5th International Congress on 3D Materials Science
(3DMS 2020)

June 28–July 1, 2020 • Hyatt Regency Washington on Capitol Hill• Washington, D.C., USA

Technical Program

Submit Abstract
Deadline Extended to November 22, 2019

The following technical topics (as well as other related topics) will be covered during this congress:

  • Methods for materials simulation and modelling
  • 3D Data processing and reconstruction algorithms
  • Process-microstructure-property relationships in 3D
  • Materials dynamics in 3D
  • New characterization methods
  • Machine learning
  • Other

The 5th International Congress on 3D Materials Science (3DMS 2020) seeks to provide the premier forum for presentations of current interest and significance to the three-dimensional characterization, visualization, quantitative analysis, modeling, and development of structure–property relationships of materials, as well as big data and machine learning issues associated with 3D materials science (3DMS). Additionally, this congress will provide an intimate environment for rich discussions and interactions among the key researchers in the world to not only assess the state-of-the-art within the various elements of 3DMS, but also to roadmap the key areas of future research. The congress will include plenary, keynote, and invited lectures as well as contributed presentations. The technical program will:

  • Cover a range of topical areas representing the most critical and rapidly growing areas of 3D materials science
  • Include oral presentations, interactive poster sessions, and panel discussions for maximum interaction
  • Address state-of-the-art subtopics to roadmap key areas for future research in 3DMS

Plenary Speakers

  • Jaafar El-Awady
    Johns Hopkins University, USA
  • Satoshi Hata
    Kyushu University, Japan
  • Helena Van Swygenhoven
    Paul Scherrer Institut, Switzerland

Invited Speakers

  • Joel Bernier
    Lawrence Livermore National Laboratory, USA
  • Vincent De Andrade
    Advanced Photon Source, USA
  • Marc DeGraef
    Carnegie Mellon University, USA
  • Emmanuel Marquis
    University of Michigan, USA
  • Ulrich Lienert
    DESY, Germany
  • Wolfgang Ludwig
    European Synchrotron Radiation Facility
  • Reeju Pokharel
    Los Alamos National Laboratory, USA
  • Hemant Sharma
    Argonne National Laboratory, USA
  • Kazuyuki Shimizu
    Kyushu University, Japan
  • Katsuyo Thornton
    University of Michigan, USA
  • Hideyuki Yasuda
    Kyoto University, Japan
  • Yubin Zhang
    Technical University of Denmark, Denmark
  • Abstract Submissions

    Abstracts must be submitted to ProgramMaster by November 22, 2019, to be considered for inclusion in the congress.

    To assist the congress organizing committee in evaluating abstracts fairly, please be as clear and detailed in your abstract as possible. Abstracts should be 150 words, or less.

    If you have any questions regarding abstract submission, send an e-mail to TMS Programming Staff.

    View the final programs from past 3DMS congresses for examples of abstracts and technical topics presented at the congress:

    For More Information

    For more information about this meeting, please complete the meeting inquiry form or contact:

    TMS Meeting Services
    5700 Corporate Drive Suite 750
    Pittsburgh, PA 15237
    Telephone:
    U.S. and Canada Only: 1-800-759-4867
    Other Countries: 1-724-776-9000, ext. 241
    Fax: 1-724-776-3770