Meeting Resources

World Congress on High Entropy Alloys (HEA 2019)

November 17-20, 2019 • Hyatt at Olive 8 • Seattle, Washington, USA

Technical Program

The key goals of the World Congress on High Entropy Alloys (HEA 2019) are to convene stakeholders from across areas of modeling and simulation, experimental characterization, and alloy design, to address many fundamental issues in both single-phase and multiphase high entropy alloys (HEAs). This conference will also examine HEA properties and potential engineering applications. Abstracts are encouraged for a range of HEA-related topics, including, but not limited to:

  • Fundamental theory
  • Alloy design and exploration
  • Computational modeling and simulation
  • Mechanical properties
  • Functional properties
  • Processing
  • Applications

Plenary (all conference) Speakers

Chain Tsuan Liu
City University of Hong Kong, Hong Kong

Presenting: "High Entropy Alloys Based on NiCoFeAlxTiy Hardening with Multicomponent Intermetallic Nanoparticles"

Dierk Raabe
Max Planck Institute for Iron Research, Germany

Presenting: "Metastable High Entropy Alloys"

Oleg Senkov
UES Inc. / Air Force Research Laboratory, USA

Presenting: "Refractory Complex Concentrated Alloys for High Temperature Applications: Opportunities and Challenges"

Keynote Speakers

Donald Brenner
North Carolina State University, USA
Jean-Philippe Couzinie
Université Paris Est, ICMPE (UMR 7182) CNRS-UPEC, France
William Curtin
EPFL / STI-IGM-LAMMM, Switzerland
Michael Gao
National Energy Technology Laboratory, USA
Easo George
Oak Ridge National Laboratory, USA
Gregory Olson
Northwestern University, USA
Robert Ritchie
University of California, Berkeley, USA
John R Scully
University of Virginia, USA
Christopher Woodward
Air Force Research Laboratory, USA

Invited Speakers

Raymundo Arroyave
Texas A&M University, USA
Rajarshi Banerjee
University of North Texas, USA
Francisco Coury
Federal University of São Carolos
Bronislava Gorr
University of Siegen, Germany
Horst Hahn
Karlsruhe Institute of Technology, Germany
Haruyuki Inui
Kyoto University, Japan
Pin Lu
QuesTek Innovations LLC, USA
Alfred Ludwig
Ruhr-University Bochum, Germany
Lewis Owen
University of Cambridge, UK
Eun Soo Park
Seoul National University, South Korea
Tresa M. Pollock
University of California, Santa Barbara, USA
James Saal
Citrine Informatics, USA
C. Tasan
Massachusetts Institute of Technology, USA
Dan Thoma
University of Wisconsin, Madison, USA
Ming-Hung Tsai
National Chung Hsing University, Taiwan
Panagiotis Tsakiropoulos
University of Sheffield, UK
An-Chou Yeh
National Tsing Hua University, Taiwan
Fan Zhang
CompuTherm LLC, USA

Boeing Future of Flight Tour

Conference attendees are invited to register for the Boeing Future of Flight Tour. Learn more about the tour here.

Abstract Submissions

The abstract submission deadline has passed. Sign up for updates on registration and programming at HEA 2019 below.

Sign Up for Updates

If you have any questions regarding abstract submission, send an e-mail to TMS Programming Staff.

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770