMS). Additionally, this congress will provide an intimate environment for rich discussions and interactions among the key researchers in the world to not only assess the state-of-the-art within the various elements of 3DMS, but also to roadmap the key areas of future research. The congress will include plenary, keynote, and invited lectures as well as contributed presentations. The technical program will:
Abstracts must be submitted to ProgramMaster by November 22, 2019, to be considered for inclusion in the congress.
To assist the congress organizing committee in evaluating abstracts fairly, please be as clear and detailed in your abstract as possible. Abstracts should be 150 words, or less.
If you have any questions regarding abstract submission, send an e-mail to TMS Programming Staff.
View the final programs from past 3DMS congresses for examples of abstracts and technical topics presented at the congress:
For more information about this meeting, please complete the meeting inquiry form or contact:
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