Meeting Resources

5th World Congress on Integrated Computational Materials Engineering (ICME 2019)

July 21–25, 2019 • JW Marriott Indianapolis • Indianapolis, Indiana, USA

Technical Program

The key goals of ICME 2019 are to convene stakeholders from across all areas of modeling and simulation, experimental specialization, and design, as well as from across academia, government, and industry, to address ICME tools and techniques and their integration, as well as to examine their application in engineering. This congress will provide a forum for presentations and discussions centering on ICME-related topics, including:

  • The wide range of materials programs where an ICME approach validated by experimental efforts is applicable, including computational- and experimental-based talks
  • Individual computational methods utilized in an ICME approach, including both advantages and limitations
  • Roles of ICME in continuing education in industry
  • High-throughput computing application in ICME
  • Development of materials processing and materials characterization technology
  • Incorporation of “big data, data fusion, and machine learning” for materials and product development with ICME methodologies
  • Development of database and database technology for ICME
  • Bridging the gap of across-scale materials simulation
  • Success stories of ICME on materials development
  • ICME implementation strategies
  • Verification, validation, and uncertainty quantification issues
  • Interoperability, data, and communications standards
  • ICME networking initiatives around the world

ICME has emerged as an important discipline because of its great potential in efficiently designing new materials, engineering new products, and improving manufacturing processes. ICME methodologies can identify gaps in the integration process when applied to solving fundamental engineering problems, these can lead to advancements in the fundamental understanding of problems, development of the linkages along the processing chain, and development of computational tools and advanced experimental technique for engineering practice and the establishment of an infrastructure for global information sharing.

Abstract Submissions

Abstracts must be submitted to ProgramMaster by January 28, 2019, to be considered for inclusion in the congress.

To assist the congress organizing committee in evaluating abstracts fairly, please be as clear and detailed in your abstract as possible. Abstracts should be 150 words.

If you have any questions regarding abstract submission, send an e-mail to TMS Programming Staff.

View the final programs from past ICME congresses

Publishing Options

A journal publishing initiative has been planned for ICME 2019, and the submission deadline is August 9, 2019. More details on specific options can be found on the Publishing Options page.

ICME 2019 Plenary Speakers

Annika Borgenstam
KTH Royal Institute of Technology (Sweden)
Presenting: "Materials of Tomorrow - The Design Approach"
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Long-Qing Chen
Pennsylvania State University (USA)
Presenting: “Understanding, Prediction and Design of Mesoscale Structures and Properties of Functional Materials Guided by Phase-field Simulations”
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Peter Collins
Iowa State University (USA)
Presenting: “An ICME Approach for Additive Manufacturing”
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Manabu Enoki
The University of Tokyo (Japan)
Presenting: "Materials Integration Project for Structural Materials in Japan"
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Mary Lee Gambone
Rolls-Royce (USA)
Presenting: “The Challenges and Opportunities in Embedding Materials Science in Virtual Design and Manufacturing”
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Louis Hector, Jr.
Rolls-Royce (USA)
Presenting: “The Challenges and Opportunities in Embedding Materials Science in Virtual Design and Manufacturing”
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Mark Horstemeyer
Mississippi State University (USA)
Presenting: "Integrated Computational Materials Engineering (ICME): Past, Present, and Future"
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Jesus Galán-López
TU Delft (Netherlands)
Presenting: “Development of Metallurgical through Process Models for the Development of New Low Carbon Strip Steel Grades”
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Alan Luo
The Ohio State University (USA)
Presenting: “Applications of CALPHAD Modeling and Integrated Computational Materials Engineering in Advanced Lightweight Metallic Materials”
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Michele Manuel
University of Florida (USA)
Presenting: TBA
David Rowenhorst
U.S. Naval Research Laboratory (USA)
Presenting: “Developing and Validating Models through 3D Characterization”
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James Warren
National Institute of Standards and Technology (USA)
Presenting: “The Materials Genome Initiative: The Coming Revolutions in Materials Research”
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Invited speakers

John Allison, University of Michigan
Dennis Dimiduk, BlueQuartz Software LLC
Begum Gulsoy, Northwestern University
Andrew Kitahara, Carnegie Mellon University
Goutam Mohapatra, John Deere Asia Technology Innovation Center
Deepankar Pal, ANSYS
Gandham Phanikumar, Indian Institute of Technology Madras
Ali Ramazani, Massachusetts Institute of Technology
Anthony Rollett, Carnegie Mellon University
Junsheng Wang, Beijing Institute of Technology
Wei Xiong, University of Pittsburgh
Kevin Xiaoyu Yang, Computer Network Information Center of the Chinese Academy of Sciences

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

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