Meeting Resources
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)

April 24–28, 2022

Hyatt Regency Lake Tahoe, Incline Village, Nevada, USA

Technical Program

Registration is now closed.

This meeting took place April 24–28, 2022. The recorded content was available to registrants until May 31, 2022. Please join the e-mail list to receive updates about ICME and future meetings.

The 6th World Congress on Integrated Computational Materials Engineering (ICME 2022) convenes leading researchers and practitioners to share the latest knowledge and advances in the discipline. This congress is the recognized hub of interaction among software developers and process engineers along the entire production chain, as well as for materials scientists and engineers developing new materials.

This is the only congress dedicated to bringing all stakeholders together from across nations, disciplines, and organizations to focus on integration priorities and gaps that need to be addressed in order to advance the field.

ICME 2022 will benefit researchers, software developers, metallurgists, materials scientists and engineers, process engineers, senior scientists, chief technology officers, and a variety of others working in R&D. Attendees will gain insights on recent advances and discuss opportunities to overcome challenges in the field.

Thank You to Our Sponsors

Program Highlights

Expert-led tutorial sessions on computational tools will describe the fundamental principles and practical execution of an open-source computational toolset with direct utility for ICME. The planned topics are PRISMS-Plasticity and PRISMS-PF; Introduction to Bayesian Optimization and BAREFOOT; and LAMMPS.

The technical program features an impressive line-up of plenary speakers, joined by over 180 oral and poster presentations! Learn more.

Health and Safety

As we take steps to gather again, we want to emphasize that your well-being is most important to us. TMS continually monitors the COVID-19 situation and the latest guidance on health and safety protocols.

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Congress Sponsors and Organizers

This congress is sponsored by TMS Materials Processing & Manufacturing Division (MPMD) and the Integrated Computational Materials Engineering (ICME) Committee, and is being organized by the following individuals:
Chair Will Joost
Programming Chair Danielle Cote, Worcester Polytechnic Institute, USA
Members Kester Clarke, Colorado School of Mines, USA
Javier Llorca, Technical University of Madrid and IMDEA Materials Institute, Spain
Heather Murdoch, Army Research Laboratory, USA
Satyam S. Sahay, John Deere Technology Center, India
Mike Sangid, Purdue University, USA 

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
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